JP2013214739A5 - - Google Patents
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- Publication number
- JP2013214739A5 JP2013214739A5 JP2013053218A JP2013053218A JP2013214739A5 JP 2013214739 A5 JP2013214739 A5 JP 2013214739A5 JP 2013053218 A JP2013053218 A JP 2013053218A JP 2013053218 A JP2013053218 A JP 2013053218A JP 2013214739 A5 JP2013214739 A5 JP 2013214739A5
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- plate
- lowered
- plates
- lowering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH00453/12 | 2012-03-30 | ||
| CH00453/12A CH706280B1 (de) | 2012-03-30 | 2012-03-30 | Verfahren zum Ablösen eines Halbleiterchips von einer Folie. |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013214739A JP2013214739A (ja) | 2013-10-17 |
| JP2013214739A5 true JP2013214739A5 (cg-RX-API-DMAC7.html) | 2016-04-07 |
| JP6128459B2 JP6128459B2 (ja) | 2017-05-17 |
Family
ID=49154876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013053218A Active JP6128459B2 (ja) | 2012-03-30 | 2013-03-15 | 金属箔から半導体チップを剥離する方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9039867B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6128459B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102084792B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN103367136B (cg-RX-API-DMAC7.html) |
| CH (1) | CH706280B1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE102013103100B4 (cg-RX-API-DMAC7.html) |
| FR (1) | FR2988902B1 (cg-RX-API-DMAC7.html) |
| MY (1) | MY164119A (cg-RX-API-DMAC7.html) |
| SG (1) | SG193709A1 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI569338B (cg-RX-API-DMAC7.html) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH707236B1 (de) | 2012-11-23 | 2016-10-31 | Besi Switzerland Ag | Verfahren zum Ablösen von Halbleiterchips von einer Folie. |
| JP5717910B1 (ja) * | 2014-02-26 | 2015-05-13 | 株式会社新川 | 半導体ダイのピックアップ装置及びピックアップ方法 |
| SG10201403372SA (en) * | 2014-06-18 | 2016-01-28 | Mfg Integration Technology Ltd | System and method for peeling a semiconductor chip from a tape using a multistage ejector |
| JP6797569B2 (ja) * | 2016-06-13 | 2020-12-09 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
| TWI648213B (zh) * | 2017-11-30 | 2019-01-21 | 景碩科技股份有限公司 | 撕箔機構 |
| JP2019169516A (ja) * | 2018-03-22 | 2019-10-03 | 東芝メモリ株式会社 | 半導体装置の突き上げ装置及び突き上げ方法 |
| CN109192681B (zh) * | 2018-09-01 | 2022-05-31 | 佛山市美特智能科技有限公司 | 芯片的快速柔性制造系统 |
| JP7217605B2 (ja) * | 2018-09-21 | 2023-02-03 | ファスフォードテクノロジ株式会社 | 半導体製造装置、突上げ治具および半導体装置の製造方法 |
| CH715447B1 (de) | 2018-10-15 | 2022-01-14 | Besi Switzerland Ag | Chip-Auswerfer. |
| DE102018125682B4 (de) * | 2018-10-16 | 2023-01-19 | Asm Assembly Systems Gmbh & Co. Kg | Ejektorvorrichtung sowie Verfahren zum Unterstützen eines Ablösens eines auf einer Haltefolie angeordneten elektrischen Bauteils |
| KR102656718B1 (ko) * | 2018-11-05 | 2024-04-12 | 세메스 주식회사 | 다이 이젝팅 장치 |
| JP7274902B2 (ja) * | 2019-03-25 | 2023-05-17 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
| KR102020034B1 (ko) * | 2019-07-09 | 2019-09-10 | (주)삼정오토메이션 | 적층세라믹콘덴서 취출 방법 |
| KR102177863B1 (ko) * | 2020-08-07 | 2020-11-11 | 변영기 | 칩 필름 단계적 박리장치 |
| JP7039675B2 (ja) * | 2020-11-18 | 2022-03-22 | ファスフォードテクノロジ株式会社 | 半導体製造装置および半導体装置の製造方法 |
| US11764098B2 (en) * | 2021-04-16 | 2023-09-19 | Asmpt Singapore Pte. Ltd. | Detaching a die from an adhesive tape by air ejection |
| JP7645768B2 (ja) * | 2021-10-26 | 2025-03-14 | 三菱電機株式会社 | 半導体製造装置および半導体装置の製造方法 |
| US12444625B2 (en) | 2021-12-08 | 2025-10-14 | Samsung Electronics Co., Ltd. | Chip peeling apparatus and chip peeling method using the same |
| JP7787014B2 (ja) | 2022-05-11 | 2025-12-16 | 三星電子株式会社 | チップ剥離装置及びチップ剥離方法 |
| CN119176305A (zh) * | 2023-06-21 | 2024-12-24 | 纬创资通(重庆)有限公司 | 除膜设备与揭膜机构 |
| KR102819732B1 (ko) | 2023-11-28 | 2025-06-16 | 한국생산기술연구원 | 반도체 제조 공정에서의 다이 이젝팅 방법 및 장치 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3976541B2 (ja) | 2001-10-23 | 2007-09-19 | 富士通株式会社 | 半導体チップの剥離方法及び装置 |
| JP4574251B2 (ja) * | 2003-09-17 | 2010-11-04 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| CH697213A5 (de) * | 2004-05-19 | 2008-06-25 | Alphasem Ag | Verfahren und Vorrichtung zum Ablösen eines auf eine flexible Folie geklebten Bauteils. |
| JP4735829B2 (ja) * | 2005-12-06 | 2011-07-27 | 澁谷工業株式会社 | チップ突き上げ装置 |
| US7665204B2 (en) * | 2006-10-16 | 2010-02-23 | Asm Assembly Automation Ltd. | Die detachment apparatus comprising pre-peeling structure |
| JP4693805B2 (ja) * | 2007-03-16 | 2011-06-01 | 株式会社東芝 | 半導体装置の製造装置及び製造方法 |
| TWI463580B (zh) | 2007-06-19 | 2014-12-01 | 瑞薩科技股份有限公司 | Manufacturing method of semiconductor integrated circuit device |
| JP4864816B2 (ja) * | 2007-06-19 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
| MY150953A (en) * | 2008-11-05 | 2014-03-31 | Esec Ag | Die-ejector |
| US8141612B2 (en) * | 2009-04-02 | 2012-03-27 | Asm Assembly Automation Ltd | Device for thin die detachment and pick-up |
| US8092645B2 (en) | 2010-02-05 | 2012-01-10 | Asm Assembly Automation Ltd | Control and monitoring system for thin die detachment and pick-up |
| JP2011216529A (ja) * | 2010-03-31 | 2011-10-27 | Furukawa Electric Co Ltd:The | 半導体装置の製造方法 |
| CH707236B1 (de) * | 2012-11-23 | 2016-10-31 | Besi Switzerland Ag | Verfahren zum Ablösen von Halbleiterchips von einer Folie. |
-
2012
- 2012-03-30 CH CH00453/12A patent/CH706280B1/de not_active IP Right Cessation
-
2013
- 2013-02-26 SG SG2013014311A patent/SG193709A1/en unknown
- 2013-02-28 FR FR1351764A patent/FR2988902B1/fr not_active Expired - Fee Related
- 2013-03-15 JP JP2013053218A patent/JP6128459B2/ja active Active
- 2013-03-15 US US13/839,586 patent/US9039867B2/en active Active
- 2013-03-22 CN CN201310113448.XA patent/CN103367136B/zh active Active
- 2013-03-22 MY MYPI2013001000A patent/MY164119A/en unknown
- 2013-03-26 KR KR1020130032134A patent/KR102084792B1/ko active Active
- 2013-03-26 DE DE102013103100.5A patent/DE102013103100B4/de not_active Expired - Fee Related
- 2013-03-28 TW TW102111159A patent/TWI569338B/zh active
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