JP2012160500A - 回路基板、半導体部品、半導体装置、回路基板の製造方法、半導体部品の製造方法及び半導体装置の製造方法 - Google Patents

回路基板、半導体部品、半導体装置、回路基板の製造方法、半導体部品の製造方法及び半導体装置の製造方法 Download PDF

Info

Publication number
JP2012160500A
JP2012160500A JP2011017407A JP2011017407A JP2012160500A JP 2012160500 A JP2012160500 A JP 2012160500A JP 2011017407 A JP2011017407 A JP 2011017407A JP 2011017407 A JP2011017407 A JP 2011017407A JP 2012160500 A JP2012160500 A JP 2012160500A
Authority
JP
Japan
Prior art keywords
copper
oxide layer
copper oxide
layer
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011017407A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012160500A5 (enExample
Inventor
Hiroshi Asami
浅見　　博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2011017407A priority Critical patent/JP2012160500A/ja
Priority to CN2012100193448A priority patent/CN102625575A/zh
Priority to US13/357,046 priority patent/US8987899B2/en
Publication of JP2012160500A publication Critical patent/JP2012160500A/ja
Publication of JP2012160500A5 publication Critical patent/JP2012160500A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W70/093—
    • H10W74/012—
    • H10W74/127—
    • H10W74/15—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H10W70/635—
    • H10W72/01271—
    • H10W72/072—
    • H10W72/07211—
    • H10W72/07236—
    • H10W72/241—
    • H10W72/252—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
JP2011017407A 2011-01-31 2011-01-31 回路基板、半導体部品、半導体装置、回路基板の製造方法、半導体部品の製造方法及び半導体装置の製造方法 Pending JP2012160500A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011017407A JP2012160500A (ja) 2011-01-31 2011-01-31 回路基板、半導体部品、半導体装置、回路基板の製造方法、半導体部品の製造方法及び半導体装置の製造方法
CN2012100193448A CN102625575A (zh) 2011-01-31 2012-01-20 电路板、半导体元件、半导体装置及其制造方法
US13/357,046 US8987899B2 (en) 2011-01-31 2012-01-24 Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011017407A JP2012160500A (ja) 2011-01-31 2011-01-31 回路基板、半導体部品、半導体装置、回路基板の製造方法、半導体部品の製造方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2012160500A true JP2012160500A (ja) 2012-08-23
JP2012160500A5 JP2012160500A5 (enExample) 2014-03-13

Family

ID=46565187

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011017407A Pending JP2012160500A (ja) 2011-01-31 2011-01-31 回路基板、半導体部品、半導体装置、回路基板の製造方法、半導体部品の製造方法及び半導体装置の製造方法

Country Status (3)

Country Link
US (1) US8987899B2 (enExample)
JP (1) JP2012160500A (enExample)
CN (1) CN102625575A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014127649A (ja) * 2012-12-27 2014-07-07 Hitachi Chemical Dupont Microsystems Ltd 半導体装置の製造方法
KR101497192B1 (ko) * 2012-12-27 2015-02-27 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
JP2016086069A (ja) * 2014-10-24 2016-05-19 三菱電機株式会社 半導体素子および半導体装置
JP2017092152A (ja) * 2015-11-05 2017-05-25 日立化成デュポンマイクロシステムズ株式会社 多層体、その製造方法及び半導体装置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9659893B2 (en) 2011-12-21 2017-05-23 Mediatek Inc. Semiconductor package
US8633588B2 (en) 2011-12-21 2014-01-21 Mediatek Inc. Semiconductor package
US9461008B2 (en) * 2012-08-16 2016-10-04 Qualcomm Incorporated Solder on trace technology for interconnect attachment
KR102306673B1 (ko) 2014-09-22 2021-09-29 삼성전자주식회사 반도체 패키지 및 그 제조 방법
CN106604540B (zh) * 2015-10-19 2019-08-13 南昌欧菲光电技术有限公司 电路板
TWI713166B (zh) * 2020-02-17 2020-12-11 頎邦科技股份有限公司 晶片封裝構造及其電路板
CN114664666A (zh) * 2022-03-18 2022-06-24 合肥矽迈微电子科技有限公司 一种提高导通性能的半导体封装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312465A (ja) * 1996-05-21 1997-12-02 Omron Corp 回路基板及びその製造方法
JP2005252162A (ja) * 2004-03-08 2005-09-15 Sharp Corp 半導体装置及びその製造方法
JP2006237151A (ja) * 2005-02-23 2006-09-07 Shinko Electric Ind Co Ltd 配線基板および半導体装置
WO2010061428A1 (ja) * 2008-11-28 2010-06-03 富士通株式会社 電子装置の製造方法、電子部品搭載用基板及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3420076B2 (ja) 1998-08-31 2003-06-23 新光電気工業株式会社 フリップチップ実装基板の製造方法及びフリップチップ実装基板及びフリップチップ実装構造
US6770971B2 (en) * 2002-06-14 2004-08-03 Casio Computer Co., Ltd. Semiconductor device and method of fabricating the same
US8133762B2 (en) * 2009-03-17 2012-03-13 Stats Chippac, Ltd. Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core
US8193034B2 (en) * 2006-11-10 2012-06-05 Stats Chippac, Ltd. Semiconductor device and method of forming vertical interconnect structure using stud bumps

