SG188752A1 - Plating cup with contoured cup bottom - Google Patents
Plating cup with contoured cup bottom Download PDFInfo
- Publication number
- SG188752A1 SG188752A1 SG2012068078A SG2012068078A SG188752A1 SG 188752 A1 SG188752 A1 SG 188752A1 SG 2012068078 A SG2012068078 A SG 2012068078A SG 2012068078 A SG2012068078 A SG 2012068078A SG 188752 A1 SG188752 A1 SG 188752A1
- Authority
- SG
- Singapore
- Prior art keywords
- cup
- wafer
- notch
- elastomeric seal
- protrusion
- Prior art date
Links
- 238000007747 plating Methods 0.000 title claims abstract description 46
- 238000009713 electroplating Methods 0.000 claims abstract description 56
- 230000002093 peripheral effect Effects 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 238000009826 distribution Methods 0.000 claims description 14
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 119
- 230000000712 assembly Effects 0.000 abstract description 2
- 238000000429 assembly Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 70
- 239000003792 electrolyte Substances 0.000 description 35
- 239000004065 semiconductor Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- 230000008569 process Effects 0.000 description 12
- 238000007789 sealing Methods 0.000 description 11
- 238000000151 deposition Methods 0.000 description 8
- 230000009977 dual effect Effects 0.000 description 8
- 230000007717 exclusion Effects 0.000 description 8
- 230000008021 deposition Effects 0.000 description 7
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000012528 membrane Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000004590 computer program Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000009428 plumbing Methods 0.000 description 2
- 238000013515 script Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 239000013536 elastomeric material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
- C25D7/126—Semiconductors first coated with a seed layer or a conductive layer for solar cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161533779P | 2011-09-12 | 2011-09-12 | |
| US13/609,037 US9512538B2 (en) | 2008-12-10 | 2012-09-10 | Plating cup with contoured cup bottom |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG188752A1 true SG188752A1 (en) | 2013-04-30 |
Family
ID=47828847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG2012068078A SG188752A1 (en) | 2011-09-12 | 2012-09-11 | Plating cup with contoured cup bottom |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9512538B2 (enExample) |
| JP (1) | JP6087549B2 (enExample) |
| KR (1) | KR102031991B1 (enExample) |
| CN (2) | CN107012495B (enExample) |
| SG (1) | SG188752A1 (enExample) |
| TW (1) | TWI567247B (enExample) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
| US9221081B1 (en) | 2011-08-01 | 2015-12-29 | Novellus Systems, Inc. | Automated cleaning of wafer plating assembly |
| US9228270B2 (en) | 2011-08-15 | 2016-01-05 | Novellus Systems, Inc. | Lipseals and contact elements for semiconductor electroplating apparatuses |
| US9988734B2 (en) | 2011-08-15 | 2018-06-05 | Lam Research Corporation | Lipseals and contact elements for semiconductor electroplating apparatuses |
| US10066311B2 (en) | 2011-08-15 | 2018-09-04 | Lam Research Corporation | Multi-contact lipseals and associated electroplating methods |
| WO2013148890A1 (en) | 2012-03-28 | 2013-10-03 | Novellus Systems, Inc. | Methods and apparatuses for cleaning electroplating substrate holders |
| KR102092416B1 (ko) | 2012-03-30 | 2020-03-24 | 노벨러스 시스템즈, 인코포레이티드 | 역전류 디플레이팅을 이용한 전기도금 기판 홀더의 클리닝 |
| US10416092B2 (en) | 2013-02-15 | 2019-09-17 | Lam Research Corporation | Remote detection of plating on wafer holding apparatus |
