JP2012222317A - 反射樹脂シート、発光ダイオード装置およびその製造方法 - Google Patents
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Abstract
【解決手段】反射樹脂層4を、第1離型基材21の上面に設け、貫通孔9を、第1離型基材21および反射樹脂層4に、厚み方向を貫通するように形成することによって、反射樹脂シート13を用意し、反射樹脂シート13をダイオード基板2の上面に、反射樹脂層4とダイオード基板2とが接触するように、積層し、発光ダイオード素子3をダイオード基板2の上面に配置し、反射樹脂層4を、発光ダイオード素子3の側面に密着させ、第1離型基材21を反射樹脂層4から引き剥がすことにより、発光ダイオード装置1を得る。
【選択図】図2
Description
まず、反射樹脂シートを用意した(図2(b)参照)。
実施例1と同様にして、積層シートを形成し、貫通孔を形成し、続いて、反射樹脂シートを用意した(図4(a)および図4(b)参照)。
<蛍光体層の用意>
Y3Al5O12:Ceからなる蛍光体粒子(球形状、平均粒子径95nm)4g、バインダー樹脂としてpoly (vinyl butyl−co−vinyl alcohol co vinyl alcohol)(シグマアルドリッチ社製、重量平均分子量90000〜120000)0.21g、焼結助剤としてシリカ粉末(Cabot Corporation社製、商品名「CAB−O−SIL HS−5」)0.012g、および、メタノール10mLを乳鉢にて混合してスラリーとし、得られたスラリーをドライヤーにてメタノールを除去し、乾燥粉末を得た。
2 ダイオード基板
3 発光ダイオード素子
4 反射樹脂層
5 蛍光体層
9 貫通孔
13反射樹脂シート
21第1離型基材
23第2離型基材
Claims (7)
- 反射樹脂層を発光ダイオード素子の側方に設けるための反射樹脂シートであって、
第1離型基材、および、
前記第1離型基材の厚み方向一方面に設けられる前記反射樹脂層
を備え、
前記第1離型基材および前記反射樹脂層に、前記厚み方向を貫通する貫通孔が、前記反射樹脂層における前記貫通孔の内周面が前記発光ダイオード素子の側面と対向配置できるように、前記発光ダイオード素子に対応して形成されていることを特徴とする、反射樹脂シート。 - 反射樹脂層を、第1離型基材の厚み方向一方面に設ける工程、
貫通孔を、前記第1離型基材および前記反射樹脂層に、前記厚み方向を貫通するように形成することによって、請求項1に記載の反射樹脂シートを用意する工程、
前記反射樹脂シートを基材の前記厚み方向一方面に、前記反射樹脂層と前記基材とが接触するように、積層する工程、
発光ダイオード素子を前記基材の前記厚み方向一方面に配置する工程、
前記反射樹脂層を、前記発光ダイオード素子の側面に密着させる工程、および、
前記第1離型基材を前記反射樹脂層から引き剥がす工程
を備えていることを特徴とする、発光ダイオード装置の製造方法。 - 前記反射樹脂層を前記発光ダイオード素子の側面に密着させる工程では、
前記第1型基材を、前記基材に向けて押圧することを特徴とする、請求項2に記載の発光ダイオード装置の製造方法。 - 前記基材が、ダイオード基板であり、
前記発光ダイオード素子を前記基材に配置する工程では、
前記発光ダイオード素子を前記反射樹脂シートの前記貫通孔内に配置して、前記発光ダイオード素子を前記基材にフリップ実装することを特徴とする、請求項2または3に記載の発光ダイオード装置の製造方法。 - 前記基材が、第2離型基材であり、
前記基材を前記反射樹脂層および前記発光ダイオード素子から引き剥がす工程、および、
前記発光ダイオード素子をダイオード基板にフリップ実装する工程
をさらに備えていることを特徴とする、請求項2または3に記載の発光ダイオード装置の製造方法。 - ダイオード基板と、
前記ダイオード基板にフリップ実装された発光ダイオード素子と、
前記発光ダイオード素子の側面に密着する反射樹脂層と
を備えることを特徴とする、発光ダイオード装置。 - 前記発光ダイオード素子の前記厚み方向一方面に形成される蛍光体層
をさらに備えることを特徴とする、請求項6に記載の発光ダイオード装置。
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JP2011089939A JP5700544B2 (ja) | 2011-04-14 | 2011-04-14 | 発光ダイオード装置の製造方法 |
EP15158178.2A EP2903041A1 (en) | 2011-04-14 | 2012-03-28 | Reflecting resin sheet, light emitting diode device and producing method thereof |
EP12161748.4A EP2511966A3 (en) | 2011-04-14 | 2012-03-28 | Reflecting resin sheet, light emitting diode device and producing method thereof |
TW101112856A TW201242112A (en) | 2011-04-14 | 2012-04-11 | Reflecting resin sheet, light emitting diode device and producing method thereof |
KR1020120037774A KR20120117661A (ko) | 2011-04-14 | 2012-04-12 | 반사 수지 시트, 발광 다이오드 장치 및 그 제조 방법 |
US13/446,568 US20120262054A1 (en) | 2011-04-14 | 2012-04-13 | Reflecting resin sheet, light emitting diode device and producing method thereof |
CN201210111081.3A CN102738363B (zh) | 2011-04-14 | 2012-04-13 | 反射树脂片、发光二极管装置及其制造方法 |
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- 2012-04-12 KR KR1020120037774A patent/KR20120117661A/ko not_active Application Discontinuation
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US11894497B2 (en) | 2015-05-29 | 2024-02-06 | Nichia Corporation | Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device |
US10825967B2 (en) | 2015-05-29 | 2020-11-03 | Nichia Corporation | Light emitting device, method of manufacturing covering member, and method of manufacturing light emitting device |
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JP7235944B2 (ja) | 2018-02-21 | 2023-03-09 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
WO2020261892A1 (ja) * | 2019-06-28 | 2020-12-30 | 株式会社ブイ・テクノロジー | 電子部品実装構造、その実装方法、led表示パネル及びledチップ実装方法 |
WO2020262034A1 (ja) * | 2019-06-28 | 2020-12-30 | 株式会社ブイ・テクノロジー | 電子部品実装構造、その実装方法及びledチップ実装方法 |
Also Published As
Publication number | Publication date |
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EP2511966A3 (en) | 2014-08-20 |
EP2511966A2 (en) | 2012-10-17 |
US20120262054A1 (en) | 2012-10-18 |
CN102738363B (zh) | 2016-07-06 |
CN102738363A (zh) | 2012-10-17 |
JP5700544B2 (ja) | 2015-04-15 |
EP2903041A1 (en) | 2015-08-05 |
KR20120117661A (ko) | 2012-10-24 |
TW201242112A (en) | 2012-10-16 |
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