JP2013500395A5 - - Google Patents
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- JP2013500395A5 JP2013500395A5 JP2012522097A JP2012522097A JP2013500395A5 JP 2013500395 A5 JP2013500395 A5 JP 2013500395A5 JP 2012522097 A JP2012522097 A JP 2012522097A JP 2012522097 A JP2012522097 A JP 2012522097A JP 2013500395 A5 JP2013500395 A5 JP 2013500395A5
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- JP
- Japan
- Prior art keywords
- composition according
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- choh
- composition
- additive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 claims 15
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000000654 additive Substances 0.000 claims 4
- 230000000996 additive effect Effects 0.000 claims 4
- 125000002947 alkylene group Chemical group 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 150000002772 monosaccharides Chemical class 0.000 claims 4
- 150000005846 sugar alcohols Polymers 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims 1
- YPZMPEPLWKRVLD-PJEQPVAWSA-N D-Glycero-D-gulo-Heptose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)[C@@H](O)C=O YPZMPEPLWKRVLD-PJEQPVAWSA-N 0.000 claims 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 claims 1
- WQZGKKKJIJFFOK-WHZQZERISA-N D-aldose Chemical compound OC[C@H]1OC(O)[C@@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-WHZQZERISA-N 0.000 claims 1
- WQZGKKKJIJFFOK-IVMDWMLBSA-N D-allopyranose Chemical compound OC[C@H]1OC(O)[C@H](O)[C@H](O)[C@@H]1O WQZGKKKJIJFFOK-IVMDWMLBSA-N 0.000 claims 1
- LKDRXBCSQODPBY-JDJSBBGDSA-N D-allulose Chemical compound OCC1(O)OC[C@@H](O)[C@@H](O)[C@H]1O LKDRXBCSQODPBY-JDJSBBGDSA-N 0.000 claims 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims 1
- HSNZZMHEPUFJNZ-QMTIVRBISA-N D-keto-manno-heptulose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)C(=O)CO HSNZZMHEPUFJNZ-QMTIVRBISA-N 0.000 claims 1
- WQZGKKKJIJFFOK-QTVWNMPRSA-N D-mannopyranose Chemical compound OC[C@H]1OC(O)[C@@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-QTVWNMPRSA-N 0.000 claims 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 1
- 229930091371 Fructose Natural products 0.000 claims 1
- 239000005715 Fructose Substances 0.000 claims 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 claims 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims 1
- SQUHHTBVTRBESD-UHFFFAOYSA-N Hexa-Ac-myo-Inositol Natural products CC(=O)OC1C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C1OC(C)=O SQUHHTBVTRBESD-UHFFFAOYSA-N 0.000 claims 1
- 208000007976 Ketosis Diseases 0.000 claims 1
- LKDRXBCSQODPBY-AMVSKUEXSA-N L-(-)-Sorbose Chemical compound OCC1(O)OC[C@H](O)[C@@H](O)[C@@H]1O LKDRXBCSQODPBY-AMVSKUEXSA-N 0.000 claims 1
- WQZGKKKJIJFFOK-VSOAQEOCSA-N L-altropyranose Chemical compound OC[C@@H]1OC(O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-VSOAQEOCSA-N 0.000 claims 1
- 229930195725 Mannitol Natural products 0.000 claims 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 1
- JVWLUVNSQYXYBE-UHFFFAOYSA-N Ribitol Natural products OCC(C)C(O)C(O)CO JVWLUVNSQYXYBE-UHFFFAOYSA-N 0.000 claims 1
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims 1
- 150000001323 aldoses Chemical group 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- WQZGKKKJIJFFOK-PHYPRBDBSA-N alpha-D-galactose Chemical compound OC[C@H]1O[C@H](O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-PHYPRBDBSA-N 0.000 claims 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 229930182830 galactose Natural products 0.000 claims 1
- 239000008103 glucose Substances 0.000 claims 1
- -1 growth Chemical class 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 125000002951 idosyl group Chemical class C1([C@@H](O)[C@H](O)[C@@H](O)[C@H](O1)CO)* 0.000 claims 1
- CDAISMWEOUEBRE-GPIVLXJGSA-N inositol Chemical compound O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@H](O)[C@@H]1O CDAISMWEOUEBRE-GPIVLXJGSA-N 0.000 claims 1
- 229960000367 inositol Drugs 0.000 claims 1
- BJHIKXHVCXFQLS-PQLUHFTBSA-N keto-D-tagatose Chemical compound OC[C@@H](O)[C@H](O)[C@H](O)C(=O)CO BJHIKXHVCXFQLS-PQLUHFTBSA-N 0.000 claims 1
