JP2012244170A - 発光素子パッケージ及びこれを備える紫外線ランプ - Google Patents
発光素子パッケージ及びこれを備える紫外線ランプ Download PDFInfo
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
【解決手段】本発明の一実施形態による発光素子パッケージは、上部が開放された空洞を有してセラミック材質を含む本体と、前記本体内に空洞の底面と前記本体の下面との間の領域に配置された放熱部材と、前記空洞の底面に配置された複数の電極と、前記本体の下面に配置され前記複数の電極と電機的に接続された複数のパッドと、前記空洞の底面に配置された前記複数の電極のうち何れか一つの上に配置され、前記複数の電極と電気的に接続された発光ダイオードと、前記複数のパッドのうち少なくとも一つと前記放熱部材との間に配置され前記放熱部材の厚さより薄い厚さを有するバッファ層と、を備える。
【選択図】図4
Description
Claims (15)
- 上部が開放の空洞を有してセラミック材質を含む本体と、
前記空洞の底面と前記本体の下面との間の領域に配置された放熱部材と、
前記空洞の底面に配置された複数の電極と、
前記本体の下面の配置され、前記複数の電極と電気的に接続された複数のパッドと、
前記空洞の底面に配置された前記複数の電極のうち何れか一つの上に配置され、前記複数の電極と電機的に接続された発光ダイオードと、
前記複数のパッドのうち少なくとも一つと放熱部材との間に配置され、前記放熱部材の厚さより薄い厚さを有するバッファ層と
を備える発光素子パッケージ。 - 前記バッファ層は、前記本体と異なるセラミック材質を含む、請求項1に記載の発光素子パッケージ。
- 前記バッファ層内には、Al、Cr、Si、Ti、Zn、Zrのうち少なくとも一つを有する酸化物、窒化物、フッ化物、硫化物のような化合物のうち少なくとも一つを含む、請求項2に記載の発光素子パッケージ。
- 前記バッファ層は、前記パッドの物質と異なる金属材質を含む、請求項1に記載の発光素子パッケージ。
- 前記バッファ層は、前記複数のパッドのうち何れか一つの上面と前記放熱部材の下面に接触され、
前記バッファ層の上面は、下面より粗い、請求項1乃至4のいずれかに記載の発光素子パッケージ。 - 前記バッファ層は、前記放熱部材の幅より広い幅を有し、50μm以下の厚さに形成されている、請求項1乃至5のいずれかに記載の発光素子パッケージ。
- 前記バッファ層は、前記本体の下面と同じ面積を有する請求項1乃至6のいずれかに記載の発光素子パッケージ。
- 前記複数の電極のうちの第1電極は、前記発光ダイオードと前記放熱部材との間に前記放熱部材の上面の幅より広い幅に形成されている、請求項1乃至7のいずれかに記載の発光素子パッケージ。
- 前記放熱部材の上面周りに前記放熱部材の側面より前記本体の側方向に突出の突起を含む、請求項1乃至8のいずれかに記載の発光素子パッケージ。
- 前記空洞の底面に配置されて前記空洞の底面より低い深さに形成された複数の副空洞を含む、請求項1乃至9のいずれかに記載の発光素子パッケージ。
- 前記複数の副空洞のうち何れか一つに配置された保護素子を備える、請求項10に記載の発光素子パッケージ。
- 前記複数の副空洞の深さは、前記空洞の深さの1/2〜1/4の深さを有する、請求項10に記載の発光素子パッケージ。
- 前記空洞の周りに配置された金属層を備える、請求項1乃至12のいずれかに記載の発光素子パッケージ。
- 前記発光ダイオードは、紫外線発光ダイオードであり、
前記本体の空洞周りに前記本体の上面より低い上面の上に配置されたガラスフィルムを備える、請求項1乃至13のいずれかに記載の発光素子パッケージ。 - 発光素子パッケージと、
前記発光素子パッケージが配列されたモージュル基板と
を備え、
前記発光素子パッケージは、
上部が開放の空洞を有してセラミック材質を含む本体と、
前記本体内に空洞の底面と前記本体の下面との間の領域に配置された放熱部材と、
前記空洞の底面に配置された複数の電極と、
前記本体の下面に配置されて前記複数の電極と電機的に接続された複数のパッドと、
前記空洞の底面に配置された前記複数の電極のうち何れか一つの上に配置され、前記複数の電極と電機的に接続された発光ダイオードと、
前記複数のパッドのうち少なくとも一つと前記放熱部材との間に配置されて前記放熱部材の厚さより薄い厚さを有するバッファ層と
を備える、紫外線ランプ。
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KR10-2011-0045379 | 2011-05-13 | ||
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KR1020110045378A KR101869552B1 (ko) | 2011-05-13 | 2011-05-13 | 발광 소자 패키지 및 이를 구비한 자외선 램프 |
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JP2016134019A Division JP6144391B2 (ja) | 2011-05-13 | 2016-07-06 | 発光素子パッケージ |
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JP2016134019A Active JP6144391B2 (ja) | 2011-05-13 | 2016-07-06 | 発光素子パッケージ |
JP2017094172A Active JP6400782B2 (ja) | 2011-05-13 | 2017-05-10 | 発光素子パッケージ |
JP2018112131A Active JP6498820B2 (ja) | 2011-05-13 | 2018-06-12 | 発光素子パッケージ |
JP2019046940A Active JP6966761B2 (ja) | 2011-05-13 | 2019-03-14 | 発光素子パッケージ |
JP2021168120A Active JP7252665B2 (ja) | 2011-05-13 | 2021-10-13 | 発光素子パッケージ |
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JP2016134019A Active JP6144391B2 (ja) | 2011-05-13 | 2016-07-06 | 発光素子パッケージ |
JP2017094172A Active JP6400782B2 (ja) | 2011-05-13 | 2017-05-10 | 発光素子パッケージ |
JP2018112131A Active JP6498820B2 (ja) | 2011-05-13 | 2018-06-12 | 発光素子パッケージ |
JP2019046940A Active JP6966761B2 (ja) | 2011-05-13 | 2019-03-14 | 発光素子パッケージ |
JP2021168120A Active JP7252665B2 (ja) | 2011-05-13 | 2021-10-13 | 発光素子パッケージ |
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JP6966761B2 (ja) | 2021-11-17 |
CN106848033A (zh) | 2017-06-13 |
JP6498820B2 (ja) | 2019-04-10 |
CN102779932A (zh) | 2012-11-14 |
JP6400782B2 (ja) | 2018-10-03 |
JP2019117939A (ja) | 2019-07-18 |
EP2523230A3 (en) | 2015-12-02 |
JP2017143304A (ja) | 2017-08-17 |
JP2022009093A (ja) | 2022-01-14 |
JP5968674B2 (ja) | 2016-08-10 |
US20120286319A1 (en) | 2012-11-15 |
EP2523230B1 (en) | 2019-09-18 |
JP7252665B2 (ja) | 2023-04-05 |
CN106848033B (zh) | 2019-04-19 |
US10270021B2 (en) | 2019-04-23 |
EP2523230A2 (en) | 2012-11-14 |
CN102779932B (zh) | 2017-01-18 |
JP6144391B2 (ja) | 2017-06-07 |
US20190067544A1 (en) | 2019-02-28 |
US10811583B2 (en) | 2020-10-20 |
JP2016181726A (ja) | 2016-10-13 |
JP2018137488A (ja) | 2018-08-30 |
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