JP2013500395A5 - - Google Patents
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- JP2013500395A5 JP2013500395A5 JP2012522097A JP2012522097A JP2013500395A5 JP 2013500395 A5 JP2013500395 A5 JP 2013500395A5 JP 2012522097 A JP2012522097 A JP 2012522097A JP 2012522097 A JP2012522097 A JP 2012522097A JP 2013500395 A5 JP2013500395 A5 JP 2013500395A5
- Authority
- JP
- Japan
- Prior art keywords
- composition according
- support
- choh
- composition
- additive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000203 mixture Substances 0.000 claims 15
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- 239000000654 additive Substances 0.000 claims 4
- 230000000996 additive effect Effects 0.000 claims 4
- 125000002947 alkylene group Chemical group 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 150000002772 monosaccharides Chemical class 0.000 claims 4
- 150000005846 sugar alcohols Polymers 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- HEBKCHPVOIAQTA-UHFFFAOYSA-N meso ribitol Natural products OCC(O)C(O)C(O)CO HEBKCHPVOIAQTA-UHFFFAOYSA-N 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 claims 1
- YPZMPEPLWKRVLD-PJEQPVAWSA-N D-Glycero-D-gulo-Heptose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)[C@@H](O)C=O YPZMPEPLWKRVLD-PJEQPVAWSA-N 0.000 claims 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 claims 1
- WQZGKKKJIJFFOK-WHZQZERISA-N D-aldose Chemical compound OC[C@H]1OC(O)[C@@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-WHZQZERISA-N 0.000 claims 1
- WQZGKKKJIJFFOK-IVMDWMLBSA-N D-allopyranose Chemical compound OC[C@H]1OC(O)[C@H](O)[C@H](O)[C@@H]1O WQZGKKKJIJFFOK-IVMDWMLBSA-N 0.000 claims 1
- LKDRXBCSQODPBY-JDJSBBGDSA-N D-allulose Chemical compound OCC1(O)OC[C@@H](O)[C@@H](O)[C@H]1O LKDRXBCSQODPBY-JDJSBBGDSA-N 0.000 claims 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 claims 1
- HSNZZMHEPUFJNZ-QMTIVRBISA-N D-keto-manno-heptulose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)C(=O)CO HSNZZMHEPUFJNZ-QMTIVRBISA-N 0.000 claims 1
- WQZGKKKJIJFFOK-QTVWNMPRSA-N D-mannopyranose Chemical compound OC[C@H]1OC(O)[C@@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-QTVWNMPRSA-N 0.000 claims 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims 1
- 229930091371 Fructose Natural products 0.000 claims 1
- 239000005715 Fructose Substances 0.000 claims 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 claims 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims 1
- SQUHHTBVTRBESD-UHFFFAOYSA-N Hexa-Ac-myo-Inositol Natural products CC(=O)OC1C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C(OC(C)=O)C1OC(C)=O SQUHHTBVTRBESD-UHFFFAOYSA-N 0.000 claims 1
- 208000007976 Ketosis Diseases 0.000 claims 1
- LKDRXBCSQODPBY-AMVSKUEXSA-N L-(-)-Sorbose Chemical compound OCC1(O)OC[C@H](O)[C@@H](O)[C@@H]1O LKDRXBCSQODPBY-AMVSKUEXSA-N 0.000 claims 1
- WQZGKKKJIJFFOK-VSOAQEOCSA-N L-altropyranose Chemical compound OC[C@@H]1OC(O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-VSOAQEOCSA-N 0.000 claims 1
- 229930195725 Mannitol Natural products 0.000 claims 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims 1
