JP2012520572A - インピーダンス制御ワイヤーボンド及び基準ワイヤーボンドを有するマイクロ電子アセンブリ - Google Patents
インピーダンス制御ワイヤーボンド及び基準ワイヤーボンドを有するマイクロ電子アセンブリ Download PDFInfo
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- JP2012520572A JP2012520572A JP2011554232A JP2011554232A JP2012520572A JP 2012520572 A JP2012520572 A JP 2012520572A JP 2011554232 A JP2011554232 A JP 2011554232A JP 2011554232 A JP2011554232 A JP 2011554232A JP 2012520572 A JP2012520572 A JP 2012520572A
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- 238000004377 microelectronic Methods 0.000 title claims abstract description 106
- 239000004020 conductor Substances 0.000 claims abstract description 74
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000000926 separation method Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0006—Interconnects
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- Power Engineering (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
【選択図】図1A
Description
本願は、2009年9月22日に出願の韓国特許出願第10−2009−0089471号からの優先権を主張し、2009年3月13日に出願の米国仮特許出願第61/210,063号の利益を主張し、それらの特許出願の開示内容を引用することにより本明細書の一部をなすものとする。
Z0=[138×log(4H/d)]/√εR Ω
Claims (13)
- マイクロ電子アセンブリであって、
その表面において露出するデバイスコンタクトを有するマイクロ電子デバイスと、
複数の信号コンタクト及び複数の基準コンタクトを有する相互接続素子であって、該基準コンタクトは基準電位の発生源に接続可能である、相互接続素子と、
前記デバイスコンタクトを前記信号コンタクトに接続する信号導体であって、前記マイクロ電子デバイスの前記表面の上方の経路内に延在する実質的な部分を有する、信号導体と、
前記基準コンタクトに接続され、前記信号導体の前記経路から少なくとも実質的に均等な間隔で配置される経路内に延在する実質的な部分を有する基準導体であって、前記信号導体のための所望のインピーダンスが達成されるように、該基準導体のうちの少なくとも1つが、前記相互接続素子の2つの基準コンタクトに接続される、基準導体と
を含んでなる、マイクロ電子アセンブリ。 - マイクロ電子アセンブリであって、
その表面上にデバイスコンタクトを有するマイクロ電子デバイスと、
複数の信号コンタクト及び複数の基準コンタクトを有する相互接続素子であって、該基準コンタクトは基準電位の発生源に接続可能である、相互接続素子と、
前記デバイスコンタクトを前記信号コンタクトに接続する信号導体であって、前記マイクロ電子デバイスの前記表面の上方の経路内に延在する実質的な部分を有する、信号導体と、
前記基準コンタクトに接続され、前記信号導体の前記経路のかなりの部分と少なくとも実質的に平行に延在する基準導体であって、該基準導体は、前記信号導体の上方、又は前記信号導体の下方のうちの少なくとも一方に配置され、前記信号導体のための所望のインピーダンスが達成されるように、該基準導体のうちの少なくとも1つが、前記相互接続素子の2つの基準コンタクトに接続される、基準導体と
を含んでなる、マイクロ電子アセンブリ。 - 前記信号導体のうちの少なくともいくつかの前記経路は第1の平面内に延在し、前記基準導体のうちの少なくともいくつかのかなりの部分が、前記第1の平面に対して少なくとも実質的に平行である第2の平面内に延在する、請求項1又は2に記載のマイクロ電子アセンブリ。
- 前記基準導体のかなりの部分が、前記信号導体の前記経路の長さの少なくとも約50%にわたって、前記信号導体の前記経路に対して少なくとも実質的に平行に延在する、請求項1又は2に記載のマイクロ電子アセンブリ。
- 前記信号導体は信号ボンドワイヤーを含み、前記基準導体は基準ボンドワイヤーを含む、請求項1又は2に記載のマイクロ電子アセンブリ。
- 前記信号導体は信号ボンドワイヤーであり、前記基準導体は基準ボンドワイヤーである、請求項1又は2に記載のマイクロ電子アセンブリ。
- 前記基準ボンドワイヤーのうちの少なくとも1つは、前記相互接続素子のそれぞれの基準コンタクトに結合される、請求項6に記載のマイクロ電子アセンブリ。
