ATE423225T1 - Flacher endblock als träger eines drehbaren sputter-targets - Google Patents
Flacher endblock als träger eines drehbaren sputter-targetsInfo
- Publication number
- ATE423225T1 ATE423225T1 AT05857644T AT05857644T ATE423225T1 AT E423225 T1 ATE423225 T1 AT E423225T1 AT 05857644 T AT05857644 T AT 05857644T AT 05857644 T AT05857644 T AT 05857644T AT E423225 T1 ATE423225 T1 AT E423225T1
- Authority
- AT
- Austria
- Prior art keywords
- block
- target
- coolant
- support
- end block
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Motor Or Generator Frames (AREA)
- Nozzles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04105116 | 2004-10-18 | ||
EP05101905 | 2005-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE423225T1 true ATE423225T1 (de) | 2009-03-15 |
Family
ID=35809667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05857644T ATE423225T1 (de) | 2004-10-18 | 2005-10-11 | Flacher endblock als träger eines drehbaren sputter-targets |
Country Status (12)
Country | Link |
---|---|
US (1) | US8562799B2 (de) |
EP (1) | EP1799876B1 (de) |
JP (2) | JP5582681B2 (de) |
KR (1) | KR101358820B1 (de) |
AT (1) | ATE423225T1 (de) |
DE (1) | DE602005012850D1 (de) |
DK (1) | DK1799876T3 (de) |
ES (1) | ES2320366T3 (de) |
PL (1) | PL1799876T3 (de) |
PT (1) | PT1799876E (de) |
SI (1) | SI1799876T1 (de) |
WO (1) | WO2006097152A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070108907A (ko) * | 2005-03-11 | 2007-11-13 | 베카에르트 어드벤스드 코팅스 | 단일, 직각 엔드-블록 |
US20120031755A1 (en) * | 2006-11-24 | 2012-02-09 | Guo George X | Deposition system capable of processing multiple roll-fed substrates |
US20080127887A1 (en) * | 2006-12-01 | 2008-06-05 | Applied Materials, Inc. | Vertically mounted rotary cathodes in sputtering system on elevated rails |
DE102008033904B4 (de) * | 2008-07-18 | 2012-01-19 | Von Ardenne Anlagentechnik Gmbh | Antriebsendblock für eine Magnetronanordnung mit einem rotierenden Target |
US8182662B2 (en) * | 2009-03-27 | 2012-05-22 | Sputtering Components, Inc. | Rotary cathode for magnetron sputtering apparatus |
WO2010115189A1 (en) * | 2009-04-03 | 2010-10-07 | General Plasma, Inc. | Rotary magnetron |
JP5497572B2 (ja) * | 2009-08-18 | 2014-05-21 | キヤノンアネルバ株式会社 | スパッタリング装置及び真空処理装置 |
DE102009056241B4 (de) * | 2009-12-01 | 2012-07-12 | Von Ardenne Anlagentechnik Gmbh | Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target |
KR101155906B1 (ko) | 2009-12-11 | 2012-06-20 | 삼성모바일디스플레이주식회사 | 스퍼터링 장치 |
EP2371992B1 (de) * | 2010-04-01 | 2013-06-05 | Applied Materials, Inc. | Endblock und Zerstäubungsvorrichtung |
EP2387063B1 (de) * | 2010-05-11 | 2014-04-30 | Applied Materials, Inc. | Kammer zur physikalischen Dampfabscheidung |
WO2013003458A1 (en) | 2011-06-27 | 2013-01-03 | Soleras Ltd. | Sputtering target |
BE1020564A5 (nl) * | 2013-04-04 | 2013-12-03 | Soleras Advanced Coatings Bvba | Spindel voor magnetron sputter inrichting. |
US9809876B2 (en) | 2014-01-13 | 2017-11-07 | Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique (C.R.V.C.) Sarl | Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure |
US10699885B2 (en) | 2014-08-29 | 2020-06-30 | Bühler AG | Dual power feed rotary sputtering cathode |
CN104640339A (zh) * | 2015-01-12 | 2015-05-20 | 广东韦达尔科技有限公司 | 一种等离子表面处理装置 |
BE1024754B9 (nl) * | 2016-11-29 | 2018-07-24 | Soleras Advanced Coatings Bvba | Een universeel monteerbaar eindblok |
JP2018131644A (ja) * | 2017-02-13 | 2018-08-23 | 株式会社アルバック | スパッタリング装置用の回転式カソードユニット |
