JP2013058629A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013058629A5 JP2013058629A5 JP2011196394A JP2011196394A JP2013058629A5 JP 2013058629 A5 JP2013058629 A5 JP 2013058629A5 JP 2011196394 A JP2011196394 A JP 2011196394A JP 2011196394 A JP2011196394 A JP 2011196394A JP 2013058629 A5 JP2013058629 A5 JP 2013058629A5
- Authority
- JP
- Japan
- Prior art keywords
- copper
- etching
- copper alloy
- ammonium
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims description 28
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 239000000243 solution Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 18
- -1 ammonium ions Chemical class 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 7
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims description 7
- JZBWUTVDIDNCMW-UHFFFAOYSA-L dipotassium;oxido sulfate Chemical compound [K+].[K+].[O-]OS([O-])(=O)=O JZBWUTVDIDNCMW-UHFFFAOYSA-L 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000012935 ammoniumperoxodisulfate Substances 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 150000004968 peroxymonosulfuric acids Chemical class 0.000 claims description 3
- OKBMCNHOEMXPTM-UHFFFAOYSA-M potassium peroxymonosulfate Chemical compound [K+].OOS([O-])(=O)=O OKBMCNHOEMXPTM-UHFFFAOYSA-M 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims 2
- 239000005751 Copper oxide Substances 0.000 claims 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 2
- KASGZKMAZIEEHX-UHFFFAOYSA-N aluminum copper magnesium oxygen(2-) Chemical compound [O-2].[Al+3].[Mg+2].[Cu+2] KASGZKMAZIEEHX-UHFFFAOYSA-N 0.000 claims 2
- 229910000431 copper oxide Inorganic materials 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- LFVGISIMTYGQHF-UHFFFAOYSA-N ammonium dihydrogen phosphate Chemical compound [NH4+].OP(O)([O-])=O LFVGISIMTYGQHF-UHFFFAOYSA-N 0.000 description 3
- 229910000387 ammonium dihydrogen phosphate Inorganic materials 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 235000019837 monoammonium phosphate Nutrition 0.000 description 3
- 229910018516 Al—O Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 229910003023 Mg-Al Inorganic materials 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- NHGXDBSUJJNIRV-UHFFFAOYSA-M tetrabutylammonium chloride Chemical compound [Cl-].CCCC[N+](CCCC)(CCCC)CCCC NHGXDBSUJJNIRV-UHFFFAOYSA-M 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 2
- PAWQVTBBRAZDMG-UHFFFAOYSA-N 2-(3-bromo-2-fluorophenyl)acetic acid Chemical compound OC(=O)CC1=CC=CC(Br)=C1F PAWQVTBBRAZDMG-UHFFFAOYSA-N 0.000 description 1
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 1
- GDTSJMKGXGJFGQ-UHFFFAOYSA-N 3,7-dioxido-2,4,6,8,9-pentaoxa-1,3,5,7-tetraborabicyclo[3.3.1]nonane Chemical compound O1B([O-])OB2OB([O-])OB1O2 GDTSJMKGXGJFGQ-UHFFFAOYSA-N 0.000 description 1
- GDDNTTHUKVNJRA-UHFFFAOYSA-N 3-bromo-3,3-difluoroprop-1-ene Chemical compound FC(F)(Br)C=C GDDNTTHUKVNJRA-UHFFFAOYSA-N 0.000 description 1
- USFZMSVCRYTOJT-UHFFFAOYSA-N Ammonium acetate Chemical compound N.CC(O)=O USFZMSVCRYTOJT-UHFFFAOYSA-N 0.000 description 1
- 239000005695 Ammonium acetate Substances 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- 239000004251 Ammonium lactate Substances 0.000 description 1
