JP2013153068A - 配線基板、発光装置及び配線基板の製造方法 - Google Patents

配線基板、発光装置及び配線基板の製造方法 Download PDF

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Publication number
JP2013153068A
JP2013153068A JP2012013242A JP2012013242A JP2013153068A JP 2013153068 A JP2013153068 A JP 2013153068A JP 2012013242 A JP2012013242 A JP 2012013242A JP 2012013242 A JP2012013242 A JP 2012013242A JP 2013153068 A JP2013153068 A JP 2013153068A
Authority
JP
Japan
Prior art keywords
layer
main surface
reflective layer
light emitting
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012013242A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013153068A5 (https=
Inventor
Shigeji Muramatsu
茂次 村松
Hiroshi Shimizu
浩 清水
Kazuki Kobayashi
和貴 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2012013242A priority Critical patent/JP2013153068A/ja
Priority to EP15153328.8A priority patent/EP2882267A3/en
Priority to CN2013100277645A priority patent/CN103227272A/zh
Priority to EP13152504.0A priority patent/EP2621253B1/en
Priority to US13/749,096 priority patent/US9029891B2/en
Publication of JP2013153068A publication Critical patent/JP2013153068A/ja
Publication of JP2013153068A5 publication Critical patent/JP2013153068A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2012013242A 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法 Pending JP2013153068A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012013242A JP2013153068A (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法
EP15153328.8A EP2882267A3 (en) 2012-01-25 2013-01-24 Wiring substrate, light emitting device, and manufacturing method of wiring substrate
CN2013100277645A CN103227272A (zh) 2012-01-25 2013-01-24 布线基板、发光器件以及布线基板的制造方法
EP13152504.0A EP2621253B1 (en) 2012-01-25 2013-01-24 Wiring substrate, light emitting device, and manufacturing method of wiring substrate
US13/749,096 US9029891B2 (en) 2012-01-25 2013-01-24 Wiring substrate, light emitting device, and manufacturing method of wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012013242A JP2013153068A (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2013153068A true JP2013153068A (ja) 2013-08-08
JP2013153068A5 JP2013153068A5 (https=) 2014-12-04

Family

ID=47709854

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012013242A Pending JP2013153068A (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法

Country Status (4)

Country Link
US (1) US9029891B2 (https=)
EP (2) EP2621253B1 (https=)
JP (1) JP2013153068A (https=)
CN (1) CN103227272A (https=)

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* Cited by examiner, † Cited by third party
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JP2015046236A (ja) * 2013-08-27 2015-03-12 東芝ライテック株式会社 発光装置及び照明装置
JP2015050342A (ja) * 2013-09-02 2015-03-16 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
WO2015093170A1 (ja) * 2013-12-18 2015-06-25 シャープ株式会社 発光装置用基板、発光装置、及び、発光装置用基板の製造方法
WO2015098322A1 (ja) * 2013-12-27 2015-07-02 シャープ株式会社 発光装置用基板、発光装置、および、発光装置用基板の製造方法
WO2016042788A1 (ja) * 2014-09-18 2016-03-24 東芝ライテック株式会社 発光モジュール用基板、発光モジュール及び照明器具
CN105591006A (zh) * 2014-10-20 2016-05-18 展晶科技(深圳)有限公司 覆晶式led封装体
JPWO2015104928A1 (ja) * 2014-01-10 2017-03-23 シャープ株式会社 発光装置用基板、発光装置および発光装置用基板の製造方法
JP2019087570A (ja) * 2017-11-02 2019-06-06 シチズン電子株式会社 発光装置およびｌｅｄパッケージ
JP2020004882A (ja) * 2018-06-29 2020-01-09 日亜化学工業株式会社 発光モジュールの製造方法
JP2021005713A (ja) * 2020-08-26 2021-01-14 日亜化学工業株式会社 発光モジュール
CN112638041A (zh) * 2020-12-25 2021-04-09 深圳光韵达激光应用技术有限公司 一种散热基板制作工艺
US11538966B2 (en) 2019-04-05 2022-12-27 Nichia Corporation Method of manufacturing light emitting device
US12027501B2 (en) 2020-04-02 2024-07-02 Nichia Corporation Surface light source and method of manufacturing surface light source

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JP6050975B2 (ja) * 2012-03-27 2016-12-21 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
CN104747934A (zh) * 2013-12-31 2015-07-01 赵依军 用于提供定向光束的led照明装置
JP6379542B2 (ja) * 2014-03-14 2018-08-29 日亜化学工業株式会社 照明装置
JP6203942B2 (ja) * 2014-04-04 2017-09-27 シャープ株式会社 発光装置用基板の製造方法、発光装置の製造方法、及び照明装置の製造方法
US9326373B2 (en) * 2014-04-09 2016-04-26 Finisar Corporation Aluminum nitride substrate
US20170104135A1 (en) * 2015-10-13 2017-04-13 Sensor Electronic Technology, Inc. Light Emitting Diode Mounting Structure
KR102473668B1 (ko) 2016-03-02 2022-12-01 삼성전자주식회사 발광 소자 실장 기판 및 이를 이용한 발광 패키지
US20200321493A1 (en) * 2016-06-07 2020-10-08 Philips Lighting Holding B.V. Uv solid state output device
JP2019015797A (ja) * 2017-07-04 2019-01-31 住友電気工業株式会社 光結合部材及び光通信モジュール
DE102017130008A1 (de) * 2017-12-14 2019-06-19 Siteco Beleuchtungstechnik Gmbh Led-bauteil mit kachelartigem muster von kontaktflächen
CN109979890A (zh) * 2017-12-28 2019-07-05 凤凰先驱股份有限公司 电子封装件及其制法
CN118829276A (zh) 2018-05-11 2024-10-22 索尼半导体解决方案公司 显示装置
KR102871447B1 (ko) 2020-05-25 2025-10-14 삼성전자주식회사 발광 소자를 포함하는 광원 모듈
CN112462554B (zh) * 2020-07-16 2024-05-17 江西晶亮光电科技协同创新有限公司 新型发光装置及其制备方法、背光模组
US11729915B1 (en) 2022-03-22 2023-08-15 Tactotek Oy Method for manufacturing a number of electrical nodes, electrical node module, electrical node, and multilayer structure

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JP2005347354A (ja) * 2004-05-31 2005-12-15 Sanyo Electric Co Ltd 回路装置およびその製造方法
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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015046236A (ja) * 2013-08-27 2015-03-12 東芝ライテック株式会社 発光装置及び照明装置
JP2015050342A (ja) * 2013-09-02 2015-03-16 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
WO2015093170A1 (ja) * 2013-12-18 2015-06-25 シャープ株式会社 発光装置用基板、発光装置、及び、発光装置用基板の製造方法
JPWO2015093170A1 (ja) * 2013-12-18 2017-03-16 シャープ株式会社 発光装置用基板、発光装置、及び、発光装置用基板の製造方法
US10276765B2 (en) 2013-12-27 2019-04-30 Sharp Kabushiki Kaisha Substrate for light emitting devices, light emitting device, and method for producing substrate for light emitting devices
WO2015098322A1 (ja) * 2013-12-27 2015-07-02 シャープ株式会社 発光装置用基板、発光装置、および、発光装置用基板の製造方法
JPWO2015098322A1 (ja) * 2013-12-27 2017-03-23 シャープ株式会社 発光装置用基板、発光装置、および、発光装置用基板の製造方法
JPWO2015104928A1 (ja) * 2014-01-10 2017-03-23 シャープ株式会社 発光装置用基板、発光装置および発光装置用基板の製造方法
WO2016042788A1 (ja) * 2014-09-18 2016-03-24 東芝ライテック株式会社 発光モジュール用基板、発光モジュール及び照明器具
JPWO2016042788A1 (ja) * 2014-09-18 2017-04-27 東芝ライテック株式会社 発光モジュール用基板、発光モジュール及び照明器具
CN105591006A (zh) * 2014-10-20 2016-05-18 展晶科技(深圳)有限公司 覆晶式led封装体
JP2019087570A (ja) * 2017-11-02 2019-06-06 シチズン電子株式会社 発光装置およびｌｅｄパッケージ
JP2020004882A (ja) * 2018-06-29 2020-01-09 日亜化学工業株式会社 発光モジュールの製造方法
US11640957B2 (en) 2018-06-29 2023-05-02 Nichia Corporation Light emitting module
US11538966B2 (en) 2019-04-05 2022-12-27 Nichia Corporation Method of manufacturing light emitting device
US12027501B2 (en) 2020-04-02 2024-07-02 Nichia Corporation Surface light source and method of manufacturing surface light source
JP2021005713A (ja) * 2020-08-26 2021-01-14 日亜化学工業株式会社 発光モジュール
JP7057526B2 (ja) 2020-08-26 2022-04-20 日亜化学工業株式会社 発光モジュール
CN112638041A (zh) * 2020-12-25 2021-04-09 深圳光韵达激光应用技术有限公司 一种散热基板制作工艺
CN112638041B (zh) * 2020-12-25 2022-03-08 深圳光韵达激光应用技术有限公司 一种散热基板制作工艺

Also Published As

Publication number Publication date
EP2621253B1 (en) 2016-12-21
US9029891B2 (en) 2015-05-12
EP2882267A3 (en) 2015-10-28
US20130187182A1 (en) 2013-07-25
EP2882267A2 (en) 2015-06-10
CN103227272A (zh) 2013-07-31
EP2621253A1 (en) 2013-07-31

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