JP2012019080A5 - - Google Patents

Download PDF

Info

Publication number
JP2012019080A5
JP2012019080A5 JP2010155785A JP2010155785A JP2012019080A5 JP 2012019080 A5 JP2012019080 A5 JP 2012019080A5 JP 2010155785 A JP2010155785 A JP 2010155785A JP 2010155785 A JP2010155785 A JP 2010155785A JP 2012019080 A5 JP2012019080 A5 JP 2012019080A5
Authority
JP
Japan
Prior art keywords
layer
electrode pad
forming
wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010155785A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012019080A (ja
JP5502624B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2010155785A external-priority patent/JP5502624B2/ja
Priority to JP2010155785A priority Critical patent/JP5502624B2/ja
Priority to TW100123500A priority patent/TWI521618B/zh
Priority to KR1020110065762A priority patent/KR20120005383A/ko
Priority to CN2011101979171A priority patent/CN102316680A/zh
Priority to US13/176,876 priority patent/US20120006591A1/en
Publication of JP2012019080A publication Critical patent/JP2012019080A/ja
Publication of JP2012019080A5 publication Critical patent/JP2012019080A5/ja
Publication of JP5502624B2 publication Critical patent/JP5502624B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010155785A 2010-07-08 2010-07-08 配線基板の製造方法及び配線基板 Active JP5502624B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010155785A JP5502624B2 (ja) 2010-07-08 2010-07-08 配線基板の製造方法及び配線基板
TW100123500A TWI521618B (zh) 2010-07-08 2011-07-04 配線基板及其製造方法
KR1020110065762A KR20120005383A (ko) 2010-07-08 2011-07-04 배선 기판 및 배선 기판 제조 방법
US13/176,876 US20120006591A1 (en) 2010-07-08 2011-07-06 Wiring Substrate and Method for Manufacturing Wiring Substrate
CN2011101979171A CN102316680A (zh) 2010-07-08 2011-07-06 配线基板及制造配线基板的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010155785A JP5502624B2 (ja) 2010-07-08 2010-07-08 配線基板の製造方法及び配線基板

Publications (3)

Publication Number Publication Date
JP2012019080A JP2012019080A (ja) 2012-01-26
JP2012019080A5 true JP2012019080A5 (OSRAM) 2013-05-30
JP5502624B2 JP5502624B2 (ja) 2014-05-28

Family

ID=45429376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010155785A Active JP5502624B2 (ja) 2010-07-08 2010-07-08 配線基板の製造方法及び配線基板

Country Status (5)

