JP2013054281A5 - - Google Patents

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Publication number
JP2013054281A5
JP2013054281A5 JP2011193849A JP2011193849A JP2013054281A5 JP 2013054281 A5 JP2013054281 A5 JP 2013054281A5 JP 2011193849 A JP2011193849 A JP 2011193849A JP 2011193849 A JP2011193849 A JP 2011193849A JP 2013054281 A5 JP2013054281 A5 JP 2013054281A5
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JP
Japan
Prior art keywords
pixel electrode
electrode
switching element
active matrix
matrix substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011193849A
Other languages
English (en)
Japanese (ja)
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JP2013054281A (ja
JP5865634B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2011193849A priority Critical patent/JP5865634B2/ja
Priority claimed from JP2011193849A external-priority patent/JP5865634B2/ja
Priority to US13/604,452 priority patent/US9704742B2/en
Publication of JP2013054281A publication Critical patent/JP2013054281A/ja
Priority to US14/340,284 priority patent/US20140377952A1/en
Publication of JP2013054281A5 publication Critical patent/JP2013054281A5/ja
Application granted granted Critical
Publication of JP5865634B2 publication Critical patent/JP5865634B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011193849A 2011-09-06 2011-09-06 配線膜の製造方法 Active JP5865634B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011193849A JP5865634B2 (ja) 2011-09-06 2011-09-06 配線膜の製造方法
US13/604,452 US9704742B2 (en) 2011-09-06 2012-09-05 Wiring film and active matrix substrate using the same, and method for manufacturing wiring film
US14/340,284 US20140377952A1 (en) 2011-09-06 2014-07-24 Wiring film and active matrix substrate using the same, and method for manufacturing wiring film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011193849A JP5865634B2 (ja) 2011-09-06 2011-09-06 配線膜の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015249485A Division JP6072888B2 (ja) 2015-12-22 2015-12-22 配線膜およびそれを用いたアクティブマトリクス基板、並びに配線膜の製造方法

Publications (3)

Publication Number Publication Date
JP2013054281A JP2013054281A (ja) 2013-03-21
JP2013054281A5 true JP2013054281A5 (https=) 2014-09-18
JP5865634B2 JP5865634B2 (ja) 2016-02-17

Family

ID=47752427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011193849A Active JP5865634B2 (ja) 2011-09-06 2011-09-06 配線膜の製造方法

Country Status (2)

Country Link
US (2) US9704742B2 (https=)
JP (1) JP5865634B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015012048A (ja) * 2013-06-27 2015-01-19 三菱電機株式会社 アクティブマトリクス基板およびその製造方法
CN103605242B (zh) * 2013-11-21 2016-08-31 合肥京东方光电科技有限公司 一种阵列基板及其制备方法和显示装置
JP6287635B2 (ja) * 2014-06-30 2018-03-07 日立金属株式会社 半導体装置の製造方法および半導体装置
JP6562089B2 (ja) * 2016-02-01 2019-08-21 株式会社リコー 電界効果型トランジスタ及びその製造方法、表示素子、表示装置、システム
CN108231797A (zh) * 2018-01-03 2018-06-29 京东方科技集团股份有限公司 一种导电结构图案及其制备方法、阵列基板、显示装置
US11011381B2 (en) * 2018-07-27 2021-05-18 Texas Instruments Incorporated Patterning platinum by alloying and etching platinum alloy

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4425183A (en) * 1983-08-08 1984-01-10 Ncr Corporation Metal bevel process for multi-level metal semiconductor applications
US4556629A (en) * 1983-12-21 1985-12-03 Morton Thiokol, Inc. Developer composition for positive photoresists using solution with cyclic quaternary ammonium hydroxides
JPH06122982A (ja) 1992-10-13 1994-05-06 Matsushita Electric Ind Co Ltd アルミニウムを主成分とする金属薄膜のエッチング液組成物
JP2614403B2 (ja) 1993-08-06 1997-05-28 インターナショナル・ビジネス・マシーンズ・コーポレイション テーパエッチング方法
US6081308A (en) * 1996-11-21 2000-06-27 Samsung Electronics Co., Ltd. Method for manufacturing liquid crystal display
JP2001077098A (ja) 1999-09-03 2001-03-23 Toshiba Corp エッチング液、及びこれを用いる薄膜パターンの製造方法
JP2003127397A (ja) 2001-10-26 2003-05-08 Canon Inc 回路基板の製造方法
TWI245071B (en) * 2002-04-24 2005-12-11 Mitsubishi Chem Corp Etchant and method of etching
JP2005303003A (ja) * 2004-04-12 2005-10-27 Kobe Steel Ltd 表示デバイスおよびその製法
KR20060081470A (ko) * 2005-01-07 2006-07-13 삼성전자주식회사 박막트랜지스터 기판과 그 제조방법
JP2007123672A (ja) * 2005-10-31 2007-05-17 Mitsubishi Electric Corp 導電体構造、導電体構造の製造方法、素子基板および素子基板の製造方法
JP2007157755A (ja) 2005-11-30 2007-06-21 Kobe Steel Ltd 配線膜の形成方法
KR20070075808A (ko) * 2006-01-16 2007-07-24 삼성전자주식회사 표시 기판의 제조 방법 및 이를 이용하여 제조한 표시 기판
JP2008098611A (ja) * 2006-09-15 2008-04-24 Kobe Steel Ltd 表示装置
WO2008047667A1 (fr) * 2006-10-16 2008-04-24 Mitsui Mining & Smelting Co., Ltd. Film multicouche pour câblage et réalisation câblée
KR101365673B1 (ko) * 2006-11-24 2014-02-21 삼성디스플레이 주식회사 박막 트랜지스터, 이를 포함하는 박막 트랜지스터 기판 및이의 제조방법
CN101952485A (zh) * 2007-11-22 2011-01-19 出光兴产株式会社 蚀刻液组合物

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