- 229910014472 Ca—O Inorganic materials 0.000 description 1
- 229910017566 Cu-Mn Inorganic materials 0.000 description 1
- 229910017767 Cu—Al Inorganic materials 0.000 description 1
- 229910017818 Cu—Mg Inorganic materials 0.000 description 1
- 229910017871 Cu—Mn Inorganic materials 0.000 description 1
- 229910017985 Cu—Zr Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910019092 Mg-O Inorganic materials 0.000 description 1
- 229910019395 Mg—O Inorganic materials 0.000 description 1
- 229910017262 Mo—B Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 229910008423 Si—B Inorganic materials 0.000 description 1
- RCITVHFNWJIDNA-UHFFFAOYSA-K [NH4+].[NH4+].[NH4+].[Fe+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O Chemical compound [NH4+].[NH4+].[NH4+].[Fe+3].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O RCITVHFNWJIDNA-UHFFFAOYSA-K 0.000 description 1
- DOIXGGGORNAJAT-UHFFFAOYSA-M [NH4+].[Ni+].[O-]S([O-])(=O)=O Chemical compound [NH4+].[Ni+].[O-]S([O-])(=O)=O DOIXGGGORNAJAT-UHFFFAOYSA-M 0.000 description 1
- VPIRQWXATMKGOF-UHFFFAOYSA-L [O-]S([O-])(=O)=O.N.[Mg+2].[Mg+2] Chemical compound [O-]S([O-])(=O)=O.N.[Mg+2].[Mg+2] VPIRQWXATMKGOF-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229940043376 ammonium acetate Drugs 0.000 description 1
- 235000019257 ammonium acetate Nutrition 0.000 description 1
- LCQXXBOSCBRNNT-UHFFFAOYSA-K ammonium aluminium sulfate Chemical compound [NH4+].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O LCQXXBOSCBRNNT-UHFFFAOYSA-K 0.000 description 1
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical compound [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- VZTDIZULWFCMLS-UHFFFAOYSA-N ammonium formate Chemical compound [NH4+].[O-]C=O VZTDIZULWFCMLS-UHFFFAOYSA-N 0.000 description 1
- 229940107816 ammonium iodide Drugs 0.000 description 1
- 229940059265 ammonium lactate Drugs 0.000 description 1
- 235000019286 ammonium lactate Nutrition 0.000 description 1
- VBIXEXWLHSRNKB-UHFFFAOYSA-N ammonium oxalate Chemical compound [NH4+].[NH4+].[O-]C(=O)C([O-])=O VBIXEXWLHSRNKB-UHFFFAOYSA-N 0.000 description 1
- 229910000148 ammonium phosphate Inorganic materials 0.000 description 1
- ZRIUUUJAJJNDSS-UHFFFAOYSA-N ammonium phosphates Chemical compound [NH4+].[NH4+].[NH4+].[O-]P([O-])([O-])=O ZRIUUUJAJJNDSS-UHFFFAOYSA-N 0.000 description 1
- BFNBIHQBYMNNAN-UHFFFAOYSA-N ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical compound [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 description 1
- WPADTLKJFUUWIK-UHFFFAOYSA-N azane iron oxalic acid Chemical compound N.N.N.[Fe].OC(=O)C(O)=O.OC(=O)C(O)=O.OC(=O)C(O)=O WPADTLKJFUUWIK-UHFFFAOYSA-N 0.000 description 1
- YCNIBOIOWCTRCL-UHFFFAOYSA-N azane;2,2,2-trifluoroacetic acid Chemical compound [NH4+].[O-]C(=O)C(F)(F)F YCNIBOIOWCTRCL-UHFFFAOYSA-N 0.000 description 1
- PLKYGPRDCKGEJH-UHFFFAOYSA-N azane;2-hydroxypropane-1,2,3-tricarboxylic acid;iron Chemical compound N.[Fe].OC(=O)CC(O)(C(O)=O)CC(O)=O PLKYGPRDCKGEJH-UHFFFAOYSA-N 0.000 description 1
- UMEAURNTRYCPNR-UHFFFAOYSA-N azane;iron(2+) Chemical compound N.[Fe+2] UMEAURNTRYCPNR-UHFFFAOYSA-N 0.000 description 1