- JVWLUVNSQYXYBE-UHFFFAOYSA-N Ribitol Natural products OCC(C)C(O)C(O)CO JVWLUVNSQYXYBE-UHFFFAOYSA-N 0.000 claims 1
- TVXBFESIOXBWNM-UHFFFAOYSA-N Xylitol Natural products OCCC(O)C(O)C(O)CCO TVXBFESIOXBWNM-UHFFFAOYSA-N 0.000 claims 1
- 150000001323 aldoses Chemical group 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- WQZGKKKJIJFFOK-PHYPRBDBSA-N alpha-D-galactose Chemical compound OC[C@H]1O[C@H](O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-PHYPRBDBSA-N 0.000 claims 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 125000004122 cyclic group Chemical group 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 229930182830 galactose Natural products 0.000 claims 1
- 239000008103 glucose Substances 0.000 claims 1
- -1 growth Chemical class 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 125000002951 idosyl group Chemical class C1([C@@H](O)[C@H](O)[C@@H](O)[C@H](O1)CO)* 0.000 claims 1
- CDAISMWEOUEBRE-GPIVLXJGSA-N inositol Chemical compound O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@H](O)[C@@H]1O CDAISMWEOUEBRE-GPIVLXJGSA-N 0.000 claims 1
- 229960000367 inositol Drugs 0.000 claims 1
- BJHIKXHVCXFQLS-PQLUHFTBSA-N keto-D-tagatose Chemical compound OC[C@@H](O)[C@H](O)[C@H](O)C(=O)CO BJHIKXHVCXFQLS-PQLUHFTBSA-N 0.000 claims 1
- 150000002584 ketoses Chemical class 0.000 claims 1
- 239000000594 mannitol Substances 0.000 claims 1
- 235000010355 mannitol Nutrition 0.000 claims 1
- 150000002700 mannoheptoses Chemical class 0.000 claims 1
- 125000005702 oxyalkylene group Chemical group 0.000 claims 1
- 229920005604 random copolymer Polymers 0.000 claims 1
- HEBKCHPVOIAQTA-ZXFHETKHSA-N ribitol Chemical compound OC[C@H](O)[C@H](O)[C@H](O)CO HEBKCHPVOIAQTA-ZXFHETKHSA-N 0.000 claims 1
- CDAISMWEOUEBRE-UHFFFAOYSA-N scyllo-inosotol Natural products OC1C(O)C(O)C(O)C(O)C1O CDAISMWEOUEBRE-UHFFFAOYSA-N 0.000 claims 1
- 239000000600 sorbitol Substances 0.000 claims 1
- 235000010356 sorbitol Nutrition 0.000 claims 1
- 239000000811 xylitol Substances 0.000 claims 1
- 235000010447 xylitol Nutrition 0.000 claims 1
- HEBKCHPVOIAQTA-SCDXWVJYSA-N xylitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)CO HEBKCHPVOIAQTA-SCDXWVJYSA-N 0.000 claims 1
- 229960002675 xylitol Drugs 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22980909P | 2009-07-30 | 2009-07-30 | |
| US61/229,809 | 2009-07-30 | ||
| PCT/EP2010/060375 WO2011012475A1 (en) | 2009-07-30 | 2010-07-19 | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015132392A Division JP6117284B2 (ja) | 2009-07-30 | 2015-07-01 | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013500395A JP2013500395A (ja) | 2013-01-07 |
| JP2013500395A5 true JP2013500395A5 (https=) | 2013-09-05 |
| JP5775077B2 JP5775077B2 (ja) | 2015-09-09 |
Family
ID=42733749
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012522097A Active JP5775077B2 (ja) | 2009-07-30 | 2010-07-19 | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
| JP2015132392A Active JP6117284B2 (ja) | 2009-07-30 | 2015-07-01 | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015132392A Active JP6117284B2 (ja) | 2009-07-30 | 2015-07-01 | 無ボイドでのサブミクロン構造物充填用の、抑制剤を含有する金属メッキ組成物 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9617647B2 (https=) |
| EP (1) | EP2459779B1 (https=) |
| JP (2) | JP5775077B2 (https=) |
| KR (1) | KR101738708B1 (https=) |
| CN (1) | CN102471910B (https=) |
| IL (1) | IL217234A (https=) |
| MY (1) | MY160150A (https=) |
| RU (1) | RU2539895C2 (https=) |
| SG (2) | SG10201404301WA (https=) |
| TW (1) | TWI515341B (https=) |
| WO (1) | WO2011012475A1 (https=) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY170653A (en) | 2010-12-21 | 2019-08-23 | Basf Se | Composition for metal electroplating comprising leveling agent |
| US9631292B2 (en) | 2011-06-01 | 2017-04-25 | Basf Se | Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features |
| EP2530102A1 (en) | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| US20130133243A1 (en) | 2011-06-28 | 2013-05-30 | Basf Se | Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants |
| MY172822A (en) | 2012-11-09 | 2019-12-12 | Basf Se | Composition for metal electroplating comprising leveling agent |
| ES2681836T3 (es) * | 2015-09-10 | 2018-09-17 | Atotech Deutschland Gmbh | Composición de baño para chapado de cobre |
| CN110100048B (zh) * | 2016-12-20 | 2022-06-21 | 巴斯夫欧洲公司 | 包含用于无空隙填充的抑制试剂的用于金属电镀的组合物 |
| CN107604414B (zh) * | 2017-08-22 | 2020-03-24 | 珠海市奥美伦精细化工有限公司 | 一种铝及铝合金阳极氧化高温无镍封闭剂 |
| KR102641595B1 (ko) | 2017-09-04 | 2024-02-27 | 바스프 에스이 | 평탄화 제제를 포함하는 금속 전기 도금용 조성물 |
| CN111344438B (zh) * | 2017-11-20 | 2025-06-06 | 巴斯夫欧洲公司 | 用于电镀钴的包含流平剂的组合物 |
| ES2881029T3 (es) * | 2018-01-09 | 2021-11-26 | Atotech Deutschland Gmbh | Aditivo de ureileno, su uso y un método para su preparación |
| EP4034696A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| WO2021058336A1 (en) | 2019-09-27 | 2021-04-01 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| KR20220164496A (ko) | 2020-04-03 | 2022-12-13 | 바스프 에스이 | 폴리아미노아미드 유형 레벨링제를 포함하는 구리 범프 전착용 조성물 |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| CN115720598A (zh) | 2020-07-13 | 2023-02-28 | 巴斯夫欧洲公司 | 用于在钴晶种上电镀铜的组合物 |
| KR20240070557A (ko) | 2021-10-01 | 2024-05-21 | 바스프 에스이 | 폴리아미노아미드 타입 레벨링제를 포함하는 구리 전착용 조성물 |
| US20250388725A1 (en) | 2022-07-07 | 2025-12-25 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| CN120457244A (zh) | 2022-12-19 | 2025-08-08 | 巴斯夫欧洲公司 | 用于铜纳米孪晶电沉积的组合物 |
| WO2025026863A1 (en) | 2023-08-03 | 2025-02-06 | Basf Se | Composition for copper electroplating on a metal seed |
| JP7787368B1 (ja) * | 2024-06-25 | 2025-12-16 | Ykk株式会社 | 硫酸銅めっき液 |
| WO2026003954A1 (ja) * | 2024-06-25 | 2026-01-02 | Ykk株式会社 | 硫酸銅めっき液 |
| WO2026037751A1 (en) | 2024-08-16 | 2026-02-19 | Basf Se | Composition for metal electroplating comprising an additive for defect-free filling of features on electronic substrates |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB602591A (en) | 1945-02-12 | 1948-05-31 | Du Pont | Improvements in or relating to the electro-deposition of metals |
| GB1221688A (en) * | 1968-03-09 | 1971-02-03 | Geigy Uk Ltd | Tin electroplating bath and process |
| GB2064585B (en) * | 1979-11-19 | 1983-11-09 | Enthone | Acid zinc electro plating solutions and methods utilizing ethoxylated/propoxylated polyhydric alcohols |
