JP2012164697A - 電力用パワーモジュール及び電力用半導体装置 - Google Patents

電力用パワーモジュール及び電力用半導体装置 Download PDF

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Publication number
JP2012164697A
JP2012164697A JP2011021679A JP2011021679A JP2012164697A JP 2012164697 A JP2012164697 A JP 2012164697A JP 2011021679 A JP2011021679 A JP 2011021679A JP 2011021679 A JP2011021679 A JP 2011021679A JP 2012164697 A JP2012164697 A JP 2012164697A
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Japan
Prior art keywords
power
semiconductor element
power semiconductor
heat spreader
power module
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Pending
Application number
JP2011021679A
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English (en)
Japanese (ja)
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JP2012164697A5 (enExample
Inventor
Yasushi Nakajima
泰 中島
Noriyuki Betsushiba
範之 別芝
Hirotoshi Maekawa
博敏 前川
Seiji Ishibashi
誠司 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2011021679A priority Critical patent/JP2012164697A/ja
Publication of JP2012164697A publication Critical patent/JP2012164697A/ja
Publication of JP2012164697A5 publication Critical patent/JP2012164697A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07552—Controlling the environment, e.g. atmosphere composition or temperature changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2011021679A 2011-02-03 2011-02-03 電力用パワーモジュール及び電力用半導体装置 Pending JP2012164697A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011021679A JP2012164697A (ja) 2011-02-03 2011-02-03 電力用パワーモジュール及び電力用半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011021679A JP2012164697A (ja) 2011-02-03 2011-02-03 電力用パワーモジュール及び電力用半導体装置

Publications (2)

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JP2012164697A true JP2012164697A (ja) 2012-08-30
JP2012164697A5 JP2012164697A5 (enExample) 2013-08-01

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ID=46843838

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JP2011021679A Pending JP2012164697A (ja) 2011-02-03 2011-02-03 電力用パワーモジュール及び電力用半導体装置

Country Status (1)

Country Link
JP (1) JP2012164697A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015029186A1 (ja) * 2013-08-29 2015-03-05 三菱電機株式会社 半導体モジュール、半導体装置、及び自動車
JP2016096302A (ja) * 2014-11-17 2016-05-26 トヨタ自動車株式会社 半導体装置とその製造方法
WO2016125669A1 (ja) * 2015-02-02 2016-08-11 株式会社村田製作所 半導体モジュール
WO2017138402A1 (ja) * 2016-02-08 2017-08-17 ローム株式会社 半導体装置、パワーモジュール、およびその製造方法
JP2018063999A (ja) * 2016-10-11 2018-04-19 トヨタ自動車株式会社 半導体装置
CN115023805A (zh) * 2020-02-06 2022-09-06 三菱电机株式会社 半导体模块和电力变换装置
JP2023033668A (ja) * 2021-08-30 2023-03-13 株式会社 日立パワーデバイス 半導体装置及びその製造方法
WO2024004026A1 (ja) * 2022-06-28 2024-01-04 三菱電機株式会社 半導体装置及び電力変換装置
WO2025010223A1 (en) * 2023-07-03 2025-01-09 Tesla, Inc. Semiconductor device package with improved cooling

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556648A (en) * 1978-10-20 1980-04-25 Toshiba Corp Semiconductor device
JPS5867050A (ja) * 1981-10-16 1983-04-21 Nec Corp 樹脂封止型半導体装置
JPH09213844A (ja) * 1995-09-04 1997-08-15 Anam Ind Co Inc 二重封止部を有するヒートシンク内装型半導体パッケージ及びその製造方法
JPH11243165A (ja) * 1998-12-22 1999-09-07 Sanken Electric Co Ltd 半導体装置
JP2010114257A (ja) * 2008-11-06 2010-05-20 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2010219420A (ja) * 2009-03-18 2010-09-30 Fuji Electric Systems Co Ltd 半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5556648A (en) * 1978-10-20 1980-04-25 Toshiba Corp Semiconductor device
JPS5867050A (ja) * 1981-10-16 1983-04-21 Nec Corp 樹脂封止型半導体装置
JPH09213844A (ja) * 1995-09-04 1997-08-15 Anam Ind Co Inc 二重封止部を有するヒートシンク内装型半導体パッケージ及びその製造方法
JPH11243165A (ja) * 1998-12-22 1999-09-07 Sanken Electric Co Ltd 半導体装置
JP2010114257A (ja) * 2008-11-06 2010-05-20 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2010219420A (ja) * 2009-03-18 2010-09-30 Fuji Electric Systems Co Ltd 半導体装置

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11239123B2 (en) * 2013-08-29 2022-02-01 Mitsubishi Electric Corporation Semiconductor module, semiconductor device, and vehicle
CN105493272A (zh) * 2013-08-29 2016-04-13 三菱电机株式会社 半导体模块、半导体装置以及汽车
US20160111345A1 (en) * 2013-08-29 2016-04-21 Mitsubishi Electric Corporation Semiconductor module, semiconductor device, and vehicle
JPWO2015029186A1 (ja) * 2013-08-29 2017-03-02 三菱電機株式会社 半導体モジュール、半導体装置、及び自動車
WO2015029186A1 (ja) * 2013-08-29 2015-03-05 三菱電機株式会社 半導体モジュール、半導体装置、及び自動車
CN105493272B (zh) * 2013-08-29 2019-03-15 三菱电机株式会社 半导体模块、半导体装置以及汽车
DE112013007390B4 (de) 2013-08-29 2020-06-25 Mitsubishi Electric Corporation Halbleitermodul, Halbleitervorrichtung und Fahrzeug
JP2016096302A (ja) * 2014-11-17 2016-05-26 トヨタ自動車株式会社 半導体装置とその製造方法
WO2016125669A1 (ja) * 2015-02-02 2016-08-11 株式会社村田製作所 半導体モジュール
JPWO2016125669A1 (ja) * 2015-02-02 2017-10-12 株式会社村田製作所 半導体モジュール
WO2017138402A1 (ja) * 2016-02-08 2017-08-17 ローム株式会社 半導体装置、パワーモジュール、およびその製造方法
JP2018063999A (ja) * 2016-10-11 2018-04-19 トヨタ自動車株式会社 半導体装置
CN115023805A (zh) * 2020-02-06 2022-09-06 三菱电机株式会社 半导体模块和电力变换装置
JP2023033668A (ja) * 2021-08-30 2023-03-13 株式会社 日立パワーデバイス 半導体装置及びその製造方法
JP7619723B2 (ja) 2021-08-30 2025-01-22 ミネベアパワーデバイス株式会社 半導体装置及びその製造方法
WO2024004026A1 (ja) * 2022-06-28 2024-01-04 三菱電機株式会社 半導体装置及び電力変換装置
JP7493686B1 (ja) * 2022-06-28 2024-05-31 三菱電機株式会社 半導体装置及び電力変換装置
WO2025010223A1 (en) * 2023-07-03 2025-01-09 Tesla, Inc. Semiconductor device package with improved cooling

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