JP2012222537A - パッケージ、振動子、発振器及び電子機器 - Google Patents

パッケージ、振動子、発振器及び電子機器 Download PDF

Info

Publication number
JP2012222537A
JP2012222537A JP2011085160A JP2011085160A JP2012222537A JP 2012222537 A JP2012222537 A JP 2012222537A JP 2011085160 A JP2011085160 A JP 2011085160A JP 2011085160 A JP2011085160 A JP 2011085160A JP 2012222537 A JP2012222537 A JP 2012222537A
Authority
JP
Japan
Prior art keywords
main surface
base portion
package
bonding material
corner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011085160A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012222537A5 (enExample
Inventor
Katsumi Kuroda
勝巳 黒田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2011085160A priority Critical patent/JP2012222537A/ja
Priority to CN201210096452.5A priority patent/CN102739185B/zh
Priority to TW101111914A priority patent/TWI493663B/zh
Priority to KR1020120034300A priority patent/KR20120115107A/ko
Priority to US13/441,324 priority patent/US20120256695A1/en
Publication of JP2012222537A publication Critical patent/JP2012222537A/ja
Publication of JP2012222537A5 publication Critical patent/JP2012222537A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2011085160A 2011-04-07 2011-04-07 パッケージ、振動子、発振器及び電子機器 Withdrawn JP2012222537A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011085160A JP2012222537A (ja) 2011-04-07 2011-04-07 パッケージ、振動子、発振器及び電子機器
CN201210096452.5A CN102739185B (zh) 2011-04-07 2012-04-01 基底基板、振子、振荡器以及电子设备
TW101111914A TWI493663B (zh) 2011-04-07 2012-04-03 封裝、振動元件、發振器及電子機器
KR1020120034300A KR20120115107A (ko) 2011-04-07 2012-04-03 패키지, 진동자, 발진기 및 전자 기기
US13/441,324 US20120256695A1 (en) 2011-04-07 2012-04-06 Base substrate, resonator, oscillator, and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011085160A JP2012222537A (ja) 2011-04-07 2011-04-07 パッケージ、振動子、発振器及び電子機器

Publications (2)

Publication Number Publication Date
JP2012222537A true JP2012222537A (ja) 2012-11-12
JP2012222537A5 JP2012222537A5 (enExample) 2014-05-08

Family

ID=46965622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011085160A Withdrawn JP2012222537A (ja) 2011-04-07 2011-04-07 パッケージ、振動子、発振器及び電子機器

Country Status (5)

Country Link
US (1) US20120256695A1 (enExample)
JP (1) JP2012222537A (enExample)
KR (1) KR20120115107A (enExample)
CN (1) CN102739185B (enExample)
TW (1) TWI493663B (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015012452A (ja) * 2013-06-28 2015-01-19 京セラクリスタルデバイス株式会社 水晶デバイス
JP2015029177A (ja) * 2013-07-30 2015-02-12 京セラクリスタルデバイス株式会社 水晶デバイス
JP2015186095A (ja) * 2014-03-25 2015-10-22 京セラクリスタルデバイス株式会社 水晶デバイス
JP2016032185A (ja) * 2014-07-29 2016-03-07 京セラクリスタルデバイス株式会社 水晶デバイス
JP2016031949A (ja) * 2014-07-25 2016-03-07 株式会社リコー ウエハレベルパッケージング構造体及びその製造方法
JP2017038227A (ja) * 2015-08-10 2017-02-16 株式会社村田製作所 電子部品及びその製造方法
WO2025063007A1 (ja) * 2023-09-22 2025-03-27 株式会社大真空 圧電振動デバイス

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6163023B2 (ja) 2013-06-10 2017-07-12 日本電波工業株式会社 水晶デバイス及び水晶デバイスの製造方法
JP6183156B2 (ja) * 2013-10-30 2017-08-23 セイコーエプソン株式会社 パッケージ、振動デバイス、発振器、電子機器及び移動体
JP2015142240A (ja) * 2014-01-28 2015-08-03 セイコーエプソン株式会社 量子干渉ユニット、量子干渉装置、原子発振器、電子機器および移動体
KR102460754B1 (ko) 2016-03-17 2022-10-31 삼성전기주식회사 소자 패키지 및 그 제조방법
CN106374869A (zh) * 2016-08-31 2017-02-01 成都晶宝时频技术股份有限公司 一种贴片式石英晶体谐振器基座
KR102414843B1 (ko) * 2017-05-22 2022-06-30 삼성전기주식회사 음향파 디바이스 및 그 제조방법

