JP2013211566A5 - - Google Patents
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- Publication number
- JP2013211566A5 JP2013211566A5 JP2013098574A JP2013098574A JP2013211566A5 JP 2013211566 A5 JP2013211566 A5 JP 2013211566A5 JP 2013098574 A JP2013098574 A JP 2013098574A JP 2013098574 A JP2013098574 A JP 2013098574A JP 2013211566 A5 JP2013211566 A5 JP 2013211566A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grains
- polishing
- mass
- content
- wavelength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 61
- 239000006061 abrasive grain Substances 0.000 claims 52
- 239000007788 liquid Substances 0.000 claims 48
- 229910052751 metal Inorganic materials 0.000 claims 32
- 239000002184 metal Substances 0.000 claims 32
- 239000006185 dispersion Substances 0.000 claims 30
- 239000002002 slurry Substances 0.000 claims 24
- 238000002835 absorbance Methods 0.000 claims 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 13
- 238000002834 transmittance Methods 0.000 claims 12
- 239000000654 additive Substances 0.000 claims 11
- 239000003513 alkali Substances 0.000 claims 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 6
- 150000003839 salts Chemical class 0.000 claims 6
- 230000000996 additive effect Effects 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 4
- 229910052684 Cerium Inorganic materials 0.000 claims 4
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 4
- 239000011163 secondary particle Substances 0.000 claims 4
- 229910021529 ammonia Inorganic materials 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013098574A JP5831495B2 (ja) | 2010-11-22 | 2013-05-08 | スラリー及びその製造方法、研磨液セット、研磨液及びその製造方法、並びに、基板の研磨方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010260036 | 2010-11-22 | ||
| JP2010260036 | 2010-11-22 | ||
| JP2013098574A JP5831495B2 (ja) | 2010-11-22 | 2013-05-08 | スラリー及びその製造方法、研磨液セット、研磨液及びその製造方法、並びに、基板の研磨方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012545748A Division JP5590144B2 (ja) | 2010-11-22 | 2011-11-21 | スラリー、研磨液セット、研磨液、及び、基板の研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013211566A JP2013211566A (ja) | 2013-10-10 |
| JP2013211566A5 true JP2013211566A5 (https=) | 2015-05-21 |
| JP5831495B2 JP5831495B2 (ja) | 2015-12-09 |
Family
ID=46145883
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012545748A Active JP5590144B2 (ja) | 2010-11-22 | 2011-11-21 | スラリー、研磨液セット、研磨液、及び、基板の研磨方法 |
| JP2013098578A Withdrawn JP2013211567A (ja) | 2010-11-22 | 2013-05-08 | スラリー、研磨液セット、研磨液、基板の研磨方法及び基板 |
| JP2013098580A Withdrawn JP2013211568A (ja) | 2010-11-22 | 2013-05-08 | スラリー、研磨液セット、研磨液、基板の研磨方法及び基板 |
| JP2013098574A Active JP5831495B2 (ja) | 2010-11-22 | 2013-05-08 | スラリー及びその製造方法、研磨液セット、研磨液及びその製造方法、並びに、基板の研磨方法 |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012545748A Active JP5590144B2 (ja) | 2010-11-22 | 2011-11-21 | スラリー、研磨液セット、研磨液、及び、基板の研磨方法 |
| JP2013098578A Withdrawn JP2013211567A (ja) | 2010-11-22 | 2013-05-08 | スラリー、研磨液セット、研磨液、基板の研磨方法及び基板 |
