JP2014525516A5 - - Google Patents
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- Publication number
- JP2014525516A5 JP2014525516A5 JP2014528522A JP2014528522A JP2014525516A5 JP 2014525516 A5 JP2014525516 A5 JP 2014525516A5 JP 2014528522 A JP2014528522 A JP 2014528522A JP 2014528522 A JP2014528522 A JP 2014528522A JP 2014525516 A5 JP2014525516 A5 JP 2014525516A5
- Authority
- JP
- Japan
- Prior art keywords
- target
- coupled
- cooling ring
- cap
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 17
- 239000003507 refrigerant Substances 0.000 claims description 17
- 238000005240 physical vapour deposition Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229910000906 Bronze Inorganic materials 0.000 claims description 3
- 239000010974 bronze Substances 0.000 claims description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000004544 sputter deposition Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 4
- 239000002994 raw material Substances 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161530922P | 2011-09-02 | 2011-09-02 | |
| US61/530,922 | 2011-09-02 | ||
| US13/584,972 | 2012-08-14 | ||
| US13/584,972 US9096927B2 (en) | 2011-09-02 | 2012-08-14 | Cooling ring for physical vapor deposition chamber target |
| PCT/US2012/052680 WO2013033102A1 (en) | 2011-09-02 | 2012-08-28 | Cooling ring for physical vapor deposition chamber target |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017082646A Division JP2017133111A (ja) | 2011-09-02 | 2017-04-19 | 物理気相堆積チャンバターゲット用の冷却リング |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014525516A JP2014525516A (ja) | 2014-09-29 |
| JP2014525516A5 true JP2014525516A5 (enExample) | 2015-09-10 |
Family
ID=47752280
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014528522A Pending JP2014525516A (ja) | 2011-09-02 | 2012-08-28 | 物理気相堆積チャンバターゲット用の冷却リング |
| JP2017082646A Pending JP2017133111A (ja) | 2011-09-02 | 2017-04-19 | 物理気相堆積チャンバターゲット用の冷却リング |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017082646A Pending JP2017133111A (ja) | 2011-09-02 | 2017-04-19 | 物理気相堆積チャンバターゲット用の冷却リング |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9096927B2 (enExample) |
| JP (2) | JP2014525516A (enExample) |
| KR (2) | KR20190108179A (enExample) |
| CN (1) | CN103764869B (enExample) |
| TW (1) | TWI557251B (enExample) |
| WO (1) | WO2013033102A1 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140147593A1 (en) * | 2012-11-27 | 2014-05-29 | Intermolecular, Inc. | Liquid Cooled Sputter Apertured Shields |
| US20150354054A1 (en) * | 2014-06-06 | 2015-12-10 | Applied Materials, Inc. | Cooled process tool adapter for use in substrate processing chambers |
| US10546733B2 (en) * | 2014-12-31 | 2020-01-28 | Applied Materials, Inc. | One-piece process kit shield |
| US10662529B2 (en) * | 2016-01-05 | 2020-05-26 | Applied Materials, Inc. | Cooled gas feed block with baffle and nozzle for HDP-CVD |
| US10471542B1 (en) * | 2017-06-27 | 2019-11-12 | United States Of America As Represented By The Administrator Of Nasa | Cladding and freeform deposition for coolant channel closeout |
| US11189472B2 (en) | 2017-07-17 | 2021-11-30 | Applied Materials, Inc. | Cathode assembly having a dual position magnetron and centrally fed coolant |
| US10513432B2 (en) | 2017-07-31 | 2019-12-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Anti-stiction process for MEMS device |
| KR102598114B1 (ko) * | 2019-02-05 | 2023-11-02 | 어플라이드 머티어리얼스, 인코포레이티드 | 증착 장치 및 증착 장치를 모니터링하기 위한 방법 |
| US11492697B2 (en) | 2020-06-22 | 2022-11-08 | Applied Materials, Inc. | Apparatus for improved anode-cathode ratio for rf chambers |
| CN215636446U (zh) | 2021-08-26 | 2022-01-25 | 威海电美世光机电有限公司 | 一种ak干燥区间的轴承供水结构 |
| US11948784B2 (en) | 2021-10-21 | 2024-04-02 | Applied Materials, Inc. | Tilted PVD source with rotating pedestal |
