TWI537411B - 用於物理氣相沉積之腔室及用於物理氣相沉積腔室之腔門 - Google Patents
用於物理氣相沉積之腔室及用於物理氣相沉積腔室之腔門 Download PDFInfo
- Publication number
- TWI537411B TWI537411B TW100113714A TW100113714A TWI537411B TW I537411 B TWI537411 B TW I537411B TW 100113714 A TW100113714 A TW 100113714A TW 100113714 A TW100113714 A TW 100113714A TW I537411 B TWI537411 B TW I537411B
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- target
- door
- bearing
- outer casing
- Prior art date
Links
- 238000005240 physical vapour deposition Methods 0.000 title claims description 70
- 239000000758 substrate Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 26
- 238000012545 processing Methods 0.000 claims description 25
- 238000004544 sputter deposition Methods 0.000 claims description 13
- 239000013077 target material Substances 0.000 claims description 5
- 230000013011 mating Effects 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- 230000008569 process Effects 0.000 description 11
- 238000007789 sealing Methods 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 9
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000013536 elastomeric material Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10162560.6A EP2387063B1 (en) | 2010-05-11 | 2010-05-11 | Chamber for physical vapor deposition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201200618A TW201200618A (en) | 2012-01-01 |
| TWI537411B true TWI537411B (zh) | 2016-06-11 |
Family
ID=42320179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100113714A TWI537411B (zh) | 2010-05-11 | 2011-04-20 | 用於物理氣相沉積之腔室及用於物理氣相沉積腔室之腔門 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8758579B2 (enExample) |
| EP (2) | EP2387063B1 (enExample) |
| JP (2) | JP2013530308A (enExample) |
| KR (1) | KR101667195B1 (enExample) |
| CN (1) | CN102918622B (enExample) |
| TW (1) | TWI537411B (enExample) |
| WO (1) | WO2011141513A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101913791B1 (ko) * | 2014-07-22 | 2018-11-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 타겟 어레인지먼트, 그를 구비한 프로세싱 장치 및 그의 제조 방법 |
| TWI700750B (zh) * | 2017-01-24 | 2020-08-01 | 美商應用材料股份有限公司 | 用於介電薄膜的選擇性沉積之方法及設備 |
| WO2020048846A1 (en) | 2018-09-03 | 2020-03-12 | Agc Glass Europe | Kit for mounting a surface treatment chamber |
| NL2023642B1 (en) | 2019-08-14 | 2021-02-24 | Leydenjar Tech B V | Silicon composition material for use as battery anode |
| WO2022058014A1 (en) * | 2020-09-17 | 2022-03-24 | Applied Materials, Inc. | Cathode assembly, deposition apparatus and method for sputter deposition |
| CN118401696A (zh) * | 2021-12-16 | 2024-07-26 | 应用材料公司 | 用于溅射沉积的阴极组件、沉积设备和方法 |
| NL2030360B1 (en) * | 2021-12-30 | 2023-07-06 | Leydenjar Tech B V | Plasma-enhanced Chemical Vapour Deposition Apparatus |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5924758U (ja) * | 1982-08-04 | 1984-02-16 | 株式会社徳田製作所 | スパツタリング装置 |
| US4519885A (en) * | 1983-12-27 | 1985-05-28 | Shatterproof Glass Corp. | Method and apparatus for changing sputtering targets in a magnetron sputtering system |
| US5591314A (en) * | 1995-10-27 | 1997-01-07 | Morgan; Steven V. | Apparatus for affixing a rotating cylindrical magnetron target to a spindle |
| US5824197A (en) * | 1996-06-05 | 1998-10-20 | Applied Materials, Inc. | Shield for a physical vapor deposition chamber |