- RZOBLYBZQXQGFY-HSHFZTNMSA-N azanium;(2r)-2-hydroxypropanoate Chemical compound [NH4+].C[C@@H](O)C([O-])=O RZOBLYBZQXQGFY-HSHFZTNMSA-N 0.000 description 1
- NGPGDYLVALNKEG-UHFFFAOYSA-N azanium;azane;2,3,4-trihydroxy-4-oxobutanoate Chemical compound [NH4+].[NH4+].[O-]C(=O)C(O)C(O)C([O-])=O NGPGDYLVALNKEG-UHFFFAOYSA-N 0.000 description 1
- PCCNIENXBRUYFK-UHFFFAOYSA-O azanium;cerium(4+);pentanitrate Chemical compound [NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PCCNIENXBRUYFK-UHFFFAOYSA-O 0.000 description 1
- RAGLTCMTCZHYEJ-UHFFFAOYSA-K azanium;chromium(3+);disulfate Chemical compound [NH4+].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O RAGLTCMTCZHYEJ-UHFFFAOYSA-K 0.000 description 1
- VCNSVJZBSHPMSH-UHFFFAOYSA-N azanium;cobalt;chloride Chemical compound [NH4+].[Cl-].[Co] VCNSVJZBSHPMSH-UHFFFAOYSA-N 0.000 description 1
- AWZACWPILWGEQL-UHFFFAOYSA-M azanium;copper(1+);sulfate Chemical compound [NH4+].[Cu+].[O-]S([O-])(=O)=O AWZACWPILWGEQL-UHFFFAOYSA-M 0.000 description 1
- LDDQLRUQCUTJBB-UHFFFAOYSA-O azanium;hydrofluoride Chemical compound [NH4+].F LDDQLRUQCUTJBB-UHFFFAOYSA-O 0.000 description 1
- BWKOZPVPARTQIV-UHFFFAOYSA-N azanium;hydron;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [NH4+].OC(=O)CC(O)(C(O)=O)CC([O-])=O BWKOZPVPARTQIV-UHFFFAOYSA-N 0.000 description 1
- AJGPQPPJQDDCDA-UHFFFAOYSA-N azanium;hydron;oxalate Chemical compound N.OC(=O)C(O)=O AJGPQPPJQDDCDA-UHFFFAOYSA-N 0.000 description 1
- URGYLQKORWLZAQ-UHFFFAOYSA-N azanium;periodate Chemical compound [NH4+].[O-]I(=O)(=O)=O URGYLQKORWLZAQ-UHFFFAOYSA-N 0.000 description 1
- XEPNJJFNSJKTSO-UHFFFAOYSA-N azanium;zinc;chloride Chemical compound [NH4+].[Cl-].[Zn] XEPNJJFNSJKTSO-UHFFFAOYSA-N 0.000 description 1
- LRFJFPBGPRAOHO-UHFFFAOYSA-L cobalt cobalt(2+) sulfate Chemical compound [Co].[Co++].[O-]S([O-])(=O)=O LRFJFPBGPRAOHO-UHFFFAOYSA-L 0.000 description 1
- ZURAKLKIKYCUJU-UHFFFAOYSA-N copper;azane Chemical compound N.[Cu+2] ZURAKLKIKYCUJU-UHFFFAOYSA-N 0.000 description 1
- WTDHULULXKLSOZ-UHFFFAOYSA-N hydroxylamine hydrochloride Substances Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 description 1
- WCYJQVALWQMJGE-UHFFFAOYSA-M hydroxylammonium chloride Chemical compound [Cl-].O[NH3+] WCYJQVALWQMJGE-UHFFFAOYSA-M 0.000 description 1
- ANAIULQUYDWKAL-UHFFFAOYSA-J iron(2+);disulfate Chemical compound [Fe+2].[Fe+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O ANAIULQUYDWKAL-UHFFFAOYSA-J 0.000 description 1
- FDZHBUDWRBLGCE-UHFFFAOYSA-L manganese manganese(2+) sulfate Chemical compound [Mn].[Mn++].[O-]S([O-])(=O)=O FDZHBUDWRBLGCE-UHFFFAOYSA-L 0.000 description 1
- CUXQLKLUPGTTKL-UHFFFAOYSA-M microcosmic salt Chemical compound [NH4+].[Na+].OP([O-])([O-])=O CUXQLKLUPGTTKL-UHFFFAOYSA-M 0.000 description 1
- 239000006012 monoammonium phosphate Substances 0.000 description 1
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910000343 potassium bisulfate Inorganic materials 0.000 description 1