| US4505839A (en) | 1981-05-18 | 1985-03-19 | Petrolite Corporation | Polyalkanolamines |
| SU1035097A1 (ru) * | 1981-07-20 | 1983-08-15 | Днепропетровский Ордена Трудового Красного Знамени Государственный Университет Им.300-Летия Воссоединения Украины С Россией | Электролит меднени |
| US4430490A (en) * | 1982-08-10 | 1984-02-07 | Ppg Industries, Inc. | Polyether polyols and their method of preparation |
| JPS59182986A (ja) * | 1983-04-01 | 1984-10-17 | Keigo Obata | スズ、鉛及びすず−鉛合金メツキ浴 |
| JPS62182295A (ja) * | 1985-08-07 | 1987-08-10 | Daiwa Tokushu Kk | 銅メツキ浴組成物 |
| DE4003243A1 (de) | 1990-02-03 | 1991-08-08 | Basf Ag | Verwendung von trialkanolaminpolyethern als demulgatoren von oel-in-wasser-emulsionen |
| JPH0641581A (ja) * | 1992-07-23 | 1994-02-15 | Seiko Epson Corp | コンタクトレンズ用親水性洗浄剤 |
| JP3244866B2 (ja) * | 1993-05-25 | 2002-01-07 | 株式会社大和化成研究所 | すず−鉛合金めっき浴 |
| EP1197587B1 (en) | 2000-10-13 | 2006-09-20 | Shipley Co. L.L.C. | Seed layer repair and electroplating bath |
| US6776893B1 (en) * | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
| EP1422320A1 (en) * | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Copper electroplating bath |
| WO2004050559A1 (ja) | 2002-12-03 | 2004-06-17 | Asahi Kasei Kabushiki Kaisha | 酸化銅超微粒子 |
| US20050133376A1 (en) * | 2003-12-19 | 2005-06-23 | Opaskar Vincent C. | Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom |
| US20050199507A1 (en) * | 2004-03-09 | 2005-09-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical structures and compositions of ECP additives to reduce pit defects |
| EP1819848A1 (en) | 2004-11-29 | 2007-08-22 | Technic, Incorporated | Near neutral ph tin electroplating solution |
| US20060213780A1 (en) | 2005-03-24 | 2006-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electroplating composition and method |
| RU2282682C1 (ru) * | 2005-04-28 | 2006-08-27 | Российский химико-технологический университет им. Д.И. Менделеева | Электролит и способ меднения |
| US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
| JP2008266722A (ja) * | 2007-04-20 | 2008-11-06 | Ebara Udylite Kk | パルス銅めっき浴用添加剤およびこれを用いたパルス銅めっき浴 |
| MY157126A (en) * | 2009-07-30 | 2016-05-13 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
-
2010
- 2010-07-19 JP JP2012522097A patent/JP5775077B2/ja active Active
- 2010-07-19 WO PCT/EP2010/060375 patent/WO2011012475A1/en not_active Ceased
- 2010-07-19 US US13/384,732 patent/US9617647B2/en active Active
- 2010-07-19 SG SG10201404301WA patent/SG10201404301WA/en unknown
- 2010-07-19 EP EP10734120.8A patent/EP2459779B1/en active Active
- 2010-07-19 SG SG2011097185A patent/SG177418A1/en unknown
- 2010-07-19 MY MYPI2012000018A patent/MY160150A/en unknown
- 2010-07-19 CN CN201080033648.9A patent/CN102471910B/zh active Active
- 2010-07-19 KR KR1020127001758A patent/KR101738708B1/ko active Active
- 2010-07-19 RU RU2012107130/02A patent/RU2539895C2/ru not_active IP Right Cessation
- 2010-07-30 TW TW099125505A patent/TWI515341B/zh active
-
2011
- 2011-12-27 IL IL217234A patent/IL217234A/en active IP Right Grant
-
2015
- 2015-07-01 JP JP2015132392A patent/JP6117284B2/ja active Active
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