- 150000002584 ketoses Chemical class 0.000 claims 1
- 239000000594 mannitol Substances 0.000 claims 1
- 235000010355 mannitol Nutrition 0.000 claims 1
- 150000002700 mannoheptoses Chemical class 0.000 claims 1
- 125000005702 oxyalkylene group Chemical group 0.000 claims 1
- 229920005604 random copolymer Polymers 0.000 claims 1
- HEBKCHPVOIAQTA-ZXFHETKHSA-N ribitol Chemical compound OC[C@H](O)[C@H](O)[C@H](O)CO HEBKCHPVOIAQTA-ZXFHETKHSA-N 0.000 claims 1
- CDAISMWEOUEBRE-UHFFFAOYSA-N scyllo-inosotol Natural products OC1C(O)C(O)C(O)C(O)C1O CDAISMWEOUEBRE-UHFFFAOYSA-N 0.000 claims 1
- 239000000600 sorbitol Substances 0.000 claims 1
- 235000010356 sorbitol Nutrition 0.000 claims 1
- 239000000811 xylitol Substances 0.000 claims 1
- 235000010447 xylitol Nutrition 0.000 claims 1
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims 1
- 229960002675 xylitol Drugs 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22980909P | 2009-07-30 | 2009-07-30 | |
| US61/229,809 | 2009-07-30 | ||
| PCT/EP2010/060375 WO2011012475A1 (en) | 2009-07-30 | 2010-07-19 | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015132392A Division JP6117284B2 (ja) | 2009-07-30 | 2015-07-01 | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013500395A JP2013500395A (ja) | 2013-01-07 |
| JP2013500395A5 true JP2013500395A5 (https=) | 2013-09-05 |
| JP5775077B2 JP5775077B2 (ja) | 2015-09-09 |
Family
ID=42733749
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012522097A Active JP5775077B2 (ja) | 2009-07-30 | 2010-07-19 | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
| JP2015132392A Active JP6117284B2 (ja) | 2009-07-30 | 2015-07-01 | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015132392A Active JP6117284B2 (ja) | 2009-07-30 | 2015-07-01 | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9617647B2 (https=) |
| EP (1) | EP2459779B1 (https=) |
| JP (2) | JP5775077B2 (https=) |
| KR (1) | KR101738708B1 (https=) |
| CN (1) | CN102471910B (https=) |
| IL (1) | IL217234A (https=) |
| MY (1) | MY160150A (https=) |
| RU (1) | RU2539895C2 (https=) |
| SG (2) | SG177418A1 (https=) |
| TW (1) | TWI515341B (https=) |
| WO (1) | WO2011012475A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2655457B1 (en) | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| CN103547631B (zh) | 2011-06-01 | 2016-07-06 | 巴斯夫欧洲公司 | 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物 |
| EP2530102A1 (en) | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| US20130133243A1 (en) | 2011-06-28 | 2013-05-30 | Basf Se | Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants |
| RU2015121797A (ru) | 2012-11-09 | 2017-01-10 | Басф Се | Композиция для электролитического осаждения металла, содержащая выравнивающий агент |
| ES2681836T3 (es) | 2015-09-10 | 2018-09-17 | Atotech Deutschland Gmbh | Composición de baño para chapado de cobre |
| US11926918B2 (en) * | 2016-12-20 | 2024-03-12 | Basf Se | Composition for metal plating comprising suppressing agent for void free filing |
| CN107604414B (zh) * | 2017-08-22 | 2020-03-24 | 珠海市奥美伦精细化工有限公司 | 一种铝及铝合金阳极氧化高温无镍封闭剂 |
| US11387108B2 (en) | 2017-09-04 | 2022-07-12 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP3714085B1 (en) * | 2017-11-20 | 2023-08-09 | Basf Se | Composition for cobalt electroplating comprising leveling agent |
| ES2881029T3 (es) * | 2018-01-09 | 2021-11-26 | Atotech Deutschland Gmbh | Aditivo de ureileno, su uso y un método para su preparación |
| CN114450438A (zh) | 2019-09-27 | 2022-05-06 | 巴斯夫欧洲公司 | 用于铜凸块电沉积的包含流平剂的组合物 |
| EP4034696A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| JP2023520530A (ja) | 2020-04-03 | 2023-05-17 | ビーエーエスエフ ソシエタス・ヨーロピア | ポリアミノアミド型レベリング剤を含む銅バンプ電着用組成物 |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| EP4179132B1 (en) | 2020-07-13 | 2024-09-25 | Basf Se | Composition for copper electroplating on a cobalt seed |
| KR20240070557A (ko) | 2021-10-01 | 2024-05-21 | 바스프 에스이 | 폴리아미노아미드 타입 레벨링제를 포함하는 구리 전착용 조성물 |
| US20250388725A1 (en) | 2022-07-07 | 2025-12-25 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| WO2024132828A1 (en) | 2022-12-19 | 2024-06-27 | Basf Se | A composition for copper nanotwin electrodeposition |
