JP2013219191A5 - - Google Patents

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Publication number
JP2013219191A5
JP2013219191A5 JP2012088642A JP2012088642A JP2013219191A5 JP 2013219191 A5 JP2013219191 A5 JP 2013219191A5 JP 2012088642 A JP2012088642 A JP 2012088642A JP 2012088642 A JP2012088642 A JP 2012088642A JP 2013219191 A5 JP2013219191 A5 JP 2013219191A5
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JP
Japan
Prior art keywords
core substrate
electrode
insulating layer
substrate
core
Prior art date
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Granted
Application number
JP2012088642A
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English (en)
Japanese (ja)
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JP5827166B2 (ja
JP2013219191A (ja
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Priority to JP2012088642A priority Critical patent/JP5827166B2/ja
Priority claimed from JP2012088642A external-priority patent/JP5827166B2/ja
Priority to US13/855,762 priority patent/US9386695B2/en
Publication of JP2013219191A publication Critical patent/JP2013219191A/ja
Publication of JP2013219191A5 publication Critical patent/JP2013219191A5/ja
Application granted granted Critical
Publication of JP5827166B2 publication Critical patent/JP5827166B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012088642A 2012-04-09 2012-04-09 配線基板及び配線基板の製造方法 Active JP5827166B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012088642A JP5827166B2 (ja) 2012-04-09 2012-04-09 配線基板及び配線基板の製造方法
US13/855,762 US9386695B2 (en) 2012-04-09 2013-04-03 Wiring substrate having multiple core substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012088642A JP5827166B2 (ja) 2012-04-09 2012-04-09 配線基板及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013219191A JP2013219191A (ja) 2013-10-24
JP2013219191A5 true JP2013219191A5 (OSRAM) 2015-02-19
JP5827166B2 JP5827166B2 (ja) 2015-12-02

Family

ID=49291408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012088642A Active JP5827166B2 (ja) 2012-04-09 2012-04-09 配線基板及び配線基板の製造方法

Country Status (2)

Country Link
US (1) US9386695B2 (OSRAM)
JP (1) JP5827166B2 (OSRAM)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101548816B1 (ko) 2013-11-11 2015-08-31 삼성전기주식회사 인쇄회로기판 및 그 제조방법
CN105746004B (zh) * 2013-11-22 2019-06-07 三井金属矿业株式会社 带有电路形成层的支持基板、两面带有电路形成层的支持基板、多层层压板、多层印刷线路板的制造方法及多层印刷线路板
JP2015146401A (ja) * 2014-02-04 2015-08-13 大日本印刷株式会社 ガラスインターポーザー
JP6361179B2 (ja) * 2014-03-10 2018-07-25 大日本印刷株式会社 配線板、配線板の製造方法
KR101580287B1 (ko) * 2014-05-02 2015-12-24 삼성전기주식회사 인쇄회로기판, 인쇄회로기판 스트립 및 그 제조방법
US9960120B2 (en) * 2015-03-31 2018-05-01 Shinko Electric Industries Co., Ltd. Wiring substrate with buried substrate having linear conductors
JP6600573B2 (ja) * 2015-03-31 2019-10-30 新光電気工業株式会社 配線基板及び半導体パッケージ
KR101795480B1 (ko) * 2015-04-06 2017-11-10 코닝정밀소재 주식회사 집적회로 패키지용 기판
JP6661232B2 (ja) * 2016-03-01 2020-03-11 新光電気工業株式会社 配線基板、半導体装置、配線基板の製造方法及び半導体装置の製造方法
TWI705536B (zh) * 2018-11-16 2020-09-21 欣興電子股份有限公司 載板結構及其製作方法
WO2020129553A1 (ja) * 2018-12-19 2020-06-25 日本板硝子株式会社 微細構造付ガラス基板及び微細構造付ガラス基板の製造方法
JP7184679B2 (ja) * 2019-03-13 2022-12-06 イビデン株式会社 プリント配線板およびその製造方法
CN113013125B (zh) * 2019-12-20 2024-07-09 奥特斯奥地利科技与系统技术有限公司 嵌入有在侧向上位于堆叠体的导电结构之间的内插件的部件承载件
JP2021108317A (ja) * 2019-12-27 2021-07-29 イビデン株式会社 プリント配線板およびその製造方法
KR20230018242A (ko) * 2021-07-29 2023-02-07 엘지이노텍 주식회사 회로기판 및 이를 포함하는 패키지 기판

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3761862B2 (ja) 1999-05-27 2006-03-29 Ｈｏｙａ株式会社 両面配線板の製造方法
SG177608A1 (en) * 2009-07-10 2012-02-28 Toray Industries Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
US8584354B2 (en) * 2010-08-26 2013-11-19 Corning Incorporated Method for making glass interposer panels

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