| US9518334B2 (en) | 2013-03-11 | 2016-12-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electro-plating and apparatus for performing the same |
| CN104975338B (zh) * | 2014-04-02 | 2018-09-07 | 盛美半导体设备（上海）有限公司 | 电化学抛光的金属阳极及其密封结构 |
| JP6745103B2 (ja) * | 2014-11-26 | 2020-08-26 | ノベラス・システムズ・インコーポレーテッドＮｏｖｅｌｌｕｓ Ｓｙｓｔｅｍｓ Ｉｎｃｏｒｐｏｒａｔｅｄ | 半導体電気メッキ装置用のリップシールおよび接触要素 |
| US9758897B2 (en) | 2015-01-27 | 2017-09-12 | Applied Materials, Inc. | Electroplating apparatus with notch adapted contact ring seal and thief electrode |
| US9689082B2 (en) | 2015-04-14 | 2017-06-27 | Applied Materials, Inc. | Electroplating wafers having a notch |
| US10053793B2 (en) * | 2015-07-09 | 2018-08-21 | Lam Research Corporation | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
| US20170073832A1 (en) * | 2015-09-11 | 2017-03-16 | Lam Research Corporation | Durable low cure temperature hydrophobic coating in electroplating cup assembly |
| CN109314070B (zh) * | 2016-07-01 | 2022-10-18 | 卡本有限公司 | 用于旋涂多层薄膜的具有液体保存特征的方法和系统 |
| US9891039B1 (en) | 2017-03-14 | 2018-02-13 | Globalfoundries Inc. | Method and device for measuring plating ring assembly dimensions |
| JP6893142B2 (ja) * | 2017-07-25 | 2021-06-23 | 上村工業株式会社 | ワーク保持治具及び電気めっき装置 |
| WO2019047086A1 (en) * | 2017-09-07 | 2019-03-14 | Acm Research (Shanghai) Inc. | PLATE CHUCK |
| TWI791785B (zh) * | 2019-03-06 | 2023-02-11 | 大陸商盛美半導體設備（上海）股份有限公司 | 電鍍夾盤 |
| JP2022550449A (ja) * | 2019-10-04 | 2022-12-01 | ラム リサーチ コーポレーション | リップシールプレートアウトを防止するためのウエハ遮蔽 |
| WO2021221872A1 (en) * | 2020-04-30 | 2021-11-04 | Lam Research Corporation | Lipseal edge exclusion engineering to maintain material integrity at wafer edge |
| CN114645311A (zh) * | 2020-12-18 | 2022-06-21 | 盛美半导体设备(上海)股份有限公司 | 基板保持装置的杯形夹盘及基板保持装置 |
| US11920254B2 (en) | 2021-08-30 | 2024-03-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Detection of contact formation between a substrate and contact pins in an electroplating system |
| CN113957500B (zh) * | 2021-10-15 | 2023-02-28 | 长鑫存储技术有限公司 | 晶圆电镀设备 |
| CN113846363B (zh) * | 2021-10-27 | 2022-09-23 | 上海戴丰科技有限公司 | 一种晶圆电镀挂具 |
| CN117737818B (zh) * | 2023-12-20 | 2024-09-06 | 西安赛富乐斯半导体科技有限公司 | 改善电化学刻蚀均匀性装置 |
| CN117448927B (zh) * | 2023-12-26 | 2024-03-15 | 苏州智程半导体科技股份有限公司 | 一种晶圆电镀抗疲劳电环 |
Family Cites Families (87)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3755946A (en) * | 1972-03-21 | 1973-09-04 | F Tomlinson | Clip-on shell catcher |
| US4466864A (en) | 1983-12-16 | 1984-08-21 | At&T Technologies, Inc. | Methods of and apparatus for electroplating preselected surface regions of electrical articles |
| US5000827A (en) | 1990-01-02 | 1991-03-19 | Motorola, Inc. | Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect |
| US5368711A (en) | 1990-08-01 | 1994-11-29 | Poris; Jaime | Selective metal electrodeposition process and apparatus |
| USRE37749E1 (en) | 1990-08-01 | 2002-06-18 | Jaime Poris | Electrodeposition apparatus with virtual anode |
| WO1992007968A1 (en) | 1990-10-26 | 1992-05-14 | International Business Machines Corporation | STRUCTURE AND METHOD OF MAKING ALPHA-Ta IN THIN FILMS |
| US5221449A (en) | 1990-10-26 | 1993-06-22 | International Business Machines Corporation | Method of making Alpha-Ta thin films |
| US5482611A (en) | 1991-09-30 | 1996-01-09 | Helmer; John C. | Physical vapor deposition employing ion extraction from a plasma |
| US5227041A (en) | 1992-06-12 | 1993-07-13 | Digital Equipment Corporation | Dry contact electroplating apparatus |
| JP3490238B2 (ja) | 1997-02-17 | 2004-01-26 | 三菱電機株式会社 | メッキ処理装置およびメッキ処理方法 |
