JPH04231461A - Protector for sputtering target and packaging method - Google Patents
Protector for sputtering target and packaging methodInfo
- Publication number
- JPH04231461A JPH04231461A JP41507590A JP41507590A JPH04231461A JP H04231461 A JPH04231461 A JP H04231461A JP 41507590 A JP41507590 A JP 41507590A JP 41507590 A JP41507590 A JP 41507590A JP H04231461 A JPH04231461 A JP H04231461A
- Authority
- JP
- Japan
- Prior art keywords
- target
- bag
- protector
- sputtering
- backing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001012 protector Effects 0.000 title claims abstract description 21
- 238000005477 sputtering target Methods 0.000 title claims description 12
- 238000000034 method Methods 0.000 title claims description 11
- 238000004806 packaging method and process Methods 0.000 title claims description 7
- 239000013077 target material Substances 0.000 claims abstract description 23
- 238000004544 sputter deposition Methods 0.000 claims abstract description 17
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 230000001681 protective effect Effects 0.000 claims description 15
- 239000007789 gas Substances 0.000 abstract description 13
- 238000012856 packing Methods 0.000 abstract description 13
- 239000000463 material Substances 0.000 abstract description 7
- 239000000428 dust Substances 0.000 abstract description 6
- 239000011261 inert gas Substances 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、スパッタリング装置の
ターゲットの保護具に関し、ターゲットの取扱い時又は
保存時に、ターゲット表面の塵の付着や表面の破損を防
ぐための保護具、およびこの保護具を用いたターゲット
の包装方法に関する。[Field of Industrial Application] The present invention relates to a protector for a target in a sputtering apparatus, and a protector for preventing dust from adhering to the target surface and damage to the target surface during handling or storage of the target, and a protector for preventing the surface from being damaged. Regarding the packaging method of the target used.
【0002】0002
【従来の技術】従来、この種のスパッタリングターゲッ
トの包装方法は、(1)ターゲットを袋状のパッキング
に入れ、パッキング内の気体を排気して減圧するか真空
にし、パッキングを閉じる方法、(2)ターゲットを袋
状のパッキングに入れ、パッキング内の気体を不活性ガ
スで置換しパッキングを閉じる方法、又、(3)密閉容
器を用いてターゲットのスパッタリング面に接触しない
ようにボルト等でターゲットを固定し、真空排気又はガ
ス置換を行う方法が提案されている。BACKGROUND ART Conventionally, methods for packaging sputtering targets of this type include (1) placing the target in a bag-like packing, evacuating the gas in the packing to reduce the pressure or create a vacuum, and closing the packing; ) Place the target in a bag-like packing, replace the gas inside the packing with an inert gas, and close the packing; or (3) Place the target in a sealed container with bolts, etc. to avoid contact with the sputtering surface of the target. Methods have been proposed in which it is fixed and vacuum evacuated or gas replaced.
【0003】0003
【発明が解決しようとしている問題点】前記したように
、従来の袋状のパッキングを用いた方法は、例えば(1
)の方法は、パッキング材料が排気によりターゲットの
表面に密着するので、パッキング材料の表面に付着して
いる異物がターゲットの表面に転写するという欠点があ
り、(2)の方法ではパッキング内でターゲットが移動
した場合、パッキングとターゲットが擦れ、塵等が発生
し、これがターゲット表面に付着するという問題点があ
る。更に、これらのいずれの方法でも、パッキングで覆
われたターゲットのスパッタリング面が堅い物体と接触
するので、ターゲット面に割れ、欠け等の破損を生ずる
恐れがあった。Problems to be Solved by the Invention As mentioned above, the conventional method using bag-shaped packing, for example,
Method (2) has the disadvantage that the packing material is brought into close contact with the surface of the target by exhaust gas, and foreign matter adhering to the surface of the packing material is transferred to the surface of the target. When the packing and target move, there is a problem in that the packing and target rub against each other, generating dust, etc., which adheres to the target surface. Furthermore, in any of these methods, since the sputtering surface of the target covered with packing comes into contact with a hard object, there is a risk that damage such as cracking or chipping may occur on the target surface.