Country Link
US (1) US20120006591A1 (OSRAM)
JP (1) JP5502624B2 (OSRAM)
KR (1) KR20120005383A (OSRAM)
CN (1) CN102316680A (OSRAM)
TW (1) TWI521618B (OSRAM)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5142967B2 (ja) * 2008-12-10 2013-02-13 ルネサスエレクトロニクス株式会社 半導体装置
JP6166879B2 (ja) * 2011-09-06 2017-07-19 株式会社 大昌電子 片面プリント配線板およびその製造方法
US20130168132A1 (en) * 2011-12-29 2013-07-04 Sumsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
JP6110084B2 (ja) * 2012-07-06 2017-04-05 株式会社 大昌電子 プリント配線板およびその製造方法
WO2014071813A1 (zh) 2012-11-08 2014-05-15 南通富士通微电子股份有限公司 半导体器件的封装件和封装方法
CN102915986B (zh) 2012-11-08 2015-04-01 南通富士通微电子股份有限公司 芯片封装结构
WO2014071815A1 (zh) * 2012-11-08 2014-05-15 南通富士通微电子股份有限公司 半导体器件及其形成方法
KR101411813B1 (ko) 2012-11-09 2014-06-27 앰코 테크놀로지 코리아 주식회사 반도체 디바이스 및 그 제조 방법
KR101516083B1 (ko) * 2013-10-14 2015-04-29 삼성전기주식회사 인쇄회로기판 및 인쇄회로기판 제조 방법
US9412686B2 (en) * 2014-08-26 2016-08-09 United Microelectronics Corp. Interposer structure and manufacturing method thereof
JP2016076534A (ja) * 2014-10-03 2016-05-12 イビデン株式会社 金属ポスト付きプリント配線板およびその製造方法
KR101896226B1 (ko) * 2015-05-15 2018-10-18 스템코 주식회사 연성 회로 기판 및 그 제조 방법
KR102040605B1 (ko) 2015-07-15 2019-12-05 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR102326505B1 (ko) 2015-08-19 2021-11-16 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
KR101742433B1 (ko) * 2016-04-21 2017-05-31 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
TWI576033B (zh) * 2016-05-06 2017-03-21 旭德科技股份有限公司 線路基板及其製作方法
JP6615701B2 (ja) * 2016-06-24 2019-12-04 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
KR102119807B1 (ko) * 2018-02-13 2020-06-05 엘지이노텍 주식회사 인쇄회로기판 및 그의 제조 방법
US20220084930A1 (en) * 2019-01-30 2022-03-17 Kyocera Corporation Electronic component mounting base and electronic device
JP2021093417A (ja) * 2019-12-09 2021-06-17 イビデン株式会社 プリント配線板、及び、プリント配線板の製造方法
KR102877704B1 (ko) * 2020-09-09 2025-10-28 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
JP7711870B2 (ja) * 2021-10-19 2025-07-23 新光電気工業株式会社 配線基板及びその製造方法
JP7743265B2 (ja) * 2021-10-26 2025-09-24 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165024A (ja) * 1998-11-25 2000-06-16 Kyocera Corp 配線基板および電子部品ならびにそれらの接続方法
US6586843B2 (en) * 2001-11-08 2003-07-01 Intel Corporation Integrated circuit device with covalently bonded connection structure
JP3990962B2 (ja) * 2002-09-17 2007-10-17 新光電気工業株式会社 配線基板の製造方法
JP4146864B2 (ja) * 2005-05-31 2008-09-10 新光電気工業株式会社 配線基板及びその製造方法、並びに半導体装置及び半導体装置の製造方法
TWI331494B (en) * 2007-03-07 2010-10-01 Unimicron Technology Corp Circuit board structure
JP5101169B2 (ja) * 2007-05-30 2012-12-19 新光電気工業株式会社 配線基板とその製造方法
JP4213191B1 (ja) * 2007-09-06 2009-01-21 新光電気工業株式会社 配線基板の製造方法
JP4783812B2 (ja) * 2008-05-12 2011-09-28 新光電気工業株式会社 配線基板の製造方法
JP5142967B2 (ja) * 2008-12-10 2013-02-13 ルネサスエレクトロニクス株式会社 半導体装置
KR101070022B1 (ko) * 2009-09-16 2011-10-04 삼성전기주식회사 다층 세라믹 회로 기판, 다층 세라믹 회로 기판 제조방법 및 이를 이용한 전자 디바이스 모듈

Similar Documents

Publication Publication Date Title
JP2012019080A5 (OSRAM)
JP2014103295A5 (OSRAM)
JP2011146477A5 (OSRAM)
JP2012186296A5 (OSRAM)
JP2014022465A5 (OSRAM)
JP2013153067A5 (OSRAM)
JP2009194322A5 (OSRAM)
JP2008160160A5 (OSRAM)
EP2560205A3 (en) Light emitting module
JP2015070007A5 (OSRAM)
JP2009283739A5 (OSRAM)
JP2012074443A5 (OSRAM)
WO2009019308A3 (de) Bauelement mit reduziertem temperaturgang und verfahren zur herstellung
JP2016096292A5 (OSRAM)
WO2011099820A3 (en) Pcb with cavity and fabricating method thereof
JP2012253195A5 (OSRAM)
JP2013080813A5 (OSRAM)
JP2013219191A5 (OSRAM)
JP2009182118A5 (OSRAM)
JP2012069952A5 (OSRAM)
JP2010287883A5 (ja) 基板及び基板の作製方法
JP2010129899A5 (OSRAM)
JP2014501449A5 (OSRAM)
EP2608407A3 (en) Circuit substrate for duplexers
WO2012087072A3 (ko) 인쇄회로기판 및 이의 제조 방법