| US5985762A (en) | 1997-05-19 | 1999-11-16 | International Business Machines Corporation | Method of forming a self-aligned copper diffusion barrier in vias |
| US6156167A (en) | 1997-11-13 | 2000-12-05 | Novellus Systems, Inc. | Clamshell apparatus for electrochemically treating semiconductor wafers |
| US6126798A (en) | 1997-11-13 | 2000-10-03 | Novellus Systems, Inc. | Electroplating anode including membrane partition system and method of preventing passivation of same |
| US6179983B1 (en) | 1997-11-13 | 2001-01-30 | Novellus Systems, Inc. | Method and apparatus for treating surface including virtual anode |
| US6159354A (en) | 1997-11-13 | 2000-12-12 | Novellus Systems, Inc. | Electric potential shaping method for electroplating |
| KR100474746B1 (ko) | 1998-02-12 | 2005-03-08 | 에이씨엠 리서치, 인코포레이티드 | 도금 장치 및 방법 |
| WO1999054527A2 (en) | 1998-04-21 | 1999-10-28 | Applied Materials, Inc. | Electro-chemical deposition system and method of electroplating on substrates |
| US6217716B1 (en) | 1998-05-06 | 2001-04-17 | Novellus Systems, Inc. | Apparatus and method for improving target erosion in hollow cathode magnetron sputter source |
| US6071388A (en) | 1998-05-29 | 2000-06-06 | International Business Machines Corporation | Electroplating workpiece fixture having liquid gap spacer |
| US6099702A (en) | 1998-06-10 | 2000-08-08 | Novellus Systems, Inc. | Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability |
| US6773560B2 (en) | 1998-07-10 | 2004-08-10 | Semitool, Inc. | Dry contact assemblies and plating machines with dry contact assemblies for plating microelectronic workpieces |
| JP4128230B2 (ja) | 1998-07-10 | 2008-07-30 | 株式会社荏原製作所 | メッキ装置 |
| KR100691201B1 (ko) * | 1998-07-10 | 2007-03-08 | 세미툴 인코포레이티드 | 무전해 도금 및 전기 도금을 사용하는 구리 도금 방법 및그 장치 |
| US6303010B1 (en) | 1999-07-12 | 2001-10-16 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
| US6080291A (en) | 1998-07-10 | 2000-06-27 | Semitool, Inc. | Apparatus for electrochemically processing a workpiece including an electrical contact assembly having a seal member |
| US6074544A (en) | 1998-07-22 | 2000-06-13 | Novellus Systems, Inc. | Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer |
| US6176985B1 (en) | 1998-10-23 | 2001-01-23 | International Business Machines Corporation | Laminated electroplating rack and connection system for optimized plating |
| US6402923B1 (en) | 2000-03-27 | 2002-06-11 | Novellus Systems Inc | Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element |
| US7070686B2 (en) | 2000-03-27 | 2006-07-04 | Novellus Systems, Inc. | Dynamically variable field shaping element |
| US6258220B1 (en) | 1998-11-30 | 2001-07-10 | Applied Materials, Inc. | Electro-chemical deposition system |
| US6613214B2 (en) | 1998-11-30 | 2003-09-02 | Applied Materials, Inc. | Electric contact element for electrochemical deposition system and method |
| US6413388B1 (en) | 2000-02-23 | 2002-07-02 | Nutool Inc. | Pad designs and structures for a versatile materials processing apparatus |
| US6309520B1 (en) * | 1998-12-07 | 2001-10-30 | Semitool, Inc. | Methods and apparatus for processing the surface of a microelectronic workpiece |
| US6124203A (en) | 1998-12-07 | 2000-09-26 | Advanced Micro Devices, Inc. | Method for forming conformal barrier layers |
| DE19859467C2 (de) | 1998-12-22 | 2002-11-28 | Steag Micro Tech Gmbh | Substrathalter |
| US6193854B1 (en) | 1999-01-05 | 2001-02-27 | Novellus Systems, Inc. | Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source |
| US6179973B1 (en) | 1999-01-05 | 2001-01-30 | Novellus Systems, Inc. | Apparatus and method for controlling plasma uniformity across a substrate |
| US6221757B1 (en) | 1999-01-20 | 2001-04-24 | Infineon Technologies Ag | Method of making a microelectronic structure |