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06152307A (ja) * 1992-11-11 1994-05-31 Meidensha Corp 表面実装形圧電振動子
JPH088685A (ja) * 1994-06-17 1996-01-12 Toshiba Corp 弾性表面波装置
JPH0884042A (ja) * 1994-09-14 1996-03-26 Citizen Watch Co Ltd パッケージ部材
JPH08340184A (ja) * 1995-06-13 1996-12-24 Shimeo Seimitsu Kk 電子部品収納用容器
JP2000049247A (ja) * 1998-07-29 2000-02-18 Nec Kansai Ltd 電子素子封止用パッケージ及び電子素子封止構体、並びに電子素子封止構体の製造方法
WO2001033631A1 (fr) * 1999-10-29 2001-05-10 Nikko Company Boitier pour dispositif haute frequence
JP2004153451A (ja) * 2002-10-29 2004-05-27 Nippon Dempa Kogyo Co Ltd 水晶振動子用ベース及びこれを用いた表面実装振動子
JP2004215039A (ja) * 2003-01-06 2004-07-29 Seiko Epson Corp 圧電デバイス、圧電デバイスの製造方法、位置決め用治具、携帯電話装置及び電子機器
JP2005033450A (ja) * 2003-07-11 2005-02-03 Murata Mfg Co Ltd 電子部品およびその製造方法
JP2007124591A (ja) * 2005-10-31 2007-05-17 Kyocera Kinseki Corp 通信モジュール
JP2010141415A (ja) * 2008-12-09 2010-06-24 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器及びその製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5987987A (en) * 1997-04-14 1999-11-23 Denso Corporation Angular velocity sensor, related method for manufacturing the sensor, and piezoelectric vibrator element used in this sensor
JP2002261570A (ja) * 2001-03-06 2002-09-13 Citizen Watch Co Ltd 水晶振動子用パッケージベースおよびそれを用いた水晶振動子パッケージ構造体の製造方法
US7034441B2 (en) * 2002-11-13 2006-04-25 Nihon Dempa Kogyo Co., Ltd Surface mount crystal unit and surface mount crystal oscillator
JP3918794B2 (ja) * 2002-12-10 2007-05-23 セイコーエプソン株式会社 圧電発振器およびその製造方法並びに電子機器
JP2005026411A (ja) * 2003-07-01 2005-01-27 Seiko Epson Corp 封止ガラス層の形成方法およびパッケージベース並びに圧電デバイス
JP4692722B2 (ja) * 2004-01-29 2011-06-01 セイコーエプソン株式会社 電子部品用パッケージおよび電子部品
CN1918783A (zh) * 2004-02-17 2007-02-21 精工爱普生株式会社 压电振荡器及其制造方法
CN2819647Y (zh) * 2005-08-02 2006-09-20 珠海粤科清华电子陶瓷有限公司 一种晶体振荡器的陶瓷封装件
JP2009194091A (ja) * 2008-02-13 2009-08-27 Seiko Instruments Inc 電子部品、電子機器、及びベース部材製造方法
TW201110275A (en) * 2009-05-13 2011-03-16 Seiko Instr Inc Electronic component, manufacturing method for electronic component, and electronic device
JP5058321B2 (ja) * 2009-11-11 2012-10-24 日本電波工業株式会社 表面実装水晶振動子及びその製造方法
JP5002696B2 (ja) * 2009-12-09 2012-08-15 日本電波工業株式会社 表面実装水晶振動子及びその製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06152307A (ja) * 1992-11-11 1994-05-31 Meidensha Corp 表面実装形圧電振動子
JPH088685A (ja) * 1994-06-17 1996-01-12 Toshiba Corp 弾性表面波装置
JPH0884042A (ja) * 1994-09-14 1996-03-26 Citizen Watch Co Ltd パッケージ部材
JPH08340184A (ja) * 1995-06-13 1996-12-24 Shimeo Seimitsu Kk 電子部品収納用容器
JP2000049247A (ja) * 1998-07-29 2000-02-18 Nec Kansai Ltd 電子素子封止用パッケージ及び電子素子封止構体、並びに電子素子封止構体の製造方法
WO2001033631A1 (fr) * 1999-10-29 2001-05-10 Nikko Company Boitier pour dispositif haute frequence
JP2004153451A (ja) * 2002-10-29 2004-05-27 Nippon Dempa Kogyo Co Ltd 水晶振動子用ベース及びこれを用いた表面実装振動子
JP2004215039A (ja) * 2003-01-06 2004-07-29 Seiko Epson Corp 圧電デバイス、圧電デバイスの製造方法、位置決め用治具、携帯電話装置及び電子機器
JP2005033450A (ja) * 2003-07-11 2005-02-03 Murata Mfg Co Ltd 電子部品およびその製造方法
JP2007124591A (ja) * 2005-10-31 2007-05-17 Kyocera Kinseki Corp 通信モジュール
JP2010141415A (ja) * 2008-12-09 2010-06-24 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶発振器及びその製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015012452A (ja) * 2013-06-28 2015-01-19 京セラクリスタルデバイス株式会社 水晶デバイス
JP2015029177A (ja) * 2013-07-30 2015-02-12 京セラクリスタルデバイス株式会社 水晶デバイス
JP2015186095A (ja) * 2014-03-25 2015-10-22 京セラクリスタルデバイス株式会社 水晶デバイス
JP2016031949A (ja) * 2014-07-25 2016-03-07 株式会社リコー ウエハレベルパッケージング構造体及びその製造方法
JP2016032185A (ja) * 2014-07-29 2016-03-07 京セラクリスタルデバイス株式会社 水晶デバイス
JP2017038227A (ja) * 2015-08-10 2017-02-16 株式会社村田製作所 電子部品及びその製造方法
WO2025063007A1 (ja) * 2023-09-22 2025-03-27 株式会社大真空 圧電振動デバイス

