JPH04231461A - Protector for sputtering target and packaging method - Google Patents

Protector for sputtering target and packaging method

Info

Publication number
JPH04231461A
JPH04231461A JP41507590A JP41507590A JPH04231461A JP H04231461 A JPH04231461 A JP H04231461A JP 41507590 A JP41507590 A JP 41507590A JP 41507590 A JP41507590 A JP 41507590A JP H04231461 A JPH04231461 A JP H04231461A
Authority
JP
Japan
Prior art keywords
target
protector
bag
sputtering
shaped material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP41507590A
Inventor
Koichi Hanawa
Hiroaki Hidaka
Shinji Sekine
Hiroshi Tanaka
Original Assignee
Tosoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tosoh Corp filed Critical Tosoh Corp
Priority to JP41507590A priority Critical patent/JPH04231461A/en
Publication of JPH04231461A publication Critical patent/JPH04231461A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To prevent the adhesion of dust on the sputtering surface of a target and the damage of the sputtering surface by coating the target for sputtering with a cylindrical protector having a specific structure, then inserting the target into a bag-shaped material and hermetically sealing the bag-shaped material.
CONSTITUTION: The target 1 for sputtering is covered with the protector 4 consisting of a cylindrical packing plate opened at one end at the time of handling or preserving the above-mentioned target 1. The cylindrical protector 4 is so mounted that its open end and at least a part of the surface of the peripheral edge 2 of the protector 4 bonded and held by the target material 1 come into contact with each other. The target 1 is then fixed by a rubber band 3 in such a manner that the sputtering surface thereof maintains a contactless state. This target is inserted into the bag-shaped material 6 and the gas therein is evacuated to a reduced pressure or to a vacuum and the bag-shaped material is sealed, or a low pressure inert gas such as Ar is sealed after evacuating. The sputtering surface of the target 1 is prevented from being stained by the dust and form being damaged by the contact of the protector 4.
COPYRIGHT: (C)1992,JPO&Japio
JP41507590A 1990-12-27 1990-12-27 Protector for sputtering target and packaging method Pending JPH04231461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP41507590A JPH04231461A (en) 1990-12-27 1990-12-27 Protector for sputtering target and packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP41507590A JPH04231461A (en) 1990-12-27 1990-12-27 Protector for sputtering target and packaging method

Publications (1)

Publication Number Publication Date
JPH04231461A true JPH04231461A (en) 1992-08-20

Family

ID=18523483

Family Applications (1)

Application Number Title Priority Date Filing Date
JP41507590A Pending JPH04231461A (en) 1990-12-27 1990-12-27 Protector for sputtering target and packaging method

Country Status (1)

Country Link
JP (1) JPH04231461A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998050598A1 (en) * 1997-05-02 1998-11-12 Intel Corporation Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor
US5846389A (en) * 1997-05-14 1998-12-08 Sony Corporation Sputtering target protection device
JP2003089870A (en) * 2001-09-17 2003-03-28 Lsi Logic Corp Sputtering method, and cover for sputtering target used for the method
WO2005037649A1 (en) 2003-10-15 2005-04-28 Nikko Materials Co., Ltd. Packaging device and packaging method for hollow cathode type spattering target
WO2011062003A1 (en) 2009-11-17 2011-05-26 Jx日鉱日石金属株式会社 Method for storing lanthanum oxide target, and vacuum-packed lanthanum oxide target
JP2011122241A (en) * 2009-11-13 2011-06-23 Semiconductor Energy Lab Co Ltd Method for packaging target material and method for mounting target
WO2012117834A1 (en) 2011-03-01 2012-09-07 Jx日鉱日石金属株式会社 Method for storing metallic lanthanum target, vacuum-sealed metallic lanthanum target, and thin film formed by sputtering using metallic lanthanum target
JP2017179464A (en) * 2016-03-30 2017-10-05 Jx金属株式会社 Cylindrical sputtering target and packaging method thereof
US10125419B2 (en) * 2011-04-21 2018-11-13 View, Inc. Lithium sputter targets

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002511115A (en) * 1997-05-02 2002-04-09 インテル コーポレーション The method of suppressing and reducing the time required for burn-in sputtering particles generated during sputtering to a minimum, and target assembly for use in this case
JP2010189768A (en) * 1997-05-02 2010-09-02 Intel Corp Method of reducing sputtering burn-in time and minimizing sputtered particulate, and target assembly used thereupon
US6030514A (en) * 1997-05-02 2000-02-29 Sony Corporation Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor
WO1998050598A1 (en) * 1997-05-02 1998-11-12 Intel Corporation Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor
US5846389A (en) * 1997-05-14 1998-12-08 Sony Corporation Sputtering target protection device
JP2003089870A (en) * 2001-09-17 2003-03-28 Lsi Logic Corp Sputtering method, and cover for sputtering target used for the method
WO2005037649A1 (en) 2003-10-15 2005-04-28 Nikko Materials Co., Ltd. Packaging device and packaging method for hollow cathode type spattering target
KR100795308B1 (en) * 2003-10-15 2008-01-15 닛코킨조쿠 가부시키가이샤 Packaging device and packaging method of hollow cathode type sputtering target
JP2011122241A (en) * 2009-11-13 2011-06-23 Semiconductor Energy Lab Co Ltd Method for packaging target material and method for mounting target
WO2011062003A1 (en) 2009-11-17 2011-05-26 Jx日鉱日石金属株式会社 Method for storing lanthanum oxide target, and vacuum-packed lanthanum oxide target
US8911600B2 (en) 2009-11-17 2014-12-16 Jx Nippon Mining & Metals Corporation Method of storing lanthanum oxide target, and vacuum-sealed lanthanum oxide target
WO2012117834A1 (en) 2011-03-01 2012-09-07 Jx日鉱日石金属株式会社 Method for storing metallic lanthanum target, vacuum-sealed metallic lanthanum target, and thin film formed by sputtering using metallic lanthanum target
US10125419B2 (en) * 2011-04-21 2018-11-13 View, Inc. Lithium sputter targets
JP2017179464A (en) * 2016-03-30 2017-10-05 Jx金属株式会社 Cylindrical sputtering target and packaging method thereof

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