- 前記基準ボンドワイヤーは、前記信号ボンドワイヤーよりも前記マイクロ電子デバイスから高い場所に配置される第1の基準ボンドワイヤーと、前記信号ボンドワイヤーよりも前記マイクロ電子アセンブリから低い場所に配置される第2の基準ボンドワイヤーと、前記信号ボンドワイヤーの個々の信号ボンドワイヤー間に介在する第3の基準ボンドワイヤーとを含む、請求項1に記載のマイクロ電子アセンブリ。
- 前記基準ボンドワイヤーは、第1の端部と、該第1の端部から離れた第2の端部とを有し、前記基準ボンドワイヤーのうちの少なくとも1つは、前記基準コンタクトに接続される第1の端部と、前記デバイスコンタクトに接続される第2の端部とを有する、請求項5に記載のマイクロ電子アセンブリ。
- 前記表面は前面であり、前記マイクロ電子アセンブリは該前面から離れた背面と、該前面と該背面との間に延在するエッジとを有し、該背面は、前記信号ボンドワイヤー及び前記基準ボンドワイヤーが前記マイクロ電子デバイスの前記エッジを越えて延在するように、前記インターコネクト素子に取り付けられる、請求項6に記載のマイクロ電子アセンブリ。
- 前記経路のうちの少なくともいくつかは、前記マイクロ電子デバイスの前記表面に対して或る角度に傾けられる、請求項1又は2に記載のマイクロ電子アセンブリ。
- 前記複数の経路は前記信号ボンドワイヤーの少なくとも一部を含む、請求項5に記載のマイクロ電子アセンブリ。
- 前記信号ボンドワイヤーのうちの少なくとも1つは、複数の接続される段として階段状に延在し、前記基準ボンドワイヤーのうちの少なくとも1つは、そのような信号ボンドワイヤーのうちの少なくともいくつかの段から少なくとも実質的に均等な間隔を置いて階段状に延在する、請求項12に記載のマイクロ電子アセンブリ。
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KR10-2009-0089471 | 2009-09-22 | ||
KR1020090089471A KR100935854B1 (ko) | 2009-09-22 | 2009-09-22 | 와이어 본딩 및 기준 와이어 본딩에 의해 제어되는 임피던스를 가진 마이크로전자 어셈블리 |
PCT/US2010/027135 WO2010105152A2 (en) | 2009-03-13 | 2010-03-12 | Microelectronic assembly with impedance controlled wirebond and reference wirebond |
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JP2015027142A Pending JP2015135971A (ja) | 2009-03-13 | 2015-02-16 | インピーダンス制御ワイヤーボンド及び基準ワイヤーボンドを有するマイクロ電子アセンブリ |
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- 2010-03-12 TW TW103110628A patent/TW201431030A/zh unknown
- 2010-03-12 WO PCT/US2010/027135 patent/WO2010105152A2/en active Application Filing
- 2010-03-12 TW TW099107375A patent/TWI441297B/zh not_active IP Right Cessation
- 2010-03-12 CN CN201080020828.3A patent/CN102428557B/zh not_active Expired - Fee Related
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- 2010-03-12 JP JP2011554232A patent/JP2012520572A/ja active Pending
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2012
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US9030031B2 (en) | 2015-05-12 |
WO2010105152A3 (en) | 2011-10-27 |
US20140117567A1 (en) | 2014-05-01 |
KR100935854B1 (ko) | 2010-01-08 |
CN102428557A (zh) | 2012-04-25 |
US20100232128A1 (en) | 2010-09-16 |
TW201114001A (en) | 2011-04-16 |
US20130140716A1 (en) | 2013-06-06 |
TWI441297B (zh) | 2014-06-11 |
TW201431030A (zh) | 2014-08-01 |
US8253259B2 (en) | 2012-08-28 |
CN102428557B (zh) | 2015-01-07 |
US8624407B2 (en) | 2014-01-07 |
WO2010105152A2 (en) | 2010-09-16 |
JP2015135971A (ja) | 2015-07-27 |
EP2406822A2 (en) | 2012-01-18 |
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