SG190054A1 - Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate - Google Patents

Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate Download PDF

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Publication number
SG190054A1
SG190054A1 SG2013032834A SG2013032834A SG190054A1 SG 190054 A1 SG190054 A1 SG 190054A1 SG 2013032834 A SG2013032834 A SG 2013032834A SG 2013032834 A SG2013032834 A SG 2013032834A SG 190054 A1 SG190054 A1 SG 190054A1
Authority
SG
Singapore
Prior art keywords
polishing
abrasive grains
mass
polished
polishing liquid
Prior art date
Application number
SG2013032834A
Other languages
English (en)
Inventor
Tomohiro Iwano
Takenori Narita
Daisuke Ryuzaki
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of SG190054A1 publication Critical patent/SG190054A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/12—Etching, surface-brightening or pickling compositions containing heavy metal salts in an amount of at least 50% of the non-solvent components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
SG2013032834A 2010-11-22 2011-11-21 Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate SG190054A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010260036 2010-11-22
PCT/JP2011/076822 WO2012070541A1 (ja) 2010-11-22 2011-11-21 スラリー、研磨液セット、研磨液、基板の研磨方法及び基板

Publications (1)

Publication Number Publication Date
SG190054A1 true SG190054A1 (en) 2013-06-28

Family

ID=46145883

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2013032834A SG190054A1 (en) 2010-11-22 2011-11-21 Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate

Country Status (7)

Country Link
US (5) US9988573B2 (https=)
JP (4) JP5590144B2 (https=)
KR (4) KR101886895B1 (https=)
CN (4) CN103222035B (https=)
SG (1) SG190054A1 (https=)
TW (4) TW201323591A (https=)
WO (1) WO2012070541A1 (https=)

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US9988573B2 (en) * 2010-11-22 2018-06-05 Hitachi Chemical Company, Ltd. Slurry, polishing liquid set, polishing liquid, method for polishing substrate, and substrate
KR101886892B1 (ko) 2010-11-22 2018-08-08 히타치가세이가부시끼가이샤 슬러리, 연마액 세트, 연마액, 기판의 연마 방법 및 기판
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Also Published As

Publication number Publication date
WO2012070541A1 (ja) 2012-05-31
JP2013211567A (ja) 2013-10-10
JP2013211568A (ja) 2013-10-10
TWI510606B (zh) 2015-12-01
CN103497733B (zh) 2016-11-23
CN103222035A (zh) 2013-07-24
US20130130501A1 (en) 2013-05-23
CN103500706A (zh) 2014-01-08
CN103222035B (zh) 2016-09-21
TW201226546A (en) 2012-07-01
TW201323592A (zh) 2013-06-16
KR20130129397A (ko) 2013-11-28
TWI434919B (zh) 2014-04-21
TW201323593A (zh) 2013-06-16
US20120329370A1 (en) 2012-12-27
JP5831495B2 (ja) 2015-12-09
JP5590144B2 (ja) 2014-09-17
KR20130129395A (ko) 2013-11-28
US20180251680A1 (en) 2018-09-06
TW201323591A (zh) 2013-06-16
CN103497732A (zh) 2014-01-08
US20130244431A1 (en) 2013-09-19
KR101886895B1 (ko) 2018-08-08
CN103497732B (zh) 2016-08-10
KR20130133188A (ko) 2013-12-06
KR20130129396A (ko) 2013-11-28
JPWO2012070541A1 (ja) 2014-05-19
CN103497733A (zh) 2014-01-08
KR101476943B1 (ko) 2014-12-24
US20130143404A1 (en) 2013-06-06
JP2013211566A (ja) 2013-10-10
US9988573B2 (en) 2018-06-05

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