| US6454918B1 (en) | 1999-03-23 | 2002-09-24 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
| US6368475B1 (en) | 2000-03-21 | 2002-04-09 | Semitool, Inc. | Apparatus for electrochemically processing a microelectronic workpiece |
| US6197182B1 (en) | 1999-07-07 | 2001-03-06 | Technic Inc. | Apparatus and method for plating wafers, substrates and other articles |
| US7645366B2 (en) | 1999-07-12 | 2010-01-12 | Semitool, Inc. | Microelectronic workpiece holders and contact assemblies for use therewith |
| US6267860B1 (en) | 1999-07-27 | 2001-07-31 | International Business Machines Corporation | Method and apparatus for electroplating |
| US6361675B1 (en) | 1999-12-01 | 2002-03-26 | Motorola, Inc. | Method of manufacturing a semiconductor component and plating tool therefor |
| US6612915B1 (en) | 1999-12-27 | 2003-09-02 | Nutool Inc. | Work piece carrier head for plating and polishing |
| US6270646B1 (en) | 1999-12-28 | 2001-08-07 | International Business Machines Corporation | Electroplating apparatus and method using a compressible contact |
| US6251242B1 (en) | 2000-01-21 | 2001-06-26 | Applied Materials, Inc. | Magnetron and target producing an extended plasma region in a sputter reactor |
| US6277249B1 (en) | 2000-01-21 | 2001-08-21 | Applied Materials Inc. | Integrated process for copper via filling using a magnetron and target producing highly energetic ions |
| US8308931B2 (en) | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| US8475636B2 (en) * | 2008-11-07 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
| KR20010107766A (ko) | 2000-05-26 | 2001-12-07 | 마에다 시게루 | 기판처리장치 및 기판도금장치 |
| JP2002069698A (ja) | 2000-08-31 | 2002-03-08 | Tokyo Electron Ltd | 液処理装置及び液処理方法 |
| WO2002029137A2 (en) | 2000-10-03 | 2002-04-11 | Applied Materials,Inc. | Method and associated apparatus for tilting a substrate upon entry for metal deposition |
| US6627052B2 (en) | 2000-12-12 | 2003-09-30 | International Business Machines Corporation | Electroplating apparatus with vertical electrical contact |
| US6540899B2 (en) | 2001-04-05 | 2003-04-01 | All Wet Technologies, Inc. | Method of and apparatus for fluid sealing, while electrically contacting, wet-processed workpieces |
| JP2002332598A (ja) | 2001-05-11 | 2002-11-22 | Tokyo Electron Ltd | 液処理装置 |
| US6800187B1 (en) | 2001-05-31 | 2004-10-05 | Novellus Systems, Inc. | Clamshell apparatus for electrochemically treating wafers |
| US6551487B1 (en) | 2001-05-31 | 2003-04-22 | Novellus Systems, Inc. | Methods and apparatus for controlled-angle wafer immersion |
| JP2003086548A (ja) | 2001-06-29 | 2003-03-20 | Hitachi Ltd | 半導体装置の製造方法及びその研磨液 |
| US6908540B2 (en) | 2001-07-13 | 2005-06-21 | Applied Materials, Inc. | Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
| US6989084B2 (en) | 2001-11-02 | 2006-01-24 | Rockwell Scientific Licensing, Llc | Semiconductor wafer plating cell assembly |
| US6579430B2 (en) | 2001-11-02 | 2003-06-17 | Innovative Technology Licensing, Llc | Semiconductor wafer plating cathode assembly |
| US6755946B1 (en) | 2001-11-30 | 2004-06-29 | Novellus Systems, Inc. | Clamshell apparatus with dynamic uniformity control |
| US7033465B1 (en) | 2001-11-30 | 2006-04-25 | Novellus Systems, Inc. | Clamshell apparatus with crystal shielding and in-situ rinse-dry |
| TWI244548B (en) | 2002-01-22 | 2005-12-01 | Taiwan Semiconductor Mfg | Method for detecting the defect of a wafer |
| JP2003301294A (ja) | 2002-04-12 | 2003-10-24 | Electroplating Eng Of Japan Co | カップ式めっき装置 |
| JP3720009B2 (ja) | 2002-10-01 | 2005-11-24 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | めっき方法及びめっき装置 |
