WO2012145702A3 - Lithium sputter targets - Google Patents
Lithium sputter targets Download PDFInfo
- Publication number
- WO2012145702A3 WO2012145702A3 PCT/US2012/034556 US2012034556W WO2012145702A3 WO 2012145702 A3 WO2012145702 A3 WO 2012145702A3 US 2012034556 W US2012034556 W US 2012034556W WO 2012145702 A3 WO2012145702 A3 WO 2012145702A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lithium
- sputter
- target
- targets
- sputter targets
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G19/00—Compounds of tin
- C01G19/02—Oxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G9/00—Compounds of zinc
- C01G9/02—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
Abstract
Described are methods of fabricating lithium sputter targets, lithium sputter targets, associated handling apparatus, and sputter methods including lithium targets. Various embodiments address adhesion of the lithium metal target to a support structure, avoiding and/or removing passivating coatings formed on the lithium target, uniformity of the lithium target as well as efficient cooling of lithium during sputtering. Target configurations used to compensate for non-uniformities in sputter plasma are described. Modular format lithium tiles and methods of fabrication are described. Rotary lithium sputter targets are also described.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/112,909 US9771646B2 (en) | 2011-04-21 | 2012-04-20 | Lithium sputter targets |
EP12774507.3A EP2699708B1 (en) | 2011-04-21 | 2012-04-20 | Lithium sputter target |
EP18186121.2A EP3431628A1 (en) | 2011-04-21 | 2012-04-20 | Lithium sputter targets |
US15/668,631 US10125419B2 (en) | 2011-04-21 | 2017-08-03 | Lithium sputter targets |
US16/150,168 US20190032195A1 (en) | 2011-04-21 | 2018-10-02 | Lithium sputter targets |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161478044P | 2011-04-21 | 2011-04-21 | |
US61/478,044 | 2011-04-21 | ||
US201161485045P | 2011-05-11 | 2011-05-11 | |
US61/485,045 | 2011-05-11 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/112,909 A-371-Of-International US9771646B2 (en) | 2011-04-21 | 2012-04-20 | Lithium sputter targets |
US15/668,631 Continuation US10125419B2 (en) | 2011-04-21 | 2017-08-03 | Lithium sputter targets |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012145702A2 WO2012145702A2 (en) | 2012-10-26 |
WO2012145702A3 true WO2012145702A3 (en) | 2013-01-03 |
Family
ID=47042192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2012/034556 WO2012145702A2 (en) | 2011-04-21 | 2012-04-20 | Lithium sputter targets |
Country Status (3)
Country | Link |
---|---|
US (3) | US9771646B2 (en) |
EP (2) | EP3431628A1 (en) |
WO (1) | WO2012145702A2 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9771646B2 (en) | 2011-04-21 | 2017-09-26 | View, Inc. | Lithium sputter targets |
WO2013003065A2 (en) | 2011-06-30 | 2013-01-03 | Soladigm, Inc. | Sputter target and sputtering methods |
BE1022190B1 (en) * | 2014-07-07 | 2016-02-25 | Soleras Advanced Coatings Bvba | PROTECTION FOR A REACTIVE SPUTTER PURPOSE |
KR102488802B1 (en) | 2014-12-19 | 2023-01-13 | 뷰, 인크. | Mitigating defects in an electrochromic device under a bus bar |
WO2017011155A1 (en) * | 2015-07-13 | 2017-01-19 | Albemarle Corporation | Processes for low pressure, cold bonding of solid lithium to metal substrates |
KR102015609B1 (en) * | 2015-07-24 | 2019-08-28 | 어플라이드 머티어리얼스, 인코포레이티드 | Optimized cooling and utilization of heat sensitive bonded metal targets |
CN105349952A (en) * | 2015-11-09 | 2016-02-24 | 基迈克材料科技(苏州)有限公司 | Manufacturing method for casting metal lithium target |
WO2017218705A1 (en) | 2016-06-17 | 2017-12-21 | View, Inc. | Mitigating defects in an electrochromic device under a bus bar |
WO2018025036A1 (en) * | 2016-08-03 | 2018-02-08 | Sigma Lithium Limited | Method of forming a metallic lithium coating |
US10570504B2 (en) * | 2017-04-26 | 2020-02-25 | International Business Machines Corporation | Structure and method to fabricate highly reactive physical vapor deposition target |
CN111411330B (en) * | 2019-01-08 | 2022-02-22 | 天津中能锂业有限公司 | Method for manufacturing lithium target assembly |
CN111519141B (en) * | 2020-03-30 | 2022-05-27 | 维达力实业(深圳)有限公司 | Lithium alloy target material and preparation method and application thereof |
CN113523298B (en) * | 2021-06-30 | 2023-07-07 | 洛阳科威钨钼有限公司 | Preparation method of planar lithium target |
CN113523299B (en) * | 2021-06-30 | 2023-05-30 | 洛阳科威钨钼有限公司 | Preparation method of tubular lithium target |
US20240075146A1 (en) * | 2022-08-31 | 2024-03-07 | Tae Technologies, Inc. | Integrated lithium target |
Citations (4)
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US5507897A (en) * | 1991-12-13 | 1996-04-16 | Societe Nationale Elf Aquitaine | Process for the preparation of a target component for cathode sputtering |
JP2003183822A (en) * | 2001-12-19 | 2003-07-03 | Mitsui Mining & Smelting Co Ltd | Sputtering target and manufacturing method therefor |
US20060272936A1 (en) * | 2005-01-28 | 2006-12-07 | Hideki Yamashita | Deposition method by physical vapor deposition and target for deposition processing by physical vapor deposition |
US20100108500A1 (en) * | 2008-10-31 | 2010-05-06 | Applied Materials, Inc. | Encapsulated sputtering target |
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US3945911A (en) | 1974-08-28 | 1976-03-23 | Shatterproof Glass Corporation | Cathodes for sputter-coating glass sheets or other substrates |
DE3223245C2 (en) | 1982-07-23 | 1986-05-22 | Nihon Shinku Gijutsu K.K., Chigasaki, Kanagawa | High speed ferromagnetic sputtering device |
JPS62149866A (en) | 1985-12-23 | 1987-07-03 | Matsushita Electric Ind Co Ltd | Target for sputtering |
JPS63143258A (en) | 1986-12-05 | 1988-06-15 | Mitsubishi Metal Corp | Sputtering target |
JPS63192863A (en) | 1987-02-06 | 1988-08-10 | Shinku Zairyo Kk | Mosaic type target device |
JPS63223168A (en) | 1987-03-11 | 1988-09-16 | Kobe Steel Ltd | Target for sputtering |
US4904362A (en) | 1987-07-24 | 1990-02-27 | Miba Gleitlager Aktiengesellschaft | Bar-shaped magnetron or sputter cathode arrangement |
CA2040993C (en) * | 1990-04-25 | 2001-08-07 | Yoshiaki Inoue | Oxygen absorbent composition and method of preserving article with same |
WO1992004482A1 (en) * | 1990-08-30 | 1992-03-19 | Materials Research Corporation | Pretextured cathode sputtering target and method of preparation thereof and sputtering therewith |
JPH04173966A (en) | 1990-11-02 | 1992-06-22 | Sanyo Shinku Kogyo Kk | Target cell unit and vacuum film forming device |
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US5262032A (en) * | 1991-05-28 | 1993-11-16 | Leybold Aktiengesellschaft | Sputtering apparatus with rotating target and target cooling |
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-
2012
- 2012-04-20 US US14/112,909 patent/US9771646B2/en active Active
- 2012-04-20 EP EP18186121.2A patent/EP3431628A1/en not_active Withdrawn
- 2012-04-20 WO PCT/US2012/034556 patent/WO2012145702A2/en active Application Filing
- 2012-04-20 EP EP12774507.3A patent/EP2699708B1/en active Active
-
2017
- 2017-08-03 US US15/668,631 patent/US10125419B2/en active Active
-
2018
- 2018-10-02 US US16/150,168 patent/US20190032195A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5507897A (en) * | 1991-12-13 | 1996-04-16 | Societe Nationale Elf Aquitaine | Process for the preparation of a target component for cathode sputtering |
JP2003183822A (en) * | 2001-12-19 | 2003-07-03 | Mitsui Mining & Smelting Co Ltd | Sputtering target and manufacturing method therefor |
US20060272936A1 (en) * | 2005-01-28 | 2006-12-07 | Hideki Yamashita | Deposition method by physical vapor deposition and target for deposition processing by physical vapor deposition |
US20100108500A1 (en) * | 2008-10-31 | 2010-05-06 | Applied Materials, Inc. | Encapsulated sputtering target |
Non-Patent Citations (1)
Title |
---|
See also references of EP2699708A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP3431628A1 (en) | 2019-01-23 |
US9771646B2 (en) | 2017-09-26 |
WO2012145702A2 (en) | 2012-10-26 |
EP2699708A4 (en) | 2014-08-06 |
EP2699708A2 (en) | 2014-02-26 |
EP2699708B1 (en) | 2018-11-14 |
US10125419B2 (en) | 2018-11-13 |
US20140138242A1 (en) | 2014-05-22 |
US20170327940A1 (en) | 2017-11-16 |
US20190032195A1 (en) | 2019-01-31 |
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