【0004】一方、(3)の方法は、上述の塵等の付着
を防止するための保護容器であるが、この保護容器は、
■ターゲットを固定するためにバッキングプレートにボ
ルト用の穴が必要であり、バッキングプレートの形状が
複雑となること、又、ターゲット使用時の真空シールの
機構上、ボルト用穴が設けられないターゲットに対して
は不適応であること。■構造が複雑であること。■ター
ゲットを完全に収納するためターゲットよりかなり大き
な形状となり、運送や保管に不便であること、等の問題
があり必ずしも好ましいものではない。On the other hand, method (3) uses a protective container to prevent the above-mentioned dust from adhering to it;
■In order to fix the target, holes for bolts are required in the backing plate, which makes the shape of the backing plate complicated, and due to the vacuum seal mechanism when using the target, there are no holes for bolts in the target. be unsuitable for ■The structure is complex. ■Since the target is completely housed, the shape is considerably larger than the target, which is not necessarily desirable because of problems such as inconvenience in transportation and storage.
【0005】[0005]
【問題を解決するための手段】本発明者等は、かかる問
題点を解決するために鋭意検討を行った結果、本発明を
完成するに至った。即ち本発明の第1の発明は、ターゲ
ット材とバッキングプレ−トを重ねた場合、ターゲット
のスパッタリング面から、バッキングプレ−トの周縁部
の少なくとも一部分がはみだした部分を持つ、バッキン
グプレ−トに接着されたターゲット材を被覆する筒状の
保護具で、前記保護具の一方の端部は閉じられており、
他方の開放部は、少なくともターゲット材を内包するに
充分な内径を持ち、且つ前記バッキングプレ−トは内包
できない内径を持スパッタリングターゲット用保護具に
関するものであり、第2の発明は、上記した保護具でタ
ーゲット材を被覆したものを、袋状物に挿入し袋状物を
封ずるか又は袋状物内の気体を排気して封ずることを特
徴とするスパッタリングターゲットの包装方法に関する
ものである。[Means for Solving the Problems] The present inventors have conducted intensive studies to solve the above problems, and as a result, have completed the present invention. That is, the first aspect of the present invention is that when the target material and the backing plate are overlapped, the backing plate has at least a portion of the peripheral edge of the backing plate protruding from the sputtering surface of the target. A cylindrical protector that covers the bonded target material, one end of the protector being closed;
The other open part has an inner diameter sufficient to contain at least the target material, and the backing plate has an inner diameter that cannot contain the target material, and the second invention relates to a sputtering target protector. This invention relates to a sputtering target packaging method characterized by inserting a target material coated with a tool into a bag-like object and sealing the bag-like object, or sealing the bag-like object by evacuating the gas inside the bag-like object. .
【0006】次に本発明を図面に基ずいて更に説明する
。本発明のスパッタリングターゲット用保護具は、図1
に示すように、筒状物(図中4)の一端を封じた形状を
しており、その開放部の端とターゲット材を接着保持し
たバッキングプレートの周縁部の少なくとも一部の表面
(図中2)とが接触するように装着することによってタ
ーゲットのスパッタリング表面は何も接触しない状態で
保護することができる。この保護具の筒状物の形状は限
定されないが、ターゲットの形状に応じて選ぶことが好
ましく、例えば円形ターゲットの場合には円筒形が適し
ている。又、この保護具の内径は少なくともターゲット
材を内包するに充分な、且つ前記バッキングプレ−トは
内包できない内径を持つものである。Next, the present invention will be further explained based on the drawings. The sputtering target protector of the present invention is shown in FIG.
As shown in the figure, it has a shape in which one end of the cylindrical object (4 in the figure) is sealed, and the surface of at least a part of the periphery of the backing plate that adheres and holds the open end and the target material (in the figure) 2) By mounting the sputtering surface so that it is in contact with the sputtering surface of the target, the sputtering surface of the target can be protected from contact with anything. Although the shape of the cylindrical object of this protective equipment is not limited, it is preferably selected depending on the shape of the target. For example, in the case of a circular target, a cylindrical shape is suitable. Further, the inner diameter of this protector is at least sufficient to contain the target material, and the inner diameter is such that the backing plate cannot contain the target material.