CN113366605B (zh) * | 2019-02-05 | 2024-02-20 | 应用材料公司 | 沉积设备和用于监测沉积设备的方法 |
KR20210080770A (ko) | 2019-12-23 | 2021-07-01 | 주식회사 선익시스템 | 스퍼터용 회전형 타겟장치 및 상기 타겟장치를 구비한 스퍼터장치 |
JP7303393B2 (ja) * | 2020-09-16 | 2023-07-04 | 株式会社アルバック | 回転式カソードユニット用の駆動ブロック |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3878085A (en) | 1973-07-05 | 1975-04-15 | Sloan Technology Corp | Cathode sputtering apparatus |
US4422916A (en) | 1981-02-12 | 1983-12-27 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4356073A (en) | 1981-02-12 | 1982-10-26 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4443318A (en) | 1983-08-17 | 1984-04-17 | Shatterproof Glass Corporation | Cathodic sputtering apparatus |
US4445997A (en) | 1983-08-17 | 1984-05-01 | Shatterproof Glass Corporation | Rotatable sputtering apparatus |
US4519885A (en) * | 1983-12-27 | 1985-05-28 | Shatterproof Glass Corp. | Method and apparatus for changing sputtering targets in a magnetron sputtering system |
US4575102A (en) * | 1984-11-20 | 1986-03-11 | Ferrofluidics Corporation | Coaxial, multiple-shaft ferrofluid seal apparatus |
US4995958A (en) | 1989-05-22 | 1991-02-26 | Varian Associates, Inc. | Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile |
US5096562A (en) * | 1989-11-08 | 1992-03-17 | The Boc Group, Inc. | Rotating cylindrical magnetron structure for large area coating |
WO1992002659A1 (en) | 1990-08-10 | 1992-02-20 | Viratec Thin Films, Inc. | Shielding for arc suppression in rotating magnetron sputtering systems |
US5200049A (en) * | 1990-08-10 | 1993-04-06 | Viratec Thin Films, Inc. | Cantilever mount for rotating cylindrical magnetrons |
US5100527A (en) * | 1990-10-18 | 1992-03-31 | Viratec Thin Films, Inc. | Rotating magnetron incorporating a removable cathode |
US5620577A (en) | 1993-12-30 | 1997-04-15 | Viratec Thin Films, Inc. | Spring-loaded mount for a rotatable sputtering cathode |
US5445721A (en) * | 1994-08-25 | 1995-08-29 | The Boc Group, Inc. | Rotatable magnetron including a replacement target structure |
US5591314A (en) | 1995-10-27 | 1997-01-07 | Morgan; Steven V. | Apparatus for affixing a rotating cylindrical magnetron target to a spindle |
JP3810132B2 (ja) * | 1996-05-23 | 2006-08-16 | 株式会社ライク | スパッタリング装置 |
EP0918351A1 (de) | 1997-11-19 | 1999-05-26 | Sinvaco N.V. | Flaches magnetron mit bewegbarer Magnetsanlage |
EP0969238A1 (de) | 1998-06-29 | 2000-01-05 | Sinvaco N.V. | Vakuumdichte Kupplung für Rohre |
US6365010B1 (en) * | 1998-11-06 | 2002-04-02 | Scivac | Sputtering apparatus and process for high rate coatings |
US6488824B1 (en) | 1998-11-06 | 2002-12-03 | Raycom Technologies, Inc. | Sputtering apparatus and process for high rate coatings |
US6263542B1 (en) * | 1999-06-22 | 2001-07-24 | Lam Research Corporation | Tolerance resistant and vacuum compliant door hinge with open-assist feature |
DE19958666C2 (de) | 1999-12-06 | 2003-10-30 | Heraeus Gmbh W C | Vorrichtung zur lösbaren Verbindung eines zylinderrohrförmigen Targetteiles mit einem Aufnahmeteil |
WO2002038826A1 (en) | 2000-11-09 | 2002-05-16 | Viratec Thin Films, Inc. | Alternating current rotatable sputter cathode |
US6375815B1 (en) | 2001-02-17 | 2002-04-23 | David Mark Lynn | Cylindrical magnetron target and apparatus for affixing the target to a rotatable spindle assembly |
US6736948B2 (en) * | 2002-01-18 | 2004-05-18 | Von Ardenne Anlagentechnik Gmbh | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation |
US20030173217A1 (en) | 2002-03-14 | 2003-09-18 | Sputtering Components, Inc. | High-power ion sputtering magnetron |
