JP5700544B2 - 発光ダイオード装置の製造方法 - Google Patents
発光ダイオード装置の製造方法 Download PDFInfo
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- JP5700544B2 JP5700544B2 JP2011089939A JP2011089939A JP5700544B2 JP 5700544 B2 JP5700544 B2 JP 5700544B2 JP 2011089939 A JP2011089939 A JP 2011089939A JP 2011089939 A JP2011089939 A JP 2011089939A JP 5700544 B2 JP5700544 B2 JP 5700544B2
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- emitting diode
- light emitting
- reflective resin
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- diode element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Description
まず、反射樹脂シートを用意した(図2(b)参照)。
実施例1と同様にして、積層シートを形成し、貫通孔を形成し、続いて、反射樹脂シートを用意した(図4(a)および図4(b)参照)。
<蛍光体層の用意>
Y3Al5O12:Ceからなる蛍光体粒子(球形状、平均粒子径95nm)4g、バインダー樹脂としてpoly (vinyl butyl−co−vinyl alcohol co vinyl alcohol)(シグマアルドリッチ社製、重量平均分子量90000〜120000)0.21g、焼結助剤としてシリカ粉末(Cabot Corporation社製、商品名「CAB−O−SIL HS−5」)0.012g、および、メタノール10mLを乳鉢にて混合してスラリーとし、得られたスラリーをドライヤーにてメタノールを除去し、乾燥粉末を得た。
2 ダイオード基板
3 発光ダイオード素子
4 反射樹脂層
5 蛍光体層
9 貫通孔
13反射樹脂シート
21第1離型基材
23第2離型基材
Claims (4)
- 反射樹脂層を、第1離型基材の厚み方向一方面に設ける工程、
貫通孔を、前記第1離型基材および前記反射樹脂層に、前記厚み方向を貫通するように形成することによって、請求項1に記載の反射樹脂シートを用意する工程、
前記反射樹脂シートを基材の前記厚み方向一方面に、前記反射樹脂層と前記基材とが接触するように、積層する工程、
発光ダイオード素子を前記基材の前記厚み方向一方面に配置する工程、
前記反射樹脂層を、前記発光ダイオード素子の側面に密着させる工程、および、
前記第1離型基材を前記反射樹脂層から引き剥がす工程
を備えていることを特徴とする、発光ダイオード装置の製造方法。 - 前記反射樹脂層を前記発光ダイオード素子の側面に密着させる工程では、
前記第1離型基材を、前記基材に向けて押圧することを特徴とする、請求項1に記載の発光ダイオード装置の製造方法。 - 前記基材が、ダイオード基板であり、
前記発光ダイオード素子を前記基材に配置する工程では、
前記発光ダイオード素子を前記反射樹脂シートの前記貫通孔内に配置して、前記発光ダイオード素子を前記基材にフリップ実装することを特徴とする、請求項1または2に記載の発光ダイオード装置の製造方法。 - 前記基材が、第2離型基材であり、
前記基材を前記反射樹脂層および前記発光ダイオード素子から引き剥がす工程、および、
前記発光ダイオード素子をダイオード基板にフリップ実装する工程
をさらに備えていることを特徴とする、請求項1または2に記載の発光ダイオード装置の製造方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011089939A JP5700544B2 (ja) | 2011-04-14 | 2011-04-14 | 発光ダイオード装置の製造方法 |
EP15158178.2A EP2903041A1 (en) | 2011-04-14 | 2012-03-28 | Reflecting resin sheet, light emitting diode device and producing method thereof |
EP12161748.4A EP2511966A3 (en) | 2011-04-14 | 2012-03-28 | Reflecting resin sheet, light emitting diode device and producing method thereof |
TW101112856A TW201242112A (en) | 2011-04-14 | 2012-04-11 | Reflecting resin sheet, light emitting diode device and producing method thereof |
KR1020120037774A KR20120117661A (ko) | 2011-04-14 | 2012-04-12 | 반사 수지 시트, 발광 다이오드 장치 및 그 제조 방법 |
CN201210111081.3A CN102738363B (zh) | 2011-04-14 | 2012-04-13 | 反射树脂片、发光二极管装置及其制造方法 |
US13/446,568 US20120262054A1 (en) | 2011-04-14 | 2012-04-13 | Reflecting resin sheet, light emitting diode device and producing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011089939A JP5700544B2 (ja) | 2011-04-14 | 2011-04-14 | 発光ダイオード装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012222317A JP2012222317A (ja) | 2012-11-12 |
JP5700544B2 true JP5700544B2 (ja) | 2015-04-15 |
Family
ID=45936967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011089939A Expired - Fee Related JP5700544B2 (ja) | 2011-04-14 | 2011-04-14 | 発光ダイオード装置の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20120262054A1 (ja) |
EP (2) | EP2511966A3 (ja) |
JP (1) | JP5700544B2 (ja) |
KR (1) | KR20120117661A (ja) |
CN (1) | CN102738363B (ja) |
TW (1) | TW201242112A (ja) |
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2011
- 2011-04-14 JP JP2011089939A patent/JP5700544B2/ja not_active Expired - Fee Related
-
2012
- 2012-03-28 EP EP12161748.4A patent/EP2511966A3/en not_active Withdrawn
- 2012-03-28 EP EP15158178.2A patent/EP2903041A1/en not_active Withdrawn
- 2012-04-11 TW TW101112856A patent/TW201242112A/zh unknown
- 2012-04-12 KR KR1020120037774A patent/KR20120117661A/ko not_active Application Discontinuation
- 2012-04-13 US US13/446,568 patent/US20120262054A1/en not_active Abandoned
- 2012-04-13 CN CN201210111081.3A patent/CN102738363B/zh not_active Expired - Fee Related
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JP2012222317A (ja) | 2012-11-12 |
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CN102738363A (zh) | 2012-10-17 |
CN102738363B (zh) | 2016-07-06 |
TW201242112A (en) | 2012-10-16 |
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EP2903041A1 (en) | 2015-08-05 |
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