【0007】又、必ずしも必要ではないが、後述する包
装方法において内部の気流を妨げないように、筒状物の
任意箇所、例えば側壁部に任意形状の穴(図中5)、溝
等を設けておくことが好ましい。該保護具を用いる際、
ターゲット材およびバッキングプレートには何等加工を
施す必要はなく、通常のターゲットの好ましい使用形態
で良い。又、この保護具の内部の大きさは、ターゲット
材が接触することなく充分に内包可能な大きさである。[0007]Although not necessarily necessary, holes (5 in the figure), grooves, etc. of arbitrary shape may be provided at any location of the cylindrical object, for example, on the side wall, so as not to obstruct the internal airflow in the packaging method described later. It is preferable to keep it. When using the protective equipment,
There is no need to perform any processing on the target material and the backing plate, and a normal target may be used in a preferred manner. Moreover, the internal size of this protector is large enough to accommodate the target material without contacting it.
【0008】次に本発明の包装方法について説明する。
図1に示すように保護具で装着したターゲットを、図2
のように袋状物6に挿入し、内部の気体を排気して、又
は排気せずにこれを封ずる。この際、外圧によって保護
具の固定装着が達成されるが、ゴムバンドや粘着テープ
等の簡易な器具を用いて固定しても良い。又、図3のよ
うに袋状物に保護具で装着したターゲットを挿入し、内
部の気体を特定の気体例えば窒素、アルゴン、ヘリウム
などのターゲット材に対して不活性な気体で置換した後
これを封ずることも可能である。又、前記したように内
部の気体を排気してこれを封ずることもできる。袋状物
の材質は特に制限されないが、軟質の合成樹脂、例えば
ポリ塩化ビニル、ポリエチレン、ポリプロピレンのシ−
ト又はフィルムが好ましい。Next, the packaging method of the present invention will be explained. The target fitted with protective equipment as shown in Figure 1 is shown in Figure 2.
It is inserted into a bag-like object 6 as shown in the figure, and the gas inside is evacuated or sealed without being evacuated. At this time, the protective equipment is fixedly attached by external pressure, but it may also be fixed using a simple device such as a rubber band or adhesive tape. Also, as shown in Figure 3, a target fitted with protective gear is inserted into a bag-like object, and the gas inside is replaced with a specific gas, such as nitrogen, argon, or helium, which is inert to the target material. It is also possible to seal it. Further, as described above, the internal gas can be evacuated and sealed. The material of the bag is not particularly limited, but it may be made of soft synthetic resin such as polyvinyl chloride, polyethylene, or polypropylene.
or a film is preferred.
【0009】次に、本発明の実施態様を例示する。図1
は円形ターゲットに本発明の保護具を装着した例である
。気流通過用の穴5を有する保護具4をターゲット1を
被覆するように装着する。保護具4とターゲット1はバ
ッキングプレート周縁部2を介して接触しターゲットの
スパッタリング面には接触していない状態である。本実
施態様は、保護具4の固定のためゴムバンド3を用いた
例である。このようにして保護具4を装着したターゲッ
トを図2に示すように袋状物6に挿入し、内部の気体を
排気して減圧又は真空にしこれを封ずる。又、上記例と
同様に図1のように保護具4を装着したターゲット1を
、図3に示すように袋状物6に挿入し、内部の気体を排
気して減圧又は真空にし、続いてアルゴンガスを0.5
気圧程度充填した後を封ずる。Next, embodiments of the present invention will be illustrated. Figure 1
This is an example in which the protective equipment of the present invention is attached to a circular target. A protective device 4 having holes 5 for passing airflow is attached to cover the target 1. The protector 4 and the target 1 are in contact with each other via the backing plate peripheral portion 2 and are not in contact with the sputtering surface of the target. This embodiment is an example in which a rubber band 3 is used to secure the protective equipment 4. The target fitted with the protective equipment 4 in this manner is inserted into the bag-like object 6 as shown in FIG. 2, and the gas inside is evacuated to create a reduced pressure or vacuum and the bag-like object 6 is sealed. Similarly to the above example, the target 1 equipped with the protective equipment 4 as shown in FIG. 1 is inserted into the bag-like object 6 as shown in FIG. 0.5 argon gas
After filling to about atmospheric pressure, seal it.
【0010】0010
【発明の効果】本発明を用いることにより、スパッタリ
ングターゲットのスパッタ面への塵の付着および同面の
破損を防止することが簡便に達成され、ターゲットの取
扱いに便利である。Effects of the Invention By using the present invention, it is possible to easily prevent dust from adhering to the sputtering surface of a sputtering target and from damaging the same, and the target is convenient to handle.
【図1】図1は本発明の一実施態様の断面図で、保護具
でターゲット材を被覆した例を示す。FIG. 1 is a cross-sectional view of one embodiment of the present invention, showing an example in which a target material is covered with a protective device.
【図2】図2はスパッタリングターゲットを袋状物に挿
入し封じた例を示す。FIG. 2 shows an example in which a sputtering target is inserted into a bag-like object and sealed.
【図3】図3はスパッタリングターゲットを袋状物に挿
入し封じた例を示す。FIG. 3 shows an example in which a sputtering target is inserted into a bag-like object and sealed.
1:スパッタリングターゲット 2:バッキングプレート周縁部 3:ゴムバンド 4:保護具 5:気流通過用穴 6:袋状物 7:真空または置換ガス充填した空間 1: Sputtering target 2: Backing plate periphery 3: Rubber band 4: Protective equipment 5: Airflow passage hole 6: Bag-like object 7: Space filled with vacuum or replacement gas
Claims (3)
た場合、ターゲットのスパッタリング面から、バッキン
グプレ−トの周縁部の少なくとも一部分がはみだした部
分を持つ、バッキングプレ−トに接着されたターゲット
材を被覆する筒状の保護具で、前記保護具の一方の端部
は閉じられており、他方の開放部は、少なくともターゲ
ット材を内包するに充分な内径を持ち、且つ前記バッキ
ングプレ−トは内包できない内径を持スパッタリングタ
ーゲット用保護具。Claim 1: A target material bonded to a backing plate, wherein when the target material and the backing plate are overlapped, at least a portion of the peripheral edge of the backing plate protrudes from the sputtering surface of the target. A cylindrical protector that covers a target material, one end of the protector is closed, the other open part has an inner diameter sufficient to contain at least the target material, and the backing plate is Protective equipment for sputtering targets with inner diameters that cannot be enclosed.
た場合、ターゲットのスパッタリング面から、バッキン
グプレ−トの周縁部の少なくとも一部分がはみだした部
分を持つ、バッキングプレ−トに接着されたターゲット
材を被覆する筒状の保護具で、前記保護具の一方の端部
は閉じられており、他方の開放部は、少なくともターゲ
ット材を内包するに充分な内径を持ち、且つ前記バッキ
ングプレ−トは内包できない内径を持スパッタリングタ
ーゲット用保護具でターゲット材を被覆したものを、袋
状物に挿入し袋状物を封ずるか又は袋状物内の気体を排
気して封ずることを特徴とするスパッタリングターゲッ
トの包装方法。2. A target material bonded to a backing plate, wherein when the target material and the backing plate are overlapped, at least a portion of the peripheral edge of the backing plate protrudes from the sputtering surface of the target. A cylindrical protector that covers a target material, one end of the protector is closed, the other open part has an inner diameter sufficient to contain at least the target material, and the backing plate is A target material coated with a sputtering target protector having an inner diameter that cannot be contained inside the bag is inserted into a bag-like object and the bag-like object is sealed, or the gas inside the bag-like object is evacuated and sealed. How to package sputtering targets.
袋状物に挿入し、袋状物内をガス置換した後封ずること
を特徴とする請求項2記載の包装方法。Claim 3: A target material covered with protective equipment,
3. The packaging method according to claim 2, further comprising inserting the bag into a bag-like object, replacing the gas inside the bag-like object, and then sealing the bag.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP41507590A JPH04231461A (en) | 1990-12-27 | 1990-12-27 | Protector for sputtering target and packaging method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP41507590A JPH04231461A (en) | 1990-12-27 | 1990-12-27 | Protector for sputtering target and packaging method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04231461A true JPH04231461A (en) | 1992-08-20 |
Family
ID=18523483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP41507590A Pending JPH04231461A (en) | 1990-12-27 | 1990-12-27 | Protector for sputtering target and packaging method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04231461A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998050598A1 (en) * | 1997-05-02 | 1998-11-12 | Intel Corporation | Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor |
US5846389A (en) * | 1997-05-14 | 1998-12-08 | Sony Corporation | Sputtering target protection device |
JP2003089870A (en) * | 2001-09-17 | 2003-03-28 | Lsi Logic Corp | Sputtering method, and cover for sputtering target used for the method |
WO2005037649A1 (en) | 2003-10-15 | 2005-04-28 | Nikko Materials Co., Ltd. | Packaging device and packaging method for hollow cathode type spattering target |
KR20110053192A (en) | 2009-11-13 | 2011-05-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for packaging target material and method for mounting target |
WO2011062003A1 (en) | 2009-11-17 | 2011-05-26 | Jx日鉱日石金属株式会社 | Method for storing lanthanum oxide target, and vacuum-packed lanthanum oxide target |
CN102203314A (en) * | 2008-10-29 | 2011-09-28 | Jx日矿日石金属株式会社 | Method for storing target comprising rare earth metal or oxide thereof |
WO2012117834A1 (en) | 2011-03-01 | 2012-09-07 | Jx日鉱日石金属株式会社 | Method for storing metallic lanthanum target, vacuum-sealed metallic lanthanum target, and thin film formed by sputtering using metallic lanthanum target |
JP2017179464A (en) * | 2016-03-30 | 2017-10-05 | Jx金属株式会社 | Cylindrical sputtering target and packaging method thereof |
US10125419B2 (en) * | 2011-04-21 | 2018-11-13 | View, Inc. | Lithium sputter targets |
JP2019163501A (en) * | 2018-03-19 | 2019-09-26 | Jx金属株式会社 | Spattering target, and its packaging method |
US10615011B2 (en) | 2011-06-30 | 2020-04-07 | View, Inc. | Sputter target and sputtering methods |
JP2022122803A (en) * | 2020-09-18 | 2022-08-23 | 株式会社岩谷技研 | Imaging method for imaging subject |
-
1990
- 1990-12-27 JP JP41507590A patent/JPH04231461A/en active Pending
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6030514A (en) * | 1997-05-02 | 2000-02-29 | Sony Corporation | Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor |
JP2002511115A (en) * | 1997-05-02 | 2002-04-09 | マテリアル リサーチ コーポレーション | Method for minimizing particles generated during sputtering by shortening time required for sputtering burn-in, and target assembly used at this time |
JP2010189768A (en) * | 1997-05-02 | 2010-09-02 | Materials Research Corp | Method of reducing sputtering burn-in time and minimizing sputtered particulate, and target assembly used thereupon |
WO1998050598A1 (en) * | 1997-05-02 | 1998-11-12 | Intel Corporation | Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor |
US5846389A (en) * | 1997-05-14 | 1998-12-08 | Sony Corporation | Sputtering target protection device |
JP2003089870A (en) * | 2001-09-17 | 2003-03-28 | Lsi Logic Corp | Sputtering method, and cover for sputtering target used for the method |
WO2005037649A1 (en) | 2003-10-15 | 2005-04-28 | Nikko Materials Co., Ltd. | Packaging device and packaging method for hollow cathode type spattering target |
KR100795308B1 (en) * | 2003-10-15 | 2008-01-15 | 닛코킨조쿠 가부시키가이샤 | Packaging device and packaging method of hollow cathode type sputtering target |
CN100436267C (en) * | 2003-10-15 | 2008-11-26 | 日矿金属株式会社 | Packaging device and packaging method for hollow cathode type spattering target |
CN102203314A (en) * | 2008-10-29 | 2011-09-28 | Jx日矿日石金属株式会社 | Method for storing target comprising rare earth metal or oxide thereof |
KR20110053192A (en) | 2009-11-13 | 2011-05-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Method for packaging target material and method for mounting target |
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