DE602004020227D1 - Rotierende rohrförmige sputtertargetanorndung - Google Patents
Rotierende rohrförmige sputtertargetanorndungInfo
- Publication number
- DE602004020227D1 DE602004020227D1 DE602004020227T DE602004020227T DE602004020227D1 DE 602004020227 D1 DE602004020227 D1 DE 602004020227D1 DE 602004020227 T DE602004020227 T DE 602004020227T DE 602004020227 T DE602004020227 T DE 602004020227T DE 602004020227 D1 DE602004020227 D1 DE 602004020227D1
- Authority
- DE
- Germany
- Prior art keywords
- assembly
- target assembly
- sputter target
- tube
- rotating tubular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 239000002826 coolant Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
- F04D17/168—Pumps specially adapted to produce a vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3497—Temperature of target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Engineering & Computer Science (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03077091 | 2003-07-04 | ||
PCT/EP2004/051247 WO2005005682A1 (en) | 2003-07-04 | 2004-06-25 | Rotating tubular sputter target assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004020227D1 true DE602004020227D1 (de) | 2009-05-07 |
Family
ID=34042902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004020227T Expired - Lifetime DE602004020227D1 (de) | 2003-07-04 | 2004-06-25 | Rotierende rohrförmige sputtertargetanorndung |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060157346A1 (de) |
EP (1) | EP1641956B1 (de) |
JP (1) | JP2009513818A (de) |
KR (1) | KR20060111896A (de) |
AT (1) | ATE426690T1 (de) |
DE (1) | DE602004020227D1 (de) |
WO (1) | WO2005005682A1 (de) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5582681B2 (ja) * | 2004-10-18 | 2014-09-03 | ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー | 回転可能なスパッタリングターゲットを支持する平面エンドブロック |
JP5004942B2 (ja) * | 2005-03-11 | 2012-08-22 | ベーカート・アドヴァンスト・コーティングス | 単一の直角エンドブロック |
WO2007147757A1 (en) * | 2006-06-19 | 2007-12-27 | Bekaert Advanced Coatings | Insert piece for an end-block of a sputtering installation |
CN201162043Y (zh) * | 2008-03-21 | 2008-12-10 | 北京京东方光电科技有限公司 | 磁控溅射靶结构及设备 |
DE102008039211B4 (de) * | 2008-05-07 | 2011-08-25 | VON ARDENNE Anlagentechnik GmbH, 01324 | Rohrtarget mit Endblock zur Kühlmittelversorgung |
KR20110014593A (ko) | 2008-05-16 | 2011-02-11 | 베카에르트 어드벤스드 코팅스 | 높은 강성을 갖는 회전가능한 스퍼터링 마그네트론 |
DE102008033904B4 (de) * | 2008-07-18 | 2012-01-19 | Von Ardenne Anlagentechnik Gmbh | Antriebsendblock für eine Magnetronanordnung mit einem rotierenden Target |
EP2446060B1 (de) | 2009-06-22 | 2017-05-10 | Statens Serum Institut | Dna-basierte verfahren zur klonspezifischen identifizierung von staphylococcus aureus |
JP5342364B2 (ja) * | 2009-08-05 | 2013-11-13 | 新明和工業株式会社 | 給電機構および真空処理装置 |
JP5730888B2 (ja) | 2009-10-26 | 2015-06-10 | ジェネラル・プラズマ・インコーポレーテッド | ロータリーマグネトロンマグネットバー、およびこれを含む高いターゲット利用のための装置 |
DE102009056241B4 (de) * | 2009-12-01 | 2012-07-12 | Von Ardenne Anlagentechnik Gmbh | Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target |
WO2011094060A2 (en) * | 2010-01-29 | 2011-08-04 | Applied Materials, Inc. | Pump baffle design for integrated pump and sputter source |
DE102010063685B4 (de) * | 2010-02-21 | 2012-07-12 | Von Ardenne Anlagentechnik Gmbh | Magnetronanordnung mit einem Hohltarget |
EP2372744B1 (de) * | 2010-04-01 | 2016-01-13 | Applied Materials, Inc. | Vorrichtung zum Stützen eines drehbaren Targets und Sputter-Installation |
EP2371992B1 (de) * | 2010-04-01 | 2013-06-05 | Applied Materials, Inc. | Endblock und Zerstäubungsvorrichtung |
US9334563B2 (en) | 2010-07-12 | 2016-05-10 | Materion Corporation | Direct cooled rotary sputtering target |
BR112013000785A2 (pt) | 2010-07-12 | 2016-05-24 | Materion Advanced Materials Technologies And Services Inc | conjunto de união de tubo de apoio de alvo giratório |
EP2723915A1 (de) | 2011-06-27 | 2014-04-30 | Soleras Ltd. | Sputter-target |