| US12195843B2 (en) | 2023-01-19 | 2025-01-14 | Applied Materials, Inc. | Multicathode PVD system for high aspect ratio barrier seed deposition |
| US12417903B2 (en) | 2023-02-16 | 2025-09-16 | Applied Materials, Inc. | Physical vapor deposition source and chamber assembly |
| US12191234B2 (en) * | 2023-05-17 | 2025-01-07 | Adeia Semiconductor Bonding Technologies Inc. | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same |
| US12283490B1 (en) | 2023-12-21 | 2025-04-22 | Adeia Semiconductor Bonding Technologies Inc. | Integrated cooling assemblies for advanced device packaging and methods of manufacturing the same |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4060470A (en) * | 1974-12-06 | 1977-11-29 | Clarke Peter J | Sputtering apparatus and method |
| DE3069702D1 (en) * | 1980-08-08 | 1985-01-10 | Battelle Development Corp | Apparatus for coating substrates by high-rate cathodic sputtering, as well as sputtering cathode for such apparatus |
| JPH02285069A (ja) * | 1989-04-25 | 1990-11-22 | Tokyo Electron Ltd | スパッタ装置 |
| JPH02301558A (ja) * | 1989-05-15 | 1990-12-13 | Tokyo Electron Ltd | スパッタ装置 |
| JP2746695B2 (ja) * | 1989-10-20 | 1998-05-06 | 東京エレクトロン株式会社 | スパッタ装置及びスパッタ方法 |
| US6689254B1 (en) | 1990-10-31 | 2004-02-10 | Tokyo Electron Limited | Sputtering apparatus with isolated coolant and sputtering target therefor |
| JP3036895B2 (ja) * | 1991-05-28 | 2000-04-24 | 東京エレクトロン株式会社 | スパッタ装置 |
| US5267607A (en) * | 1991-05-28 | 1993-12-07 | Tokyo Electron Limited | Substrate processing apparatus |
| JPH06172988A (ja) * | 1992-12-01 | 1994-06-21 | Nissin Electric Co Ltd | スパッタターゲットのバッキングプレート |
| US5487822A (en) * | 1993-11-24 | 1996-01-30 | Applied Materials, Inc. | Integrated sputtering target assembly |
| US6039848A (en) | 1995-07-10 | 2000-03-21 | Cvc Products, Inc. | Ultra-high vacuum apparatus and method for high productivity physical vapor deposition. |
| WO1997003221A1 (en) * | 1995-07-10 | 1997-01-30 | Cvc Products, Inc. | Magnetron cathode apparatus and method for sputtering |
| JPH10287975A (ja) | 1997-04-16 | 1998-10-27 | Sony Corp | スパッタリング装置及びスパッタリング装置用バッキングプレート |
| US5953827A (en) | 1997-11-05 | 1999-09-21 | Applied Materials, Inc. | Magnetron with cooling system for process chamber of processing system |
| US6117245A (en) * | 1998-04-08 | 2000-09-12 | Applied Materials, Inc. | Method and apparatus for controlling cooling and heating fluids for a gas distribution plate |
| JP4435896B2 (ja) * | 1999-03-17 | 2010-03-24 | キヤノンアネルバ株式会社 | 高周波スパッタリング装置及び薄膜作成方法 |
| US6228236B1 (en) | 1999-10-22 | 2001-05-08 | Applied Materials, Inc. | Sputter magnetron having two rotation diameters |
| US6641701B1 (en) * | 2000-06-14 | 2003-11-04 | Applied Materials, Inc. | Cooling system for magnetron sputtering apparatus |
| TW200300951A (en) * | 2001-12-10 | 2003-06-16 | Tokyo Electron Ltd | Method and device for removing harmonics in semiconductor plasma processing systems |
| JP4563760B2 (ja) * | 2004-09-24 | 2010-10-13 | 株式会社日立国際電気 | 半導体製造装置及び半導体装置の製造方法 |
| JP4957992B2 (ja) * | 2006-12-26 | 2012-06-20 | 株式会社Ｊｖｃケンウッド | マグネトロンスパッタリング装置及びそれを用いた成膜方法 |
| JP5427572B2 (ja) * | 2009-12-01 | 2014-02-26 | 昭和電工株式会社 | マグネトロンスパッタ装置、インライン式成膜装置、磁気記録媒体の製造方法 |
-
2012
- 2012-08-14 US US13/584,972 patent/US9096927B2/en active Active
- 2012-08-20 TW TW101130140A patent/TWI557251B/zh active
- 2012-08-28 KR KR1020197026543A patent/KR20190108179A/ko not_active Ceased
- 2012-08-28 KR KR1020147008661A patent/KR20140057376A/ko not_active Ceased
- 2012-08-28 WO PCT/US2012/052680 patent/WO2013033102A1/en not_active Ceased
- 2012-08-28 CN CN201280042073.6A patent/CN103764869B/zh active Active
- 2012-08-28 JP JP2014528522A patent/JP2014525516A/ja active Pending
-
2017
- 2017-04-19 JP JP2017082646A patent/JP2017133111A/ja active Pending
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