BR112013000785A2 - conjunto de união de tubo de apoio de alvo giratório - Google Patents

conjunto de união de tubo de apoio de alvo giratório

Info

Publication number
BR112013000785A2
BR112013000785A2 BR112013000785A BR112013000785A BR112013000785A2 BR 112013000785 A2 BR112013000785 A2 BR 112013000785A2 BR 112013000785 A BR112013000785 A BR 112013000785A BR 112013000785 A BR112013000785 A BR 112013000785A BR 112013000785 A2 BR112013000785 A2 BR 112013000785A2
Authority
BR
Brazil
Prior art keywords
target
support pipe
pipe joint
joint assembly
target support
Prior art date
Application number
BR112013000785A
Other languages
English (en)
Inventor
George Michael Wityak
Luther Wilburn Cox
Original Assignee
Materion Advanced Materials Technologies And Services Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materion Advanced Materials Technologies And Services Inc filed Critical Materion Advanced Materials Technologies And Services Inc
Publication of BR112013000785A2 publication Critical patent/BR112013000785A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps
    • B23K37/0443—Jigs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Physical Vapour Deposition (AREA)
  • Joints Allowing Movement (AREA)

Abstract

conjunto de união de tubo de apoio de alvo giratório. a presente invenção refere-se a um alvo giratório da pulverização catódica unido a um tubo de apoio de tal forma que o material de união seja aplicado somente próximo das extremidades do alvo giratório da pulverização catódica e também esteja entre o alvo e o tubo de apoio para formar uma abertura entre o alvo giratório da pulverização catódica e o tubo de apoio e um dispositivo para unir um alvo giratório da pulverização catódica a um tubo de apoio.
BR112013000785A 2010-07-12 2011-07-11 conjunto de união de tubo de apoio de alvo giratório BR112013000785A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US36330810P 2010-07-12 2010-07-12
PCT/US2011/043532 WO2012009264A2 (en) 2010-07-12 2011-07-11 Rotary target backing tube bonding assembly

Publications (1)

Publication Number Publication Date
BR112013000785A2 true BR112013000785A2 (pt) 2016-05-24

Family

ID=45437802

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013000785A BR112013000785A2 (pt) 2010-07-12 2011-07-11 conjunto de união de tubo de apoio de alvo giratório

Country Status (6)

Country Link
US (1) US9011652B2 (pt)
EP (1) EP2593578A4 (pt)
JP (1) JP5576562B2 (pt)
BR (1) BR112013000785A2 (pt)
RU (1) RU2013103041A (pt)
WO (1) WO2012009264A2 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9334563B2 (en) * 2010-07-12 2016-05-10 Materion Corporation Direct cooled rotary sputtering target
DE102012204425A1 (de) * 2012-03-20 2013-09-26 Von Ardenne Anlagentechnik Gmbh Sputterverfahren und Sputtervorrichtung
AT13609U1 (de) * 2012-09-17 2014-04-15 Plansee Se Rohrförmiges Target
WO2014150664A1 (en) 2013-03-15 2014-09-25 Materion Corporation Plating stack to condition a bonding surface
WO2016067717A1 (ja) * 2014-10-28 2016-05-06 三井金属鉱業株式会社 円筒形セラミックススパッタリングターゲットならびにその製造装置および製造方法
CN106270866B (zh) * 2016-08-30 2018-08-21 常州苏晶电子材料有限公司 一种旋转钼靶材的焊接方法
CN109570931B (zh) * 2018-12-08 2020-11-10 东曹(上海)电子材料有限公司 一种大尺寸平板显示器用溅射靶材的生产方法
CN111778486A (zh) * 2019-04-04 2020-10-16 领凡新能源科技(北京)有限公司 旋转靶材、旋转靶材的绑定方法和装置
US11830712B2 (en) 2019-05-22 2023-11-28 Sci Engineered Materials, Inc. High efficiency rotatable sputter target
CN115533359A (zh) * 2022-09-07 2022-12-30 有研稀土新材料股份有限公司 一种稀土旋转靶材及其制备方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2800008B2 (ja) 1988-06-27 1998-09-21 東京エレクトロン 株式会社 回転処理装置及び回転処理方法
JP3618005B2 (ja) * 1994-08-23 2005-02-09 三井金属鉱業株式会社 回転カソード用スパッタリングターゲットの製造方法
WO2000028104A1 (en) 1998-11-06 2000-05-18 Scivac Sputtering apparatus and process for high rate coatings
TW555874B (en) 2000-09-08 2003-10-01 Asahi Glass Co Ltd Cylindrical target and its production method
US6409897B1 (en) 2000-09-20 2002-06-25 Poco Graphite, Inc. Rotatable sputter target
DE10102493B4 (de) 2001-01-19 2007-07-12 W.C. Heraeus Gmbh Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
US20030173217A1 (en) * 2002-03-14 2003-09-18 Sputtering Components, Inc. High-power ion sputtering magnetron
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
DE10231203B4 (de) * 2002-07-10 2009-09-10 Interpane Entwicklungs-Und Beratungsgesellschaft Mbh Targetträgeranordnung
KR20060111896A (ko) 2003-07-04 2006-10-30 베카에르트 어드벤스드 코팅스 회전 관형 스퍼터 타겟 조립체
WO2006007504A1 (en) 2004-07-01 2006-01-19 Cardinal Cg Company Cylindrical target with oscillating magnet from magnetron sputtering
DE102004060423B4 (de) 2004-12-14 2016-10-27 Heraeus Deutschland GmbH & Co. KG Rohrtarget und dessen Verwendung
US8182661B2 (en) 2005-07-27 2012-05-22 Applied Materials, Inc. Controllable target cooling
US7922066B2 (en) 2005-09-21 2011-04-12 Soleras, LTd. Method of manufacturing a rotary sputtering target using a mold
TWI317763B (en) 2005-10-03 2009-12-01 Thermal Conductive Bonding Inc Very long cylindrical sputtering target and method for manufacturing
ATE509133T1 (de) * 2006-01-31 2011-05-15 Bekaert Advanced Coatings Nv Rohrförmiges sputtertarget mit verbesserter steifigkeit
DE102006009749A1 (de) * 2006-03-02 2007-09-06 FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH Targetanordnung
DE102006017455A1 (de) 2006-04-13 2007-10-25 Applied Materials Gmbh & Co. Kg Rohrkathode
JP4775184B2 (ja) 2006-08-31 2011-09-21 富士電機株式会社 磁気部品の巻線構造
JP5467735B2 (ja) 2007-07-02 2014-04-09 東ソー株式会社 円筒形スパッタリングターゲット
DE102007044651B4 (de) 2007-09-18 2011-07-21 W.C. Heraeus GmbH, 63450 Rohrsputtertarget mit grabenförmig strukturierter Außenfläche des Trägerrohres sowie Verfahren zu seiner Herstellung
JP5309978B2 (ja) * 2008-08-20 2013-10-09 東ソー株式会社 円筒形スパッタリングターゲットの製造方法
JP5482020B2 (ja) 2008-09-25 2014-04-23 東ソー株式会社 円筒形スパッタリングターゲット及びその製造方法
EP2276053A1 (en) 2009-07-13 2011-01-19 Applied Materials, Inc. Target backing tube, cylindrical target assembly and sputtering system
EP2276054A1 (en) 2009-07-13 2011-01-19 Applied Materials, Inc. Sputtering system, rotatable cylindrical target assembly, backing tube, target element and cooling shield

Also Published As

Publication number Publication date
EP2593578A2 (en) 2013-05-22
US9011652B2 (en) 2015-04-21
WO2012009264A2 (en) 2012-01-19
US20120006680A1 (en) 2012-01-12
EP2593578A4 (en) 2014-06-18
WO2012009264A3 (en) 2012-04-19
JP2013534569A (ja) 2013-09-05
RU2013103041A (ru) 2014-08-20
JP5576562B2 (ja) 2014-08-20

Similar Documents

Publication Publication Date Title
BR112013000785A2 (pt) conjunto de união de tubo de apoio de alvo giratório
BR112012022031A2 (pt) ferramenta de vedação de tubo com braçadeira externa e interna
BR112012030876A2 (pt) "método para formação de uma junta de montagem entre duas seções de tubo isoladas"
BR112014026814A2 (pt) vedação de metal de acanelamento com tubo integral e conjunto de vedação de acanelamento e tubo.
BR112012002074A2 (pt) conexão elétrica de balística através de uma junta de campo
GB2509678A (en) Pipeline unit
BR112013007220A2 (pt) inivibidores duplos de met e vegf para o travamento de câncer de próstata resistente a castração e metástases ósseas osteoblásticas
EP3675751C0 (en) ULTRASOUND SURGICAL INSTRUMENT WITH PRE-ASSEMBLED ACOUSTIC ASSEMBLY
EP3081137A4 (en) Flexible pipe section for endoscope and endoscope
EP3580558A4 (en) COUPLING FOR ULTRASONIC PIPE INSPECTION
FR2965598B1 (fr) Assemblage de soufflet d'etancheite soude
IL196511A0 (en) Bell joint pipe seal
BR112013028105A2 (pt) sistema de ajuste e contenção para junta flexível submarina
SG10201913718PA (en) Drywall joint tape with dual purpose adhesive backing
EP3643243A4 (en) ULTRASONIC PROBE COUPLING ASSEMBLY AND ULTRASONIC PROBE ASSEMBLY
EP2971615A4 (en) Low leakage duct segment using expansion joint assembly
TWD165257S (zh) 管接頭區段
BRPI1006983A2 (pt) conexão de tubo de freio para uma mangueira de freio
FR2965588B1 (fr) Ensemble propulsif d'aeronef
TWD165258S (zh) 管接頭區段
BR112014011189A2 (pt) sistema de conexão selada entre a ventaneira de um forno de cuba e um tubo de jato de ar e alto-forno siderúrgico
DE112011103890A5 (de) Verbindungsanordnung
IL214904A0 (en) Pipe coupling assembly
TWD165256S (zh) 管接頭區段
FR2955162B1 (fr) Joint de cardan sperique

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2383 DE 06-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.