- 235000019394 potassium persulphate Nutrition 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- YMBCJWGVCUEGHA-UHFFFAOYSA-M tetraethylammonium chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC YMBCJWGVCUEGHA-UHFFFAOYSA-M 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- FBEVECUEMUUFKM-UHFFFAOYSA-M tetrapropylazanium;chloride Chemical compound [Cl-].CCC[N+](CCC)(CCC)CCC FBEVECUEMUUFKM-UHFFFAOYSA-M 0.000 description 1
- LPSKDVINWQNWFE-UHFFFAOYSA-M tetrapropylazanium;hydroxide Chemical compound [OH-].CCC[N+](CCC)(CCC)CCC LPSKDVINWQNWFE-UHFFFAOYSA-M 0.000 description 1
- 239000001393 triammonium citrate Substances 0.000 description 1
- 235000011046 triammonium citrate Nutrition 0.000 description 1
- WYXIGTJNYDDFFH-UHFFFAOYSA-Q triazanium;borate Chemical compound [NH4+].[NH4+].[NH4+].[O-]B([O-])[O-] WYXIGTJNYDDFFH-UHFFFAOYSA-Q 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011196394A JP5885971B2 (ja) | 2011-09-08 | 2011-09-08 | 銅および銅合金のエッチング液 |
| SG2012065843A SG188734A1 (en) | 2011-09-08 | 2012-09-05 | Etching solution for copper and copper alloy |
| KR1020120099231A KR20130028014A (ko) | 2011-09-08 | 2012-09-07 | 구리 및 구리 합금의 에칭액 |
| TW101132768A TW201323661A (zh) | 2011-09-08 | 2012-09-07 | 銅和銅合金的蝕刻液 |
| CN2012103305021A CN102995021A (zh) | 2011-09-08 | 2012-09-07 | 铜及铜合金的蚀刻液组合物及蚀刻方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011196394A JP5885971B2 (ja) | 2011-09-08 | 2011-09-08 | 銅および銅合金のエッチング液 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013058629A JP2013058629A (ja) | 2013-03-28 |
| JP2013058629A5 true JP2013058629A5 (enExample) | 2014-09-18 |
| JP5885971B2 JP5885971B2 (ja) | 2016-03-16 |
Family
ID=47924114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011196394A Expired - Fee Related JP5885971B2 (ja) | 2011-09-08 | 2011-09-08 | 銅および銅合金のエッチング液 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5885971B2 (enExample) |
| KR (1) | KR20130028014A (enExample) |
| CN (1) | CN102995021A (enExample) |
| SG (1) | SG188734A1 (enExample) |
| TW (1) | TW201323661A (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6777420B2 (ja) * | 2016-04-21 | 2020-10-28 | 関東化学株式会社 | 単層膜または積層膜のエッチング組成物または前記組成物を用いたエッチング方法 |
| CN105887092B (zh) * | 2016-04-28 | 2019-01-15 | 华南理工大学 | 一种适用于臭氧回收法的pcb酸性蚀刻液 |
| JP7333755B2 (ja) * | 2018-01-05 | 2023-08-25 | 株式会社Adeka | エッチング液組成物及びエッチング方法 |
| KR102205628B1 (ko) | 2019-02-12 | 2021-01-21 | 김진호 | 구리 또는 구리 함유 금속막 식각액 조성물 |
| CN110093606A (zh) * | 2019-06-14 | 2019-08-06 | 大连亚太电子有限公司 | 一种用于pcb板的蚀刻液及其制作方法 |
| CN110938822A (zh) * | 2019-11-14 | 2020-03-31 | 浙江工业大学 | 一种钼/铜复合金属层的蚀刻液、蚀刻方法与应用 |
| CN111041489B (zh) * | 2020-01-03 | 2021-10-15 | 易安爱富(武汉)科技有限公司 | 一种钼/钛合金薄膜蚀刻液组合物及其应用 |
| WO2021251204A1 (ja) * | 2020-06-08 | 2021-12-16 | 三菱瓦斯化学株式会社 | 銅または銅合金の表面処理に用いられる化学研磨液および表面処理方法 |
| CN111809183B (zh) * | 2020-07-14 | 2022-08-09 | 北京航空航天大学宁波创新研究院 | 一种铜镓合金的金相腐蚀液以及金相显示方法 |
| CN112635553B (zh) * | 2020-12-25 | 2022-09-16 | 广东省科学院半导体研究所 | 薄膜晶体管的制作方法和显示装置 |
| JP7569252B2 (ja) * | 2021-03-26 | 2024-10-17 | 花王株式会社 | エッチング液組成物の保存方法 |
| CN113667979A (zh) * | 2021-08-05 | 2021-11-19 | Tcl华星光电技术有限公司 | 铜钼金属蚀刻液及其应用 |
| US12276033B2 (en) | 2021-10-19 | 2025-04-15 | Tokyo Electron Limited | Methods for wet etching of noble metals |
| JP2024063315A (ja) * | 2022-10-26 | 2024-05-13 | 関東化学株式会社 | エッチング液組成物およびエッチング方法 |