| JP2013098580A Withdrawn JP2013211568A (ja) | 2010-11-22 | 2013-05-08 | スラリー、研磨液セット、研磨液、基板の研磨方法及び基板 |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US9988573B2 (https=) |
| JP (4) | JP5590144B2 (https=) |
| KR (4) | KR101886895B1 (https=) |
| CN (4) | CN103222035B (https=) |
| SG (1) | SG190054A1 (https=) |
| TW (4) | TW201323591A (https=) |
| WO (1) | WO2012070541A1 (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5582187B2 (ja) | 2010-03-12 | 2014-09-03 | 日立化成株式会社 | スラリ、研磨液セット、研磨液及びこれらを用いた基板の研磨方法 |
| US9988573B2 (en) * | 2010-11-22 | 2018-06-05 | Hitachi Chemical Company, Ltd. | Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate |
| KR101886892B1 (ko) | 2010-11-22 | 2018-08-08 | 히타치가세이가부시끼가이샤 | 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판 |
| JP6044629B2 (ja) | 2012-02-21 | 2016-12-14 | 日立化成株式会社 | 研磨剤、研磨剤セット及び基体の研磨方法 |
| SG10201606827RA (en) | 2012-02-21 | 2016-10-28 | Hitachi Chemical Co Ltd | Polishing agent, polishing agent set, and substrate polishing method |
| KR102034330B1 (ko) * | 2012-05-22 | 2019-10-18 | 히타치가세이가부시끼가이샤 | 슬러리, 연마액 세트, 연마액, 기체의 연마 방법 및 기체 |
| JP5943073B2 (ja) | 2012-05-22 | 2016-06-29 | 日立化成株式会社 | スラリー、研磨液セット、研磨液及び基体の研磨方法 |
| JP5987905B2 (ja) * | 2012-05-22 | 2016-09-07 | 日立化成株式会社 | 砥粒の製造方法、スラリーの製造方法及び研磨液の製造方法 |
| US10557059B2 (en) | 2012-05-22 | 2020-02-11 | Hitachi Chemical Company, Ltd. | Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrate |
| JP5943072B2 (ja) | 2012-05-22 | 2016-06-29 | 日立化成株式会社 | スラリー、研磨液セット、研磨液及び基体の研磨方法 |
| CN104321403A (zh) * | 2012-05-22 | 2015-01-28 | 日立化成株式会社 | 磨粒、悬浮液、研磨液及这些的制造方法 |
| WO2014034358A1 (ja) | 2012-08-30 | 2014-03-06 | 日立化成株式会社 | 研磨剤、研磨剤セット及び基体の研磨方法 |
| KR102225154B1 (ko) | 2013-06-12 | 2021-03-09 | 쇼와덴코머티리얼즈가부시끼가이샤 | Cmp용 연마액 및 연마 방법 |
| JP6428625B2 (ja) * | 2013-08-30 | 2018-11-28 | 日立化成株式会社 | スラリー、研磨液セット、研磨液、及び、基体の研磨方法 |
| SG11201600902WA (en) | 2013-09-10 | 2016-03-30 | Hitachi Chemical Co Ltd | Slurry, polishing-liquid set, polishing liquid, method for polishing substrate, and substrate |
| US10030172B2 (en) | 2013-12-26 | 2018-07-24 | Hitachi Chemical Company, Ltd. | Abrasive, abrasive set, and method for polishing substrate |
| JP6720975B2 (ja) * | 2015-09-09 | 2020-07-08 | 日立化成株式会社 | 研磨液、研磨液セット及び基体の研磨方法 |
| JP6708994B2 (ja) | 2017-03-27 | 2020-06-10 | 日立化成株式会社 | スラリ及び研磨方法 |
| WO2018179061A1 (ja) | 2017-03-27 | 2018-10-04 | 日立化成株式会社 | 研磨液、研磨液セット及び研磨方法 |
| WO2019043819A1 (ja) | 2017-08-30 | 2019-03-07 | 日立化成株式会社 | スラリ及び研磨方法 |
| WO2019181016A1 (ja) | 2018-03-22 | 2019-09-26 | 日立化成株式会社 | 研磨液、研磨液セット及び研磨方法 |
| WO2020021680A1 (ja) * | 2018-07-26 | 2020-01-30 | 日立化成株式会社 | スラリ及び研磨方法 |
| WO2020065723A1 (ja) | 2018-09-25 | 2020-04-02 | 日立化成株式会社 | スラリ及び研磨方法 |
| KR102484573B1 (ko) * | 2020-08-31 | 2023-01-05 | 솔브레인 주식회사 | 산화 세륨 입자, 이를 포함하는 화학적 기계적 연마 슬러리 조성물 및 반도체 소자의 제조 방법 |
| WO2022102019A1 (ja) | 2020-11-11 | 2022-05-19 | 昭和電工マテリアルズ株式会社 | 研磨液及び研磨方法 |
| US20230128096A1 (en) | 2020-11-11 | 2023-04-27 | Showa Denko Materials Co., Ltd. | Polishing liquid and polishing method |
| CN112680111B (zh) * | 2020-12-24 | 2022-07-08 | 安徽中飞科技有限公司 | 一种玻璃用抛光液及其应用 |
| KR102620964B1 (ko) | 2021-07-08 | 2024-01-03 | 에스케이엔펄스 주식회사 | 반도체 공정용 연마 조성물 및 이를 이용한 연마된 물품의 제조방법 |
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| CN104178088B (zh) * | 2008-04-23 | 2016-08-17 | 日立化成株式会社 | 研磨剂及使用该研磨剂的基板研磨方法 |
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| JP5648567B2 (ja) | 2010-05-07 | 2015-01-07 | 日立化成株式会社 | Ｃｍｐ用研磨液及びこれを用いた研磨方法 |
| KR101886892B1 (ko) | 2010-11-22 | 2018-08-08 | 히타치가세이가부시끼가이샤 | 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판 |
| US9988573B2 (en) | 2010-11-22 | 2018-06-05 | Hitachi Chemical Company, Ltd. | Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate |
| CN102408836A (zh) | 2011-10-20 | 2012-04-11 | 天津理工大学 | 一种用于氧化钛薄膜化学机械平坦化的纳米抛光液及应用 |
| KR102034330B1 (ko) * | 2012-05-22 | 2019-10-18 | 히타치가세이가부시끼가이샤 | 슬러리, 연마액 세트, 연마액, 기체의 연마 방법 및 기체 |
| JP5943073B2 (ja) * | 2012-05-22 | 2016-06-29 | 日立化成株式会社 | スラリー、研磨液セット、研磨液及び基体の研磨方法 |
| JP6428625B2 (ja) * | 2013-08-30 | 2018-11-28 | 日立化成株式会社 | スラリー、研磨液セット、研磨液、及び、基体の研磨方法 |
-
2011
- 2011-11-21 US US13/582,969 patent/US9988573B2/en active Active
- 2011-11-21 CN CN201180055796.5A patent/CN103222035B/zh active Active
- 2011-11-21 KR KR1020137017128A patent/KR101886895B1/ko active Active
- 2011-11-21 KR KR1020137017129A patent/KR20130129396A/ko not_active Withdrawn
- 2011-11-21 KR KR1020137012271A patent/KR101476943B1/ko active Active
- 2011-11-21 CN CN201310335499.7A patent/CN103497732B/zh active Active
- 2011-11-21 JP JP2012545748A patent/JP5590144B2/ja active Active
- 2011-11-21 KR KR1020137017130A patent/KR20130129397A/ko not_active Withdrawn
- 2011-11-21 SG SG2013032834A patent/SG190054A1/en unknown
- 2011-11-21 CN CN201310335599.XA patent/CN103500706A/zh active Pending
- 2011-11-21 CN CN201310335723.2A patent/CN103497733B/zh active Active
- 2011-11-21 WO PCT/JP2011/076822 patent/WO2012070541A1/ja not_active Ceased
- 2011-11-22 TW TW102107716A patent/TW201323591A/zh unknown
- 2011-11-22 TW TW100142634A patent/TWI434919B/zh active
- 2011-11-22 TW TW102107719A patent/TWI510606B/zh active
- 2011-11-22 TW TW102107717A patent/TW201323592A/zh unknown
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2013
- 2013-01-31 US US13/755,127 patent/US20130244431A1/en not_active Abandoned
- 2013-01-31 US US13/755,075 patent/US20130143404A1/en not_active Abandoned
- 2013-01-31 US US13/754,958 patent/US20130130501A1/en not_active Abandoned
- 2013-05-08 JP JP2013098578A patent/JP2013211567A/ja not_active Withdrawn
- 2013-05-08 JP JP2013098580A patent/JP2013211568A/ja not_active Withdrawn
- 2013-05-08 JP JP2013098574A patent/JP5831495B2/ja active Active
-
2018
- 2018-05-04 US US15/970,953 patent/US20180251680A1/en not_active Abandoned
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