DE10213049A1 (de) | 2002-03-22 | 2003-10-02 | Dieter Wurczinger | Drehbare Rohrkatode |
US20070007129A1 (en) | 2003-03-25 | 2007-01-11 | Wilmert De Bosscher | Universal vacuum coupling for cylindrical target |
KR20060111896A (ko) * | 2003-07-04 | 2006-10-30 | 베카에르트 어드벤스드 코팅스 | 회전 관형 스퍼터 타겟 조립체 |
KR20070108907A (ko) | 2005-03-11 | 2007-11-13 | 베카에르트 어드벤스드 코팅스 | 단일, 직각 엔드-블록 |
-
2005
- 2005-10-11 SI SI200530640T patent/SI1799876T1/sl unknown
- 2005-10-11 EP EP05857644A patent/EP1799876B1/de active Active
- 2005-10-11 US US11/665,562 patent/US8562799B2/en active Active
- 2005-10-11 AT AT05857644T patent/ATE423225T1/de not_active IP Right Cessation
- 2005-10-11 JP JP2007536159A patent/JP5582681B2/ja active Active
- 2005-10-11 PT PT05857644T patent/PT1799876E/pt unknown
- 2005-10-11 DK DK05857644T patent/DK1799876T3/da active
- 2005-10-11 PL PL05857644T patent/PL1799876T3/pl unknown
- 2005-10-11 KR KR1020077008375A patent/KR101358820B1/ko active IP Right Grant
- 2005-10-11 DE DE602005012850T patent/DE602005012850D1/de active Active
- 2005-10-11 ES ES05857644T patent/ES2320366T3/es active Active
- 2005-10-11 WO PCT/EP2005/055143 patent/WO2006097152A1/en active Application Filing
-
2014
- 2014-06-10 JP JP2014119516A patent/JP6034830B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US8562799B2 (en) | 2013-10-22 |
KR20070067139A (ko) | 2007-06-27 |
EP1799876A1 (de) | 2007-06-27 |
JP6034830B2 (ja) | 2016-11-30 |
DK1799876T3 (da) | 2009-04-20 |
US20080105543A1 (en) | 2008-05-08 |
JP2008517150A (ja) | 2008-05-22 |
DE602005012850D1 (de) | 2009-04-02 |
KR101358820B1 (ko) | 2014-02-10 |
PT1799876E (pt) | 2009-03-30 |
ES2320366T3 (es) | 2009-05-21 |
JP5582681B2 (ja) | 2014-09-03 |
WO2006097152A1 (en) | 2006-09-21 |
SI1799876T1 (sl) | 2009-06-30 |
JP2014194086A (ja) | 2014-10-09 |
PL1799876T3 (pl) | 2009-07-31 |
EP1799876B1 (de) | 2009-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE423225T1 (de) | Flacher endblock als träger eines drehbaren sputter-targets | |
DE602004020227D1 (de) | Rotierende rohrförmige sputtertargetanorndung | |
US9349576B2 (en) | Magnetron for cylindrical targets | |
TW200606995A (en) | A magnetron sputtering device, a cylindrical cathode and a method of coating thin multicomponent films on a substrate | |
JP5265811B2 (ja) | スパッタ成膜装置 | |
DE502006008952D1 (de) | Magnetron-Sputterquelle, Sputter-Beschichtungsanlage und Verfahren zur Beschichtung eines Substrats | |
KR20200066377A (ko) | 마그네트론 스퍼터링 장치용 회전식 캐소드 유닛 | |
JP5004931B2 (ja) | スパッタ源、スパッタリング装置、及びスパッタリング方法 | |
JPH06503855A (ja) | 回転マグネトロンスパッタリングシステムにおけるアーク抑制のためのシールディング | |
JP2013524015A (ja) | 円筒形の回転する磁電管スパッタリング陰極装置及び無線周波放射を使用して材料を蒸着する方法 | |
JP2004346388A (ja) | スパッタ源、スパッタリング装置、及びスパッタリング方法 | |
JP2005298965A (ja) | 高電力スパッタリングのための電力結合器 | |
JP2003268538A (ja) | 高出力イオンスパッタリングマグネトロン | |
CN2873800Y (zh) | 一种靶装置 | |
US20180037984A1 (en) | Endblock for rotatable target with electrical connection between collector and rotor at pressure less than atmospheric pressure | |
CN109576665B (zh) | 一种离子源、镀膜装置以及镀膜方法 | |
TW200643205A (en) | Flat end-block for carrying a rotatable sputtering target | |
JP4646066B2 (ja) | 真空処理装置 | |
TW201441397A (zh) | 濺鍍設備及濺鍍方法 | |
CN109937270B (zh) | 可普遍安装的端块 | |
CN203807549U (zh) | 单枪多靶材的溅镀装置 | |
CN206157215U (zh) | 新型旋转阴极 | |
CN1884610A (zh) | 一种具有在线清洗功能的阳极装置及其应用方法 | |
CN213680867U (zh) | 一种移动弧源电弧离子沉积设备 | |
JP2011144434A (ja) | マルチターゲットスパッタ装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |