CN103227272A - 布线基板、发光器件以及布线基板的制造方法 - Google Patents

布线基板、发光器件以及布线基板的制造方法 Download PDF

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Publication number
CN103227272A
CN103227272A CN2013100277645A CN201310027764A CN103227272A CN 103227272 A CN103227272 A CN 103227272A CN 2013100277645 A CN2013100277645 A CN 2013100277645A CN 201310027764 A CN201310027764 A CN 201310027764A CN 103227272 A CN103227272 A CN 103227272A
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CN
China
Prior art keywords
layer
light emitting
reflective layer
substrate
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2013100277645A
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English (en)
Chinese (zh)
Inventor
村松茂次
清水浩
小林和贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN103227272A publication Critical patent/CN103227272A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
CN2013100277645A 2012-01-25 2013-01-24 布线基板、发光器件以及布线基板的制造方法 Pending CN103227272A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-013242 2012-01-25
JP2012013242A JP2013153068A (ja) 2012-01-25 2012-01-25 配線基板、発光装置及び配線基板の製造方法

Publications (1)

Publication Number Publication Date
CN103227272A true CN103227272A (zh) 2013-07-31

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013100277645A Pending CN103227272A (zh) 2012-01-25 2013-01-24 布线基板、发光器件以及布线基板的制造方法

Country Status (4)

Country Link
US (1) US9029891B2 (https=)
EP (2) EP2621253B1 (https=)
JP (1) JP2013153068A (https=)
CN (1) CN103227272A (https=)

Cited By (9)

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CN104747934A (zh) * 2013-12-31 2015-07-01 赵依军 用于提供定向光束的led照明装置
CN105814703A (zh) * 2013-12-18 2016-07-27 夏普株式会社 发光装置用基板、发光装置及发光装置用基板的制造方法
CN105830241A (zh) * 2013-12-27 2016-08-03 夏普株式会社 发光装置用基板、发光装置及发光装置用基板的制造方法
CN105874619A (zh) * 2014-01-10 2016-08-17 夏普株式会社 发光装置用基板、发光装置及发光装置用基板的制造方法
CN106134297A (zh) * 2014-04-04 2016-11-16 夏普株式会社 发光装置用基板及发光装置
CN109314161A (zh) * 2016-06-07 2019-02-05 飞利浦照明控股有限公司 Uv固态输出设备
CN109979890A (zh) * 2017-12-28 2019-07-05 凤凰先驱股份有限公司 电子封装件及其制法
CN112106445A (zh) * 2018-05-11 2020-12-18 索尼半导体解决方案公司 显示装置、用于驱动显示装置的方法以及电子设备
CN112462554A (zh) * 2020-07-16 2021-03-09 江西省晶能半导体有限公司 新型发光装置及其制备方法、背光模组

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JP6050975B2 (ja) * 2012-03-27 2016-12-21 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法
JP2015046236A (ja) * 2013-08-27 2015-03-12 東芝ライテック株式会社 発光装置及び照明装置
JP6280710B2 (ja) * 2013-09-02 2018-02-14 新光電気工業株式会社 配線基板、発光装置及び配線基板の製造方法
JP6379542B2 (ja) * 2014-03-14 2018-08-29 日亜化学工業株式会社 照明装置
US9326373B2 (en) * 2014-04-09 2016-04-26 Finisar Corporation Aluminum nitride substrate
WO2016042788A1 (ja) * 2014-09-18 2016-03-24 東芝ライテック株式会社 発光モジュール用基板、発光モジュール及び照明器具
CN105591006A (zh) * 2014-10-20 2016-05-18 展晶科技(深圳)有限公司 覆晶式led封装体
US20170104135A1 (en) * 2015-10-13 2017-04-13 Sensor Electronic Technology, Inc. Light Emitting Diode Mounting Structure
KR102473668B1 (ko) 2016-03-02 2022-12-01 삼성전자주식회사 발광 소자 실장 기판 및 이를 이용한 발광 패키지
JP2019015797A (ja) * 2017-07-04 2019-01-31 住友電気工業株式会社 光結合部材及び光通信モジュール
JP2019087570A (ja) * 2017-11-02 2019-06-06 シチズン電子株式会社 発光装置およびｌｅｄパッケージ
DE102017130008A1 (de) * 2017-12-14 2019-06-19 Siteco Beleuchtungstechnik Gmbh Led-bauteil mit kachelartigem muster von kontaktflächen
JP6756346B2 (ja) * 2018-06-29 2020-09-16 日亜化学工業株式会社 発光モジュールの製造方法
JP6933817B2 (ja) 2019-04-05 2021-09-08 日亜化学工業株式会社 発光装置の製造方法
US12027501B2 (en) 2020-04-02 2024-07-02 Nichia Corporation Surface light source and method of manufacturing surface light source
KR102871447B1 (ko) 2020-05-25 2025-10-14 삼성전자주식회사 발광 소자를 포함하는 광원 모듈
JP7057526B2 (ja) * 2020-08-26 2022-04-20 日亜化学工業株式会社 発光モジュール
CN112638041B (zh) * 2020-12-25 2022-03-08 深圳光韵达激光应用技术有限公司 一种散热基板制作工艺
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CN105814703A (zh) * 2013-12-18 2016-07-27 夏普株式会社 发光装置用基板、发光装置及发光装置用基板的制造方法
CN105830241A (zh) * 2013-12-27 2016-08-03 夏普株式会社 发光装置用基板、发光装置及发光装置用基板的制造方法
CN105830241B (zh) * 2013-12-27 2019-10-18 夏普株式会社 发光装置用基板、发光装置及发光装置用基板的制造方法
CN104747934A (zh) * 2013-12-31 2015-07-01 赵依军 用于提供定向光束的led照明装置
CN105874619A (zh) * 2014-01-10 2016-08-17 夏普株式会社 发光装置用基板、发光装置及发光装置用基板的制造方法
CN105874619B (zh) * 2014-01-10 2019-08-20 夏普株式会社 发光装置用基板、发光装置及发光装置用基板的制造方法
CN106134297B (zh) * 2014-04-04 2019-08-06 夏普株式会社 发光装置用基板、发光装置及照明装置
CN106134297A (zh) * 2014-04-04 2016-11-16 夏普株式会社 发光装置用基板及发光装置
CN109314161A (zh) * 2016-06-07 2019-02-05 飞利浦照明控股有限公司 Uv固态输出设备
CN109979890A (zh) * 2017-12-28 2019-07-05 凤凰先驱股份有限公司 电子封装件及其制法
CN112106445A (zh) * 2018-05-11 2020-12-18 索尼半导体解决方案公司 显示装置、用于驱动显示装置的方法以及电子设备
US12389758B2 (en) 2018-05-11 2025-08-12 Sony Semiconductor Solutions Corporation Display device, method for manufacturing display device, and electronic apparatus with interlayer insulation film
CN112462554A (zh) * 2020-07-16 2021-03-09 江西省晶能半导体有限公司 新型发光装置及其制备方法、背光模组
CN112462554B (zh) * 2020-07-16 2024-05-17 江西晶亮光电科技协同创新有限公司 新型发光装置及其制备方法、背光模组

Also Published As

Publication number Publication date
EP2621253B1 (en) 2016-12-21
US9029891B2 (en) 2015-05-12
EP2882267A3 (en) 2015-10-28
US20130187182A1 (en) 2013-07-25
JP2013153068A (ja) 2013-08-08
EP2882267A2 (en) 2015-06-10
EP2621253A1 (en) 2013-07-31

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Application publication date: 20130731