| WO2024107260A1 (en) * | 2022-11-14 | 2024-05-23 | Tokyo Electron Limited | Methods for wet etching of noble metals |
| CN116573782B (zh) * | 2023-04-03 | 2023-11-03 | 迁安市宏奥工贸有限公司 | 脱硫废液的处理方法 |
| CN118186394B (zh) * | 2024-05-16 | 2024-08-16 | 苏州高芯众科半导体有限公司 | Tf液晶面板刻蚀腔铝板清洁再生的方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4706081B2 (ja) * | 2001-06-05 | 2011-06-22 | メック株式会社 | 銅または銅合金のエッチング剤ならびにエッチング法 |
| JP4069387B2 (ja) * | 2003-08-27 | 2008-04-02 | 上村工業株式会社 | エッチング液 |
| JP4093147B2 (ja) * | 2003-09-04 | 2008-06-04 | 三菱電機株式会社 | エッチング液及びエッチング方法 |
| US7442323B2 (en) * | 2006-06-02 | 2008-10-28 | E. I. Du Pont De Nemours And Company | Potassium monopersulfate solutions |
| JP4973231B2 (ja) * | 2006-09-05 | 2012-07-11 | 日立化成工業株式会社 | 銅のエッチング処理方法およびこの方法を用いてなる配線基板と半導体パッケージ |
| US20080224092A1 (en) * | 2007-03-15 | 2008-09-18 | Samsung Electronics Co., Ltd. | Etchant for metal |
| KR101310310B1 (ko) * | 2007-03-15 | 2013-09-23 | 주식회사 동진쎄미켐 | 박막트랜지스터 액정표시장치의 식각액 조성물 |
| US8518281B2 (en) * | 2008-06-03 | 2013-08-27 | Kesheng Feng | Acid-resistance promoting composition |
| KR101520921B1 (ko) * | 2008-11-07 | 2015-05-18 | 삼성디스플레이 주식회사 | 식각액 조성물, 이를 사용한 금속 패턴의 형성 방법 및 박막 트랜지스터 표시판의 제조 방법 |
| JP5604056B2 (ja) * | 2009-05-15 | 2014-10-08 | 関東化学株式会社 | 銅含有積層膜用エッチング液 |
| CN101807572A (zh) * | 2010-02-25 | 2010-08-18 | 友达光电股份有限公司 | 刻蚀液、主动组件阵列基板及其制作方法 |
| KR20120066950A (ko) * | 2010-12-15 | 2012-06-25 | 삼성전자주식회사 | 식각액, 이를 이용한 표시 장치 및 그 제조 방법 |
-
2011
- 2011-09-08 JP JP2011196394A patent/JP5885971B2/ja not_active Expired - Fee Related
-
2012
- 2012-09-05 SG SG2012065843A patent/SG188734A1/en unknown
- 2012-09-07 KR KR1020120099231A patent/KR20130028014A/ko not_active Withdrawn
- 2012-09-07 CN CN2012103305021A patent/CN102995021A/zh active Pending
- 2012-09-07 TW TW101132768A patent/TW201323661A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013058629A5 (enExample) | ||
| JP5885971B2 (ja) | 銅および銅合金のエッチング液 | |
| CN103526206B (zh) | 一种金属布线蚀刻液及利用其的金属布线形成方法 | |
| KR102080646B1 (ko) | 구리 및 티탄을 포함하는 다층막의 에칭에 사용되는 액체조성물, 및 이 조성물을 이용한 에칭방법, 다층막 배선의 제조방법, 기판 | |
| WO2011074601A1 (ja) | ルテニウム系金属のエッチング用組成物およびその調製方法 | |
| US9039915B2 (en) | Etching solution compositions for metal laminate films | |
| JP5682624B2 (ja) | 銅層及びモリブデン層を含む多層構造膜用エッチング液 | |
| TWI716518B (zh) | 銅蝕刻劑組成物之用途 | |
| JP2017502491A5 (enExample) | ||
| KR20100123652A (ko) | 구리 함유 적층 막용 에칭액 | |
| CN104562009A (zh) | 金属配线蚀刻液组合物及利用其的金属配线形成方法 | |
| TW201333266A (zh) | 含有銅層及／或銅合金層之金屬膜用蝕刻液組成物、及使用此金屬膜用蝕刻液組成物的蝕刻方法 | |
| KR20090007668A (ko) | 티탄, 알루미늄 금속 적층막 에칭액 조성물 | |
| JP5010873B2 (ja) | チタン、アルミニウム金属積層膜エッチング液組成物 | |
| TW201600645A (zh) | 蝕刻液組合物及使用其製造液晶顯示器用陣列基板的方法 | |
| TWI614550B (zh) | 液晶顯示裝置用陣列基板的製備方法及其多層膜用蝕刻液組合物 | |
| JP4749179B2 (ja) | チタン、アルミニウム金属積層膜エッチング液組成物 | |
| JP5152943B1 (ja) | 低遊離シアン金塩の製造方法 | |
| CN105274525B (zh) | 蚀刻液组合物及使用其制造液晶显示器用阵列基板的方法 | |
| CN107012465B (zh) | 一种铜蚀刻液及其应用 | |
| JP2019066332A5 (enExample) | ||
| KR100718529B1 (ko) | 평판디스플레이의 박막트랜지스터 형성을 위한 금속전극용식각액 조성물 | |
| JP5544898B2 (ja) | タングステンのエッチング液 | |
| CN114318340B (zh) | 一种蚀刻液组合物及其制备方法 | |
| KR102209690B1 (ko) | 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법 |