Also Published As

Publication number Publication date
CN102739185B (zh) 2015-10-28
CN102739185A (zh) 2012-10-17
KR20120115107A (ko) 2012-10-17
TWI493663B (zh) 2015-07-21
TW201244021A (en) 2012-11-01
US20120256695A1 (en) 2012-10-11

Similar Documents

Publication Publication Date Title
JP2012222537A (ja) パッケージ、振動子、発振器及び電子機器
CN104009730B (zh) 振动片、振子、振荡器、传感器以及电子设备
JP2015088877A (ja) パッケージ、振動デバイス、発振器、電子機器及び移動体
JP6136349B2 (ja) 電子デバイス、電子機器及び移動体
JP2013146003A (ja) 振動デバイス及び電子機器
JP2014068098A (ja) 振動片、振動デバイス、電子機器及び移動体
JP5505189B2 (ja) 振動デバイスおよび電子機器
JP2015041785A (ja) 振動片、振動子、発振器、電子機器及び移動体
JP2016129288A (ja) 電子デバイス、電子機器及び移動体
JP2012160996A (ja) 振動片、振動子、発振器及び電子機器
JP5377350B2 (ja) 圧電振動子及びこれを用いた発振器
CN105322910B (zh) 封装基体、封装、电子器件、电子设备和移动体
JP2005130341A (ja) 圧電部品及びその製造方法、通信装置
JP2014165910A (ja) 振動片、振動子、発振器、電子機器及び移動体
JP6256036B2 (ja) 振動子、発振器、電子機器及び移動体
JP2009183008A (ja) 圧電部品の製造方法
JP2012090083A (ja) 振動デバイス及び電子機器
JP2008259004A (ja) 圧電デバイスおよびその製造方法
JP2008066921A (ja) 圧電振動子
JP2007060593A (ja) 圧電デバイス及びその製造方法
JP2013168467A (ja) パッケージ、振動デバイス及び電子機器
JP2012134824A (ja) 振動片、振動子、発振器および電子機器
JP2013120867A (ja) パッケージ、電子デバイス及び電子機器
JP2013157701A (ja) パッケージ、振動デバイス及び電子機器
JP2013153038A (ja) パッケージ、振動デバイス及び電子機器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140318

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140318

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141216

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20150106

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150210

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20150602

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20150713