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09312465A (ja) * 1996-05-21 1997-12-02 Omron Corp 回路基板及びその製造方法
JP2005252162A (ja) * 2004-03-08 2005-09-15 Sharp Corp 半導体装置及びその製造方法
JP2006237151A (ja) * 2005-02-23 2006-09-07 Shinko Electric Ind Co Ltd 配線基板および半導体装置
WO2010061428A1 (ja) * 2008-11-28 2010-06-03 富士通株式会社 電子装置の製造方法、電子部品搭載用基板及びその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014127649A (ja) * 2012-12-27 2014-07-07 Hitachi Chemical Dupont Microsystems Ltd 半導体装置の製造方法
KR101497192B1 (ko) * 2012-12-27 2015-02-27 삼성전기주식회사 전자부품 내장 인쇄회로기판 및 그 제조방법
US10015884B2 (en) 2012-12-27 2018-07-03 Samsung Electro-Mechanics Co., Ltd. Printed circuit board including embedded electronic component and method for manufacturing the same
US10887995B2 (en) 2012-12-27 2021-01-05 Samsung Electro-Mechanics Co., Ltd. Method for manufacturing a printed circuit board including an embedded electronic component
JP2016086069A (ja) * 2014-10-24 2016-05-19 三菱電機株式会社 半導体素子および半導体装置
JP2017092152A (ja) * 2015-11-05 2017-05-25 日立化成デュポンマイクロシステムズ株式会社 多層体、その製造方法及び半導体装置

Also Published As

Publication number Publication date
US20120267778A1 (en) 2012-10-25
CN102625575A (zh) 2012-08-01
US8987899B2 (en) 2015-03-24

Similar Documents

Publication Publication Date Title
JP2012160500A (ja) 回路基板、半導体部品、半導体装置、回路基板の製造方法、半導体部品の製造方法及び半導体装置の製造方法
JP5113114B2 (ja) 配線基板の製造方法及び配線基板
JP5645592B2 (ja) 半導体装置の製造方法
TW200525666A (en) Bump-on-lead flip chip interconnection
CN106463472B (zh) 半导体器件及制造其的方法
CN103794515B (zh) 芯片封装基板和结构及其制作方法
JP2012114431A (ja) 半導体搭載用基板、半導体装置及び半導体装置の製造方法
JP4729963B2 (ja) 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法
WO2015198838A1 (ja) 半導体装置およびその製造方法
KR20110112974A (ko) 패키지 기판 및 그의 제조방법
JP2008147458A (ja) プリント配線板およびその製造方法
JP2012004505A (ja) 半導体装置及びその製造方法
WO2015198837A1 (ja) 半導体装置およびその製造方法
JP2009049248A (ja) 半導体装置及びその製造方法
JP2008244186A (ja) 回路基板、半導体装置、及び半田バンプの形成方法
JP2019125709A (ja) 配線基板及びその製造方法と電子部品装置
JP5699610B2 (ja) 実装構造体及びその製造方法、並びに、電子装置
JP2010171125A (ja) 半導体装置およびその製造方法
JP2007123443A (ja) 回路基板、半導体装置、及び半導体装置の製造方法
CN204067332U (zh) 基于基板的凸点倒装芯片csp封装件
JP5516619B2 (ja) 電子部品の製造方法
JP2005268346A (ja) 半導体パッケージ基板とその製造方法
JP5685807B2 (ja) 電子装置
JP6216157B2 (ja) 電子部品装置及びその製造方法
JP4736762B2 (ja) Ｂｇａ型半導体装置及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140123

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140123

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141028

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141125

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20150407