JP2012111875A - 硬化性樹脂組成物及び硬化物 - Google Patents

硬化性樹脂組成物及び硬化物 Download PDF

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Publication number
JP2012111875A
JP2012111875A JP2010262919A JP2010262919A JP2012111875A JP 2012111875 A JP2012111875 A JP 2012111875A JP 2010262919 A JP2010262919 A JP 2010262919A JP 2010262919 A JP2010262919 A JP 2010262919A JP 2012111875 A JP2012111875 A JP 2012111875A
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Japan
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group
ladder
groups
resin composition
curable resin
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Pending
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JP2010262919A
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English (en)
Japanese (ja)
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JP2012111875A5 (enrdf_load_stackoverflow
Inventor
Yoshiaki Kamuro
恵明 禿
Keizo Inoue
慶三 井上
Hirofumi Fubetsu
博文 不別
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Daicel Corp
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Daicel Corp
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Application filed by Daicel Corp filed Critical Daicel Corp
Priority to JP2010262919A priority Critical patent/JP2012111875A/ja
Priority to CN201180050103.3A priority patent/CN103154145B/zh
Priority to PCT/JP2011/076792 priority patent/WO2012070525A1/ja
Priority to KR1020137016336A priority patent/KR20140006811A/ko
Publication of JP2012111875A publication Critical patent/JP2012111875A/ja
Publication of JP2012111875A5 publication Critical patent/JP2012111875A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2010262919A 2010-11-25 2010-11-25 硬化性樹脂組成物及び硬化物 Pending JP2012111875A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010262919A JP2012111875A (ja) 2010-11-25 2010-11-25 硬化性樹脂組成物及び硬化物
CN201180050103.3A CN103154145B (zh) 2010-11-25 2011-11-21 固化性树脂组合物及固化物
PCT/JP2011/076792 WO2012070525A1 (ja) 2010-11-25 2011-11-21 硬化性樹脂組成物及び硬化物
KR1020137016336A KR20140006811A (ko) 2010-11-25 2011-11-21 경화성 수지 조성물 및 경화물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010262919A JP2012111875A (ja) 2010-11-25 2010-11-25 硬化性樹脂組成物及び硬化物

Publications (2)

Publication Number Publication Date
JP2012111875A true JP2012111875A (ja) 2012-06-14
JP2012111875A5 JP2012111875A5 (enrdf_load_stackoverflow) 2014-01-09

Family

ID=46145867

Family Applications (1)

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JP2010262919A Pending JP2012111875A (ja) 2010-11-25 2010-11-25 硬化性樹脂組成物及び硬化物

Country Status (4)

Country Link
JP (1) JP2012111875A (enrdf_load_stackoverflow)
KR (1) KR20140006811A (enrdf_load_stackoverflow)
CN (1) CN103154145B (enrdf_load_stackoverflow)
WO (1) WO2012070525A1 (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012233117A (ja) * 2011-05-06 2012-11-29 Kaneka Corp 硬化性組成物
JP2013056981A (ja) * 2011-09-07 2013-03-28 Daicel Corp ラダー型シルセスキオキサン及びその製造方法、並びに、硬化性樹脂組成物及びその硬化物
JP2014129477A (ja) * 2012-12-28 2014-07-10 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2014109349A1 (ja) * 2013-01-09 2014-07-17 株式会社ダイセル 硬化性樹脂組成物及びその硬化物
WO2014125964A1 (ja) * 2013-02-14 2014-08-21 株式会社ダイセル 硬化性樹脂組成物、硬化物、封止材、及び半導体装置
JP2015110694A (ja) * 2013-12-06 2015-06-18 サンユレック株式会社 シリコーン樹脂組成物
JP2016216599A (ja) * 2015-05-20 2016-12-22 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物
JP2021536519A (ja) * 2018-08-31 2021-12-27 ワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG 硬化性オルガノポリシロキサン組成物、封止材及び半導体デバイス

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103547632A (zh) * 2011-07-14 2014-01-29 积水化学工业株式会社 光半导体装置用密封剂及光半导体装置
CN104583326B (zh) * 2013-08-01 2016-03-02 株式会社大赛璐 固化性树脂组合物及使用其的半导体装置
WO2015016001A1 (ja) * 2013-08-02 2015-02-05 株式会社ダイセル 硬化性樹脂組成物及びそれを用いた半導体装置
CN105209549B (zh) * 2013-08-06 2016-10-26 株式会社大赛璐 固化性树脂组合物及使用其的半导体装置
CN106459584A (zh) * 2014-06-06 2017-02-22 株式会社大赛璐 固化性树脂组合物、固化物、密封材料及半导体装置
JP6344333B2 (ja) * 2015-08-05 2018-06-20 信越化学工業株式会社 付加硬化性シリコーンゴム組成物
CN111909527B (zh) * 2019-05-10 2021-09-28 中国科学院化学研究所 可交联的有机硅组合物及反应产物及制备方法和应用

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002348473A (ja) * 2001-05-23 2002-12-04 Asahi Denka Kogyo Kk 硬化性組成物
JP2002356617A (ja) * 2001-05-30 2002-12-13 Asahi Denka Kogyo Kk 硬化性組成物
JP2005068268A (ja) * 2003-08-22 2005-03-17 Ge Toshiba Silicones Co Ltd 光学材料用硬化性組成物
JP2005105217A (ja) * 2003-10-01 2005-04-21 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2005307015A (ja) * 2004-04-22 2005-11-04 Ge Toshiba Silicones Co Ltd 光学材料封止用硬化性組成物
JP2007008996A (ja) * 2005-06-28 2007-01-18 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP2009270101A (ja) * 2008-04-11 2009-11-19 Momentive Performance Materials Inc 半導体用硬化性シリコーン組成物及びそれを用いた半導体装置
JP2010001336A (ja) * 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2010001335A (ja) * 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2011246680A (ja) * 2010-05-31 2011-12-08 Shin-Etsu Chemical Co Ltd 発光ダイオード用付加硬化型シリコーン樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1058730C (zh) * 1994-01-21 2000-11-22 中国科学院化学研究所 高规整性梯形聚氢倍半硅氧烷及其共聚物和它们的制法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002348473A (ja) * 2001-05-23 2002-12-04 Asahi Denka Kogyo Kk 硬化性組成物
JP2002356617A (ja) * 2001-05-30 2002-12-13 Asahi Denka Kogyo Kk 硬化性組成物
JP2005068268A (ja) * 2003-08-22 2005-03-17 Ge Toshiba Silicones Co Ltd 光学材料用硬化性組成物
JP2005105217A (ja) * 2003-10-01 2005-04-21 Dow Corning Toray Silicone Co Ltd 硬化性オルガノポリシロキサン組成物および半導体装置
JP2005307015A (ja) * 2004-04-22 2005-11-04 Ge Toshiba Silicones Co Ltd 光学材料封止用硬化性組成物
JP2007008996A (ja) * 2005-06-28 2007-01-18 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン樹脂組成物および光学部材
JP2009270101A (ja) * 2008-04-11 2009-11-19 Momentive Performance Materials Inc 半導体用硬化性シリコーン組成物及びそれを用いた半導体装置
JP2010001336A (ja) * 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2010001335A (ja) * 2008-06-18 2010-01-07 Dow Corning Toray Co Ltd 硬化性オルガノポリシロキサン組成物及び半導体装置
JP2011246680A (ja) * 2010-05-31 2011-12-08 Shin-Etsu Chemical Co Ltd 発光ダイオード用付加硬化型シリコーン樹脂組成物

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012233117A (ja) * 2011-05-06 2012-11-29 Kaneka Corp 硬化性組成物
JP2013056981A (ja) * 2011-09-07 2013-03-28 Daicel Corp ラダー型シルセスキオキサン及びその製造方法、並びに、硬化性樹脂組成物及びその硬化物
JP2014129477A (ja) * 2012-12-28 2014-07-10 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
US9646904B2 (en) 2013-01-09 2017-05-09 Daicel Corporation Curable resin composition, and cured product of same
WO2014109349A1 (ja) * 2013-01-09 2014-07-17 株式会社ダイセル 硬化性樹脂組成物及びその硬化物
KR20150065822A (ko) * 2013-01-09 2015-06-15 주식회사 다이셀 경화성 수지 조성물 및 그의 경화물
KR101598325B1 (ko) * 2013-01-09 2016-02-26 주식회사 다이셀 경화성 수지 조성물 및 그의 경화물
WO2014125964A1 (ja) * 2013-02-14 2014-08-21 株式会社ダイセル 硬化性樹脂組成物、硬化物、封止材、及び半導体装置
US9481791B2 (en) 2013-02-14 2016-11-01 Daicel Corporation Curable resin composition and cured product thereof, encapsulant, and semiconductor device
US9644098B2 (en) 2013-02-14 2017-05-09 Daicel Corporation Curable resin composition and cured product thereof, encapsulant, and semiconductor device
JPWO2014125964A1 (ja) * 2013-02-14 2017-02-02 株式会社ダイセル 硬化性樹脂組成物、硬化物、封止材、及び半導体装置
JP2015110694A (ja) * 2013-12-06 2015-06-18 サンユレック株式会社 シリコーン樹脂組成物
JP2016216599A (ja) * 2015-05-20 2016-12-22 株式会社ダイセル 硬化性シリコーン樹脂組成物及びその硬化物
JP2021536519A (ja) * 2018-08-31 2021-12-27 ワッカー ケミー アクチエンゲゼルシャフトWacker Chemie AG 硬化性オルガノポリシロキサン組成物、封止材及び半導体デバイス

Also Published As

Publication number Publication date
CN103154145A (zh) 2013-06-12
CN103154145B (zh) 2015-09-16
WO2012070525A1 (ja) 2012-05-31
KR20140006811A (ko) 2014-01-16

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