JP2013064196A5 - - Google Patents

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Publication number
JP2013064196A5
JP2013064196A5 JP2012200039A JP2012200039A JP2013064196A5 JP 2013064196 A5 JP2013064196 A5 JP 2013064196A5 JP 2012200039 A JP2012200039 A JP 2012200039A JP 2012200039 A JP2012200039 A JP 2012200039A JP 2013064196 A5 JP2013064196 A5 JP 2013064196A5
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JP
Japan
Prior art keywords
cup
wafer
seal
protrusion
notch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2012200039A
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English (en)
Japanese (ja)
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JP2013064196A (ja
JP6087549B2 (ja
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Priority claimed from US13/609,037 external-priority patent/US9512538B2/en
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Publication of JP2013064196A publication Critical patent/JP2013064196A/ja
Publication of JP2013064196A5 publication Critical patent/JP2013064196A5/ja
Application granted granted Critical
Publication of JP6087549B2 publication Critical patent/JP6087549B2/ja
Active legal-status Critical Current
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JP2012200039A 2011-09-12 2012-09-12 輪郭成形されたカップ底を有するメッキ用カップ Active JP6087549B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201161533779P 2011-09-12 2011-09-12
US61/533,779 2011-09-12
US13/609,037 2012-09-10
US13/609,037 US9512538B2 (en) 2008-12-10 2012-09-10 Plating cup with contoured cup bottom

Publications (3)

Publication Number Publication Date
JP2013064196A JP2013064196A (ja) 2013-04-11
JP2013064196A5 true JP2013064196A5 (enExample) 2015-11-05
JP6087549B2 JP6087549B2 (ja) 2017-03-01

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ID=47828847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012200039A Active JP6087549B2 (ja) 2011-09-12 2012-09-12 輪郭成形されたカップ底を有するメッキ用カップ

Country Status (6)

Country Link
US (2) US9512538B2 (enExample)
JP (1) JP6087549B2 (enExample)
KR (1) KR102031991B1 (enExample)
CN (2) CN107012495B (enExample)
SG (1) SG188752A1 (enExample)
TW (1) TWI567247B (enExample)

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CN113957500B (zh) * 2021-10-15 2023-02-28 长鑫存储技术有限公司 晶圆电镀设备
CN113846363B (zh) * 2021-10-27 2022-09-23 上海戴丰科技有限公司 一种晶圆电镀挂具
CN117737818B (zh) * 2023-12-20 2024-09-06 西安赛富乐斯半导体科技有限公司 改善电化学刻蚀均匀性装置
CN117448927B (zh) * 2023-12-26 2024-03-15 苏州智程半导体科技股份有限公司 一种晶圆电镀抗疲劳电环

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