| US6254745B1 (en) * | 1999-02-19 | 2001-07-03 | Tokyo Electron Limited | Ionized physical vapor deposition method and apparatus with magnetic bucket and concentric plasma and material source |
| JP4614037B2 (ja) * | 2000-09-08 | 2011-01-19 | Ａｇｃセラミックス株式会社 | 円筒状ターゲット |
| US20050051422A1 (en) * | 2003-02-21 | 2005-03-10 | Rietzel James G. | Cylindrical magnetron with self cleaning target |
| US7097744B2 (en) * | 2003-06-12 | 2006-08-29 | Applied Materials, Inc. | Method and apparatus for controlling darkspace gap in a chamber |
| US20050005846A1 (en) * | 2003-06-23 | 2005-01-13 | Venkat Selvamanickam | High throughput continuous pulsed laser deposition process and apparatus |
| JP2005213585A (ja) * | 2004-01-29 | 2005-08-11 | Konica Minolta Opto Inc | マグネトロンスパッタ装置 |
| JP4836956B2 (ja) * | 2004-10-18 | 2011-12-14 | ベーカート・アドヴァンスト・コーティングス | 回転可能なターゲットスパッタリング装置用エンドブロック |
| PL1799876T3 (pl) * | 2004-10-18 | 2009-07-31 | Bekaert Advanced Coatings | Płaski blok końcowy do podtrzymywania obrotowego targetu do napylania |
| DE102004060423B4 (de) * | 2004-12-14 | 2016-10-27 | Heraeus Deutschland GmbH & Co. KG | Rohrtarget und dessen Verwendung |
| EP1698715A1 (de) * | 2005-03-03 | 2006-09-06 | Applied Films GmbH & Co. KG | Anlage zum Beschichten eines Substrats und Einschubelement |
| CN1827545B (zh) * | 2005-03-03 | 2012-11-07 | 应用材料两合股份有限公司 | 涂敷基底的系统及插入元件 |
| JP5004942B2 (ja) * | 2005-03-11 | 2012-08-22 | ベーカート・アドヴァンスト・コーティングス | 単一の直角エンドブロック |
| US20070134500A1 (en) * | 2005-12-14 | 2007-06-14 | Klaus Hartig | Sputtering targets and methods for depositing film containing tin and niobium |
| US8500972B2 (en) * | 2008-04-14 | 2013-08-06 | Angstrom Sciences, Inc. | Cylindrical magnetron |
| US20100101949A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Rotatable sputter target backing cylinder, rotatable sputter target, method of producing a rotatable sputter target, and coating installation |
-
2010
- 2010-05-11 EP EP10162560.6A patent/EP2387063B1/en not_active Not-in-force
- 2010-05-11 EP EP13196091.6A patent/EP2709138B1/en not_active Not-in-force
- 2010-05-17 US US12/781,723 patent/US8758579B2/en not_active Expired - Fee Related
-
2011
- 2011-04-20 TW TW100113714A patent/TWI537411B/zh not_active IP Right Cessation
- 2011-05-11 JP JP2013509562A patent/JP2013530308A/ja not_active Ceased
- 2011-05-11 KR KR1020127032144A patent/KR101667195B1/ko not_active Expired - Fee Related
- 2011-05-11 CN CN201180026737.5A patent/CN102918622B/zh not_active Expired - Fee Related
- 2011-05-11 WO PCT/EP2011/057626 patent/WO2011141513A1/en not_active Ceased
-
2016
- 2016-01-14 JP JP2016005561A patent/JP6275755B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW201200618A (en) | 2012-01-01 |
| CN102918622B (zh) | 2016-03-02 |
| US20110278166A1 (en) | 2011-11-17 |
| EP2387063B1 (en) | 2014-04-30 |
| JP2016148106A (ja) | 2016-08-18 |
| JP2013530308A (ja) | 2013-07-25 |
| US8758579B2 (en) | 2014-06-24 |
| EP2709138B1 (en) | 2016-11-30 |
| WO2011141513A1 (en) | 2011-11-17 |
| KR101667195B1 (ko) | 2016-10-18 |
| EP2709138A1 (en) | 2014-03-19 |
| JP6275755B2 (ja) | 2018-02-07 |
| CN102918622A (zh) | 2013-02-06 |
| EP2387063A1 (en) | 2011-11-16 |
| KR20130081230A (ko) | 2013-07-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |