JPS63143258A - Sputtering target - Google Patents

Abstract

PURPOSE:To easily obtain a large-sized target which is free from contamination by pressing plural sheets of thin plate-shaped target elements consisting of Te, Te alloy, Se alloy, etc., at side part end faces formed with inclined or curved planes, curved faces, etc., and brazing the same to a cooling plate. CONSTITUTION:The large-sized target is obtd. by pressing plural sheets of the thin plate-shaped target elements 1 consisting of Te, Te alloy or Se alloy which is brittle and has no malleability, to each other at the side part end faces 1a, 1a facing each other and joining the same by brazing onto the cooling plate 3. The side part end face 1a of the above-mentioned method is formed to the plane inclined by, for example, about 30 deg. with the cooling plate 3. Sputtering of the constituting components such as the brazing filler metal 2 and cooling plate 3 during sputtering is thereby obviated and the large-sized target which can form the thin films without contamination is easily obtd. at a high yield.

Description

[Detailed description of the invention]

[Industrial Application Field] The present invention is used, for example, when forming a recording medium thin film of an optical disk by sputtering. Te, T
The present invention relates to a thin plate-shaped target made of e-alloy or Se-alloy and brazed to a cooling plate. [Prior Art] A sputtering target used for forming a recording medium thin film of an optical disk as described above is a 1532 Te
, Te alloys, and Se alloys cannot be plastically worked due to their brittleness and non-ductility, so melt casting and powder metallurgy methods are used to manufacture this target, thereby The produced thin plate-shaped target is used while being brazed to a cooling plate with a brazing material such as InnIn alloy or Sn+Sn alloy to prevent it from being excessively heated during sputtering. [Problem to be solved by the invention] However, in recent years, there is a need to respond to mass production based on the rapid increase in demand for optical discs, so there is a demand for larger targets.
E-alloys and Se-alloys are originally made of very brittle crystals, and such targets are usually formed into thin plate shapes of 3 to 6 m. In the casting method, the cast target is composed of a very brittle cast structure, so it is difficult to manufacture a target larger than 125 m in diameter. Also by powder metallurgy methods such as hot pressing. It is difficult to manufacture a sintered target exceeding the dimensions of 500 yes However, there is still no shortage of large-scale targets that can meet the above demands. [Findings based on research] In view of this situation, the present inventors have conducted various studies. A relatively small target that is easy to manufacture, that is, a plurality of thin plate-like target elements, is brought into contact or fitted with each other at their opposing side end surfaces.

[In the state of joining, braze to the cooling plate, and abut the side end surfaces that fit together.] If the plane is inclined, bent, or curved with respect to the cooling plate, the components of the brazing material and the cooling plate will not be sputtered during sputtering, that is, these components will not be able to form Te, Te formed by sputtering. It is possible to easily provide a large target for sputtering without contaminating the alloy or Se alloy thin film, and with good yield. I found out. [Means for solving problems]

This invention was invented based on the above-mentioned knowledge, and, like conventional targets, it is a large-sized sputtering device in which only the target is sputtered without causing sputtering to the brazing material and cooling plate attached to the target. Aimed to serve the target. A thin plate-shaped sputtering tough target made of Te, Te alloy, or Se alloy and brazed to a cooling plate, wherein the targets abut or fit at mutually opposing side end surfaces. They are joined together by squeezing each other and placed on a cooling plate. The target element is composed of a plurality of thin plate-like target elements brazed to the cooling plate, and the side end surface of the target element has a plane inclined to the cooling plate, a bent plane, or a bent plane. It is characterized by a curved surface. [Detailed description of the invention] 1. Target material The target of this invention is Te, Te alloy, or S.
Made of e-alloy 0. Among these, Te alloy and Se alloy. As an alloy component, for example, Te + Se, Cu
+ Ag * Au + Zn r Cd * Ga
t In + I7 + Ct Ger Sn *
One or more of Pb + As + Sb + B++ and S is used for 8 nights, especially Teg
It is composed of a Te-Se alloy such as O8e10 or T'e80se20. 2 Target element Target element is a thin plate-like target that is used to form the target of the present invention by joining them together, and can be formed by any method such as conventional melt casting method or powder metallurgy method. If it is too large, the material will be brittle and the number yield (J) will decrease as mentioned above, while if it is too small, a large number of pieces will be required to make a large target. Since this requires time and effort and reduces productivity, the dimensions of this target element should be 1. For example, if it is a square melted casting, the sides should be 50 to 1 Oo, and the sintered material should be In this case, it is best to set the -side to 100 to 300 mm, and the shape is not particularly restricted, but since the target is usually used in a rectangular or circular shape, it is generally rectangular or divided into two. It is preferable that the shape be circular. 2. Shape of the side end faces of the target elements to be joined In the target of the present invention, as shown in FIGS. 2 to 4, the target elements to be joined to each other are
On the side end surface 1a+la of 1, for example, a plane inclined with respect to the sheet-shaped solder 2 and the cooling plate 3 (Fig. 2), a bent plane ((A) and ICF in Fig. 3) 11 and a curved surface (84). ) are formed, and their end faces 1a and la
During sputtering, the brazing filler metal and cooling plate constituent materials may be sputtered from the joints of these target elements, and elements other than the target elements may be mixed in during film formation. This can prevent problems such as Generally, the curved plane shown in FIG. 3 and the curved surface shown in FIG. 4 are formed on the side end surfaces of the target material elements;
Rather than having them fit together. As shown in FIG. 2, it is better to form a plane on the end face that is inclined with respect to the cooling plate and to make these abut against each other.
Although this is preferable because the end face can be easily machined, if the inclined angle θ is too small, there is a risk that the filler metal and the cooling plate component (generally copper or copper alloy) will dissipate from the joint; If θ is too large, such machining becomes difficult due to the brittle nature of the target material. Therefore, it is generally preferable that this angle θ is between lθ and 6 (lj'). The invention will be explained by way of examples and in comparison with comparative examples.
Composition of seiO (numbers are atomic %, same below) and 20
In order to manufacture a large target as shown in the plan view (a) of Fig. 1 by connecting five target elements (W elements) having dimensions of 0rm x 200cm x thickness = 6m, the target element The side end faces of the joints 1 and 1 are processed into flat surfaces 1a and 1a that are inclined at an angle of 30° with respect to the solder 2 and the cooling plate 3, as shown in the partially enlarged sectional view in t) of FIG. Next, these target elements 1 are placed in a state in which the inclined planes are brought into contact with each other, but gaps are partially formed at intervals of 0.1 to 0.2 m based on machining errors of the inclined surfaces. 220n+mX1020+mX
Thickness: On a copper cooling plate (backing plate) 3 having dimensions of 10 mm, a wax 2 having a thickness of 30 μ and having a composition of In70Sn30 was used at a temperature of 140°C in a vacuum.
One inventive target was manufactured by brazing. Furthermore, for comparison, without processing the side end surface of the target element l into an inclined surface, that is, this side end surface 1
A comparison target having the same dimensions as the target of the present invention was manufactured in the same manner as described above, except that a+la was perpendicular to the surface of the cooling plate 3. Next, in order to investigate the characteristics of each target obtained as a result, these targets were subjected to magnetron sputtering with a maximum output of 2.0 W/, a thin film formation rate of 200 persons/in order, and a diameter of 3'00 mm.
Thickness on a polycarbonate substrate with dimensions: 0
．． When a 1 fi 're90selo thin film was formed and the amount of brazing material and cooling plate material (copper) mixed into the thin film was measured, no detectable contaminants were found in the target of the present invention. The comparison target had a non-uniform distribution of contaminants, with an overall content of O,1% of contaminant elements originating from the wax and the cold plate. [Effects of the Invention] From the results of the examples, 1. In the target of the present invention, since the side end face of the joint of the target is formed in the t-plane oblique to the cooling plate, there is no possibility that during sputtering, there will be problems caused by the wax and the cooling plate. In contrast, when the side end faces are simply vertically connected to the comparative target, the contaminant elements are not likely to be sputtered during film formation through the joints of the targets. Recognize. As is clear from the above description, according to the present invention, Te, Te alloy, or Se can be used to form a sputtering layer that is not contaminated by the components constituting the solder and the cooling plate.
Easily handle large alloy targets. In addition, it can be provided at a high yield, which is an industrially compatible effect.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing an example of the target of the present invention, in which (A) is a plan view, FIG. FIGS. 2, 3(a) and 3(b), and FIG. 4 are enlarged partial sectional views showing different aspects of the joint portion of the target of the present invention. In the figure, l ・Target i element, 2... Wax. 3...Cooling plate.

Claims (1)

[Scope of Claim] A thin plate-shaped sputtering target made of Te, Te alloy, or Se alloy and brazed to a cooling plate, wherein the target is in contact with mutually opposing side end surfaces. Consisting of a plurality of thin plate-like target elements connected by contacting or fitting together, placed on a cooling plate and brazed to the cooling plate, and said side end surface of said target element The target is characterized in that the target has a plane that is inclined with respect to the cooling plate, a plane that is bent, or a curved plane.