| CN121693598A (zh) | 2023-08-03 | 2026-03-17 | 巴斯夫欧洲公司 | 用于在金属晶种上进行铜电镀的组合物 |
| JP7787368B1 (ja) * | 2024-06-25 | 2025-12-16 | Ykk株式会社 | 硫酸銅めっき液 |
| WO2026003954A1 (ja) * | 2024-06-25 | 2026-01-02 | Ykk株式会社 | 硫酸銅めっき液 |
| WO2026037751A1 (en) | 2024-08-16 | 2026-02-19 | Basf Se | Composition for metal electroplating comprising an additive for defect-free filling of features on electronic substrates |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB602591A (en) | 1945-02-12 | 1948-05-31 | Du Pont | Improvements in or relating to the electro-deposition of metals |
| GB1221688A (en) * | 1968-03-09 | 1971-02-03 | Geigy Uk Ltd | Tin electroplating bath and process |
| GB2064585B (en) * | 1979-11-19 | 1983-11-09 | Enthone | Acid zinc electro plating solutions and methods utilizing ethoxylated/propoxylated polyhydric alcohols |
| US4505839A (en) | 1981-05-18 | 1985-03-19 | Petrolite Corporation | Polyalkanolamines |
| SU1035097A1 (ru) * | 1981-07-20 | 1983-08-15 | Днепропетровский Ордена Трудового Красного Знамени Государственный Университет Им.300-Летия Воссоединения Украины С Россией | Электролит меднени |
| US4430490A (en) * | 1982-08-10 | 1984-02-07 | Ppg Industries, Inc. | Polyether polyols and their method of preparation |
| JPS59182986A (ja) * | 1983-04-01 | 1984-10-17 | Keigo Obata | スズ、鉛及びすず−鉛合金メツキ浴 |
| JPS62182295A (ja) * | 1985-08-07 | 1987-08-10 | Daiwa Tokushu Kk | 銅メツキ浴組成物 |
| DE4003243A1 (de) | 1990-02-03 | 1991-08-08 | Basf Ag | Verwendung von trialkanolaminpolyethern als demulgatoren von oel-in-wasser-emulsionen |
| JPH0641581A (ja) * | 1992-07-23 | 1994-02-15 | Seiko Epson Corp | コンタクトレンズ用親水性洗浄剤 |
| JP3244866B2 (ja) * | 1993-05-25 | 2002-01-07 | 株式会社大和化成研究所 | すず−鉛合金めっき浴 |
| US6682642B2 (en) | 2000-10-13 | 2004-01-27 | Shipley Company, L.L.C. | Seed repair and electroplating bath |
| US6776893B1 (en) | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
| EP1422320A1 (en) * | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Copper electroplating bath |
| KR100692159B1 (ko) * | 2002-12-03 | 2007-03-12 | 아사히 가세이 가부시키가이샤 | 산화구리 초미립자 |
| US20050133376A1 (en) * | 2003-12-19 | 2005-06-23 | Opaskar Vincent C. | Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom |
| US20050199507A1 (en) * | 2004-03-09 | 2005-09-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical structures and compositions of ECP additives to reduce pit defects |
| EP1819848A1 (en) * | 2004-11-29 | 2007-08-22 | Technic, Incorporated | Near neutral ph tin electroplating solution |
| US20060213780A1 (en) | 2005-03-24 | 2006-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electroplating composition and method |
| RU2282682C1 (ru) * | 2005-04-28 | 2006-08-27 | Российский химико-технологический университет им. Д.И. Менделеева | Электролит и способ меднения |
| US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
| JP2008266722A (ja) * | 2007-04-20 | 2008-11-06 | Ebara Udylite Kk | パルス銅めっき浴用添加剤およびこれを用いたパルス銅めっき浴 |
| SG10201404394QA (en) * | 2009-07-30 | 2014-10-30 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filing |
-
2010
- 2010-07-19 RU RU2012107130/02A patent/RU2539895C2/ru not_active IP Right Cessation
- 2010-07-19 MY MYPI2012000018A patent/MY160150A/en unknown
- 2010-07-19 CN CN201080033648.9A patent/CN102471910B/zh active Active
- 2010-07-19 SG SG2011097185A patent/SG177418A1/en unknown
- 2010-07-19 JP JP2012522097A patent/JP5775077B2/ja active Active
- 2010-07-19 KR KR1020127001758A patent/KR101738708B1/ko active Active
- 2010-07-19 WO PCT/EP2010/060375 patent/WO2011012475A1/en not_active Ceased
- 2010-07-19 US US13/384,732 patent/US9617647B2/en active Active
- 2010-07-19 SG SG10201404301WA patent/SG10201404301WA/en unknown
- 2010-07-19 EP EP10734120.8A patent/EP2459779B1/en active Active
- 2010-07-30 TW TW099125505A patent/TWI515341B/zh active
-
2011
- 2011-12-27 IL IL217234A patent/IL217234A/en active IP Right Grant
-
2015
- 2015-07-01 JP JP2015132392A patent/JP6117284B2/ja active Active
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