KR20130136856A (ko) * | 2012-06-05 | 2013-12-13 | 주식회사 씨티씨 | 스퍼터링 소스 및 이를 포함하는 원통형 스퍼터링 장치 |
KR101441481B1 (ko) * | 2012-09-11 | 2014-09-17 | 주식회사 에스에프에이 | 회전형 캐소드 및 이를 구비한 스퍼터 장치 |
US20140110245A1 (en) * | 2012-10-18 | 2014-04-24 | Primestar Solar, Inc. | Non-bonded rotatable targets and their methods of sputtering |
JP6415957B2 (ja) * | 2014-12-09 | 2018-10-31 | 株式会社アルバック | ロータリーカソード、および、スパッタ装置 |
CN104619107A (zh) * | 2015-01-12 | 2015-05-13 | 广东韦达尔科技有限公司 | 一种等离子电磁式旋转处理装置 |
CN104640339A (zh) * | 2015-01-12 | 2015-05-20 | 广东韦达尔科技有限公司 | 一种等离子表面处理装置 |
KR101694197B1 (ko) | 2015-03-25 | 2017-01-09 | 주식회사 에스에프에이 | 스퍼터 장치 |
KR101687302B1 (ko) | 2015-06-12 | 2016-12-16 | 주식회사 에스에프에이 | 스퍼터 장치 |
BE1024754B9 (nl) * | 2016-11-29 | 2018-07-24 | Soleras Advanced Coatings Bvba | Een universeel monteerbaar eindblok |
KR102462111B1 (ko) | 2020-09-14 | 2022-11-02 | 주식회사 케이씨엠씨 | 회전형 캐소드 및 이를 구비한 스퍼터 장치 |
CN116057199A (zh) * | 2020-10-08 | 2023-05-02 | 株式会社爱发科 | 旋转式阴极单元用的驱动块 |
CN112746260B (zh) * | 2020-12-30 | 2023-02-28 | 湖南柯盛新材料有限公司 | 一种冷喷涂制造旋转靶材的工艺及其生产设备 |
CN113755803B (zh) * | 2021-08-13 | 2023-11-28 | 中山凯旋真空科技股份有限公司 | 旋转驱动机构及平面阴极装置 |
DE102021129523A1 (de) | 2021-11-12 | 2023-05-17 | VON ARDENNE Asset GmbH & Co. KG | Magnetsystem, Sputtervorrichtung und Gehäusedeckel |
KR20230112498A (ko) | 2022-01-20 | 2023-07-27 | 주식회사 케이씨엠씨 | Rf 전원용 회전형 캐소드 및 이를 구비한 스퍼터 장치 |
KR20230112499A (ko) | 2022-01-20 | 2023-07-27 | 주식회사 케이씨엠씨 | 회전형 캐소드 및 이를 구비한 스퍼터 장치 |
KR20230119297A (ko) | 2022-02-07 | 2023-08-16 | 주식회사 케이씨엠씨 | 회전형 캐소드 및 이를 구비한 스퍼터 장치 |
CN115691853B (zh) * | 2022-09-26 | 2024-01-23 | 中国核动力研究设计院 | 一种用于研究堆同位素辐照生产的辐照靶件及组装方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4422916A (en) * | 1981-02-12 | 1983-12-27 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4356073A (en) * | 1981-02-12 | 1982-10-26 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US4443318A (en) * | 1983-08-17 | 1984-04-17 | Shatterproof Glass Corporation | Cathodic sputtering apparatus |
US4824540A (en) * | 1988-04-21 | 1989-04-25 | Stuart Robley V | Method and apparatus for magnetron sputtering |
US5096562A (en) * | 1989-11-08 | 1992-03-17 | The Boc Group, Inc. | Rotating cylindrical magnetron structure for large area coating |
US4981713A (en) * | 1990-02-14 | 1991-01-01 | E. I. Du Pont De Nemours And Company | Low temperature plasma technology for corrosion protection of steel |
US5200049A (en) * | 1990-08-10 | 1993-04-06 | Viratec Thin Films, Inc. | Cantilever mount for rotating cylindrical magnetrons |
EP0543931A4 (en) * | 1990-08-10 | 1993-09-08 | Viratec Thin Films, Inc. | Shielding for arc suppression in rotating magnetron sputtering systems |
US5262032A (en) * | 1991-05-28 | 1993-11-16 | Leybold Aktiengesellschaft | Sputtering apparatus with rotating target and target cooling |
ES2257047T3 (es) * | 1998-04-16 | 2006-07-16 | Bekaert Advanced Coatings Nv. | Medios para controlar la erosion y la pulverizacion del objetivo en un magnetron. |
-
2004
- 2004-06-25 EP EP04741896A patent/EP1641956B1/de not_active Expired - Lifetime
- 2004-06-25 JP JP2006518200A patent/JP2009513818A/ja active Pending
- 2004-06-25 WO PCT/EP2004/051247 patent/WO2005005682A1/en active Application Filing
- 2004-06-25 DE DE602004020227T patent/DE602004020227D1/de not_active Expired - Lifetime
- 2004-06-25 KR KR1020067000235A patent/KR20060111896A/ko not_active Application Discontinuation
- 2004-06-25 AT AT04741896T patent/ATE426690T1/de not_active IP Right Cessation
- 2004-06-25 US US10/562,855 patent/US20060157346A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1641956B1 (de) | 2009-03-25 |
EP1641956A1 (de) | 2006-04-05 |
JP2009513818A (ja) | 2009-04-02 |
US20060157346A1 (en) | 2006-07-20 |
WO2005005682A1 (en) | 2005-01-20 |
KR20060111896A (ko) | 2006-10-30 |
ATE426690T1 (de) | 2009-04-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |