ATE426690T1 - Rotierende rohrfírmige sputtertargetanorndung - Google Patents

Rotierende rohrfírmige sputtertargetanorndung

Info

Publication number
ATE426690T1
ATE426690T1 AT04741896T AT04741896T ATE426690T1 AT E426690 T1 ATE426690 T1 AT E426690T1 AT 04741896 T AT04741896 T AT 04741896T AT 04741896 T AT04741896 T AT 04741896T AT E426690 T1 ATE426690 T1 AT E426690T1
Authority
AT
Austria
Prior art keywords
assembly
sputter target
tube
target arrangement
rotating tubular
Prior art date
Application number
AT04741896T
Other languages
English (en)
Inventor
Dirk Cnockaert
Bosscher Wilmert De
Original Assignee
Bekaert Advanced Coatings
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bekaert Advanced Coatings filed Critical Bekaert Advanced Coatings
Application granted granted Critical
Publication of ATE426690T1 publication Critical patent/ATE426690T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
    • F04D17/08—Centrifugal pumps
    • F04D17/16—Centrifugal pumps for displacing without appreciable compression
    • F04D17/168—Pumps specially adapted to produce a vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/02—Permanent magnets [PM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Engineering & Computer Science (AREA)
  • Physical Vapour Deposition (AREA)
AT04741896T 2003-07-04 2004-06-25 Rotierende rohrfírmige sputtertargetanorndung ATE426690T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP03077091 2003-07-04

Publications (1)

Publication Number Publication Date
ATE426690T1 true ATE426690T1 (de) 2009-04-15

Family

ID=34042902

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04741896T ATE426690T1 (de) 2003-07-04 2004-06-25 Rotierende rohrfírmige sputtertargetanorndung

Country Status (7)

Country Link
US (1) US20060157346A1 (de)
EP (1) EP1641956B1 (de)
JP (1) JP2009513818A (de)
KR (1) KR20060111896A (de)
AT (1) ATE426690T1 (de)
DE (1) DE602004020227D1 (de)
WO (1) WO2005005682A1 (de)

Families Citing this family (36)

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Publication number Priority date Publication date Assignee Title
SI1799876T1 (sl) * 2004-10-18 2009-06-30 Bekaert Advanced Coatings Plosk končni blok zasučne tarče za napraševanje
KR20070108907A (ko) * 2005-03-11 2007-11-13 베카에르트 어드벤스드 코팅스 단일, 직각 엔드-블록
CN101473405B (zh) * 2006-06-19 2010-11-17 贝卡尔特先进涂层公司 用于溅射装置端块的插件
CN201162043Y (zh) * 2008-03-21 2008-12-10 北京京东方光电科技有限公司 磁控溅射靶结构及设备
DE102008039211B4 (de) 2008-05-07 2011-08-25 VON ARDENNE Anlagentechnik GmbH, 01324 Rohrtarget mit Endblock zur Kühlmittelversorgung
JP5524185B2 (ja) * 2008-05-16 2014-06-18 ソレラス・アドヴァンスト・コーティングス・ビーヴイビーエー 高剛性を有する回転可能なスパッタリングマグネトロン
DE102008033904B4 (de) * 2008-07-18 2012-01-19 Von Ardenne Anlagentechnik Gmbh Antriebsendblock für eine Magnetronanordnung mit einem rotierenden Target
US9279160B2 (en) 2009-06-22 2016-03-08 Statens Serum Institut DNA-based methods for clone-specific identification of staphylococcus aureus
JP5342364B2 (ja) * 2009-08-05 2013-11-13 新明和工業株式会社 給電機構および真空処理装置
US9388490B2 (en) 2009-10-26 2016-07-12 General Plasma, Inc. Rotary magnetron magnet bar and apparatus containing the same for high target utilization
DE102009056241B4 (de) * 2009-12-01 2012-07-12 Von Ardenne Anlagentechnik Gmbh Stützeinrichtung für eine Magnetronanordnung mit einem rotierenden Target
WO2011094060A2 (en) * 2010-01-29 2011-08-04 Applied Materials, Inc. Pump baffle design for integrated pump and sputter source
DE102010063685B4 (de) * 2010-02-21 2012-07-12 Von Ardenne Anlagentechnik Gmbh Magnetronanordnung mit einem Hohltarget
EP2371992B1 (de) * 2010-04-01 2013-06-05 Applied Materials, Inc. Endblock und Zerstäubungsvorrichtung
EP2372744B1 (de) * 2010-04-01 2016-01-13 Applied Materials, Inc. Vorrichtung zum Stützen eines drehbaren Targets und Sputter-Installation
US9334563B2 (en) 2010-07-12 2016-05-10 Materion Corporation Direct cooled rotary sputtering target
JP5576562B2 (ja) * 2010-07-12 2014-08-20 マテリオン アドバンスト マテリアルズ テクノロジーズ アンド サービシーズ インコーポレイティド 回転式ターゲット裏当て管結合用組立
WO2013003458A1 (en) 2011-06-27 2013-01-03 Soleras Ltd. Sputtering target
KR20130136856A (ko) * 2012-06-05 2013-12-13 주식회사 씨티씨 스퍼터링 소스 및 이를 포함하는 원통형 스퍼터링 장치
KR101441481B1 (ko) * 2012-09-11 2014-09-17 주식회사 에스에프에이 회전형 캐소드 및 이를 구비한 스퍼터 장치
US20140110245A1 (en) * 2012-10-18 2014-04-24 Primestar Solar, Inc. Non-bonded rotatable targets and their methods of sputtering
JP6415957B2 (ja) * 2014-12-09 2018-10-31 株式会社アルバック ロータリーカソード、および、スパッタ装置
CN104619107A (zh) * 2015-01-12 2015-05-13 广东韦达尔科技有限公司 一种等离子电磁式旋转处理装置
CN104640339A (zh) * 2015-01-12 2015-05-20 广东韦达尔科技有限公司 一种等离子表面处理装置
KR101694197B1 (ko) 2015-03-25 2017-01-09 주식회사 에스에프에이 스퍼터 장치
KR101687302B1 (ko) 2015-06-12 2016-12-16 주식회사 에스에프에이 스퍼터 장치
BE1024754B9 (nl) * 2016-11-29 2018-07-24 Soleras Advanced Coatings Bvba Een universeel monteerbaar eindblok
KR102462111B1 (ko) 2020-09-14 2022-11-02 주식회사 케이씨엠씨 회전형 캐소드 및 이를 구비한 스퍼터 장치
WO2022074893A1 (ja) * 2020-10-08 2022-04-14 株式会社アルバック 回転式カソードユニット用の駆動ブロック
CN112746260B (zh) * 2020-12-30 2023-02-28 湖南柯盛新材料有限公司 一种冷喷涂制造旋转靶材的工艺及其生产设备
CN113755803B (zh) * 2021-08-13 2023-11-28 中山凯旋真空科技股份有限公司 旋转驱动机构及平面阴极装置
DE102021129523A1 (de) 2021-11-12 2023-05-17 VON ARDENNE Asset GmbH & Co. KG Magnetsystem, Sputtervorrichtung und Gehäusedeckel
KR20230112499A (ko) 2022-01-20 2023-07-27 주식회사 케이씨엠씨 회전형 캐소드 및 이를 구비한 스퍼터 장치
KR20230112498A (ko) 2022-01-20 2023-07-27 주식회사 케이씨엠씨 Rf 전원용 회전형 캐소드 및 이를 구비한 스퍼터 장치
KR20230119297A (ko) 2022-02-07 2023-08-16 주식회사 케이씨엠씨 회전형 캐소드 및 이를 구비한 스퍼터 장치
CN115691853B (zh) * 2022-09-26 2024-01-23 中国核动力研究设计院 一种用于研究堆同位素辐照生产的辐照靶件及组装方法

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US4422916A (en) * 1981-02-12 1983-12-27 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
US4824540A (en) * 1988-04-21 1989-04-25 Stuart Robley V Method and apparatus for magnetron sputtering
US5096562A (en) * 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
US4981713A (en) * 1990-02-14 1991-01-01 E. I. Du Pont De Nemours And Company Low temperature plasma technology for corrosion protection of steel
US5200049A (en) * 1990-08-10 1993-04-06 Viratec Thin Films, Inc. Cantilever mount for rotating cylindrical magnetrons
WO1992002659A1 (en) * 1990-08-10 1992-02-20 Viratec Thin Films, Inc. Shielding for arc suppression in rotating magnetron sputtering systems
US5262032A (en) * 1991-05-28 1993-11-16 Leybold Aktiengesellschaft Sputtering apparatus with rotating target and target cooling
DE69928790T2 (de) * 1998-04-16 2006-08-31 Bekaert Advanced Coatings N.V. Mittel zur kontrolle der targetabtragung und der zerstäubung in einem magnetron

Also Published As

Publication number Publication date
WO2005005682A1 (en) 2005-01-20
KR20060111896A (ko) 2006-10-30
DE602004020227D1 (de) 2009-05-07
US20060157346A1 (en) 2006-07-20
JP2009513818A (ja) 2009-04-02
EP1641956A1 (de) 2006-04-05
EP1641956B1 (de) 2009-03-25

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Legal Events

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