| US6867119B2 (en) | 2002-10-30 | 2005-03-15 | Advanced Micro Devices, Inc. | Nitrogen oxidation to reduce encroachment |
| JP4303484B2 (ja) | 2003-01-21 | 2009-07-29 | 大日本スクリーン製造株式会社 | メッキ装置 |
| US7087144B2 (en) | 2003-01-31 | 2006-08-08 | Applied Materials, Inc. | Contact ring with embedded flexible contacts |
| JP3886919B2 (ja) | 2003-03-12 | 2007-02-28 | 富士通株式会社 | めっき装置 |
| DE10313127B4 (de) | 2003-03-24 | 2006-10-12 | Rena Sondermaschinen Gmbh | Verfahren zur Behandlung von Substratoberflächen |
| US7285195B2 (en) | 2004-06-24 | 2007-10-23 | Applied Materials, Inc. | Electric field reducing thrust plate |
| US7301458B2 (en) | 2005-05-11 | 2007-11-27 | Alien Technology Corporation | Method and apparatus for testing RFID devices |
| USD548705S1 (en) | 2005-09-29 | 2007-08-14 | Tokyo Electron Limited | Attracting disc for an electrostatic chuck for semiconductor production |
| KR20080007931A (ko) | 2006-07-19 | 2008-01-23 | 삼성전자주식회사 | 전기 도금 장치 |
| TWD125773S1 (zh) | 2006-08-01 | 2008-11-01 | 東京威力科創股份有限公司 | 半導體製造用靜電吸盤用吸附板 |
| US7985325B2 (en) * | 2007-10-30 | 2011-07-26 | Novellus Systems, Inc. | Closed contact electroplating cup assembly |
| US7935231B2 (en) | 2007-10-31 | 2011-05-03 | Novellus Systems, Inc. | Rapidly cleanable electroplating cup assembly |
| JP4927789B2 (ja) * | 2008-06-06 | 2012-05-09 | 株式会社荏原製作所 | 接触シール、ウエハホルダ及びめっき装置 |
| JP5155755B2 (ja) * | 2008-07-10 | 2013-03-06 | 株式会社荏原製作所 | 磁性体膜めっき装置及びめっき処理設備 |
| USD614593S1 (en) | 2008-07-21 | 2010-04-27 | Asm Genitech Korea Ltd | Substrate support for a semiconductor deposition apparatus |
| TWD135511S1 (zh) | 2008-10-03 | 2010-06-21 | 日本碍子股份有限公司 | 靜電夾頭 |
| JP5237924B2 (ja) | 2008-12-10 | 2013-07-17 | ノベルス・システムズ・インコーポレーテッド | ベースプレート、及び電気メッキ装置 |
| US9512538B2 (en) | 2008-12-10 | 2016-12-06 | Novellus Systems, Inc. | Plating cup with contoured cup bottom |
| US8425687B2 (en) * | 2009-02-10 | 2013-04-23 | Tel Nexx, Inc. | Wetting a workpiece surface in a fluid-processing system |
| USD648289S1 (en) | 2010-10-21 | 2011-11-08 | Novellus Systems, Inc. | Electroplating flow shaping plate having offset spiral hole pattern |
-
2012
- 2012-09-10 US US13/609,037 patent/US9512538B2/en active Active
- 2012-09-11 SG SG2012068078A patent/SG188752A1/en unknown
- 2012-09-12 KR KR1020120101238A patent/KR102031991B1/ko active Active
- 2012-09-12 JP JP2012200039A patent/JP6087549B2/ja active Active
- 2012-09-12 CN CN201710089748.7A patent/CN107012495B/zh active Active
- 2012-09-12 CN CN201210354922.3A patent/CN103031580B/zh active Active
- 2012-09-12 TW TW101133342A patent/TWI567247B/zh active
-
2016
- 2016-01-07 US US14/990,573 patent/US10053792B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103031580A (zh) | 2013-04-10 |
| US9512538B2 (en) | 2016-12-06 |
| US20130062197A1 (en) | 2013-03-14 |
| KR20130028888A (ko) | 2013-03-20 |
| JP2013064196A (ja) | 2013-04-11 |
| US20150191843A9 (en) | 2015-07-09 |
| TWI567247B (zh) | 2017-01-21 |
| CN103031580B (zh) | 2017-04-12 |
| US10053792B2 (en) | 2018-08-21 |
| US20160115615A1 (en) | 2016-04-28 |
| TW201331424A (zh) | 2013-08-01 |
| CN107012495B (zh) | 2019-04-30 |
| CN107012495A (zh) | 2017-08-04 |
| KR102031991B1 (ko) | 2019-11-08 |
| JP6087549B2 (ja) | 2017-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10053792B2 (en) | Plating cup with contoured cup bottom | |
| KR102082606B1 (ko) | 반도체 전기도금 장비를 위한 립씰 및 접촉 요소 | |
| US12157950B2 (en) | Lipseals and contact elements for semiconductor electroplating apparatuses | |
| US10982346B2 (en) | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | |
| KR102683719B1 (ko) | 전기도금 컵 어셈블리에서 내구성이 있는 저 경화 온도 소수성 코팅 | |
| TW201433660A (zh) | 電鍍製程之可調整電流屏蔽 |