JP2012013341A5 - - Google Patents

Download PDF

Info

Publication number
JP2012013341A5
JP2012013341A5 JP2010151563A JP2010151563A JP2012013341A5 JP 2012013341 A5 JP2012013341 A5 JP 2012013341A5 JP 2010151563 A JP2010151563 A JP 2010151563A JP 2010151563 A JP2010151563 A JP 2010151563A JP 2012013341 A5 JP2012013341 A5 JP 2012013341A5
Authority
JP
Japan
Prior art keywords
chamber
cooling
heat treatment
cooling chamber
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010151563A
Other languages
English (en)
Japanese (ja)
Other versions
JP5658928B2 (ja
JP2012013341A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2010151563A external-priority patent/JP5658928B2/ja
Priority to JP2010151563A priority Critical patent/JP5658928B2/ja
Priority to PCT/JP2011/065179 priority patent/WO2012002532A1/ja
Priority to US13/806,159 priority patent/US20130153547A1/en
Priority to KR1020137002397A priority patent/KR20130045343A/ko
Priority to EP11800994.3A priority patent/EP2589910A4/en
Priority to CN201180031206.5A priority patent/CN103038593B/zh
Publication of JP2012013341A publication Critical patent/JP2012013341A/ja
Publication of JP2012013341A5 publication Critical patent/JP2012013341A5/ja
Publication of JP5658928B2 publication Critical patent/JP5658928B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2010151563A 2010-07-02 2010-07-02 多室型熱処理装置 Expired - Fee Related JP5658928B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2010151563A JP5658928B2 (ja) 2010-07-02 2010-07-02 多室型熱処理装置
EP11800994.3A EP2589910A4 (en) 2010-07-02 2011-07-01 THERMAL TREATMENT DEVICE WITH MULTIPLE CHAMBERS
US13/806,159 US20130153547A1 (en) 2010-07-02 2011-07-01 Multi-chamber heat treatment device
KR1020137002397A KR20130045343A (ko) 2010-07-02 2011-07-01 다실형 열처리 장치
PCT/JP2011/065179 WO2012002532A1 (ja) 2010-07-02 2011-07-01 多室型熱処理装置
CN201180031206.5A CN103038593B (zh) 2010-07-02 2011-07-01 多室型热处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010151563A JP5658928B2 (ja) 2010-07-02 2010-07-02 多室型熱処理装置

Publications (3)

Publication Number Publication Date
JP2012013341A JP2012013341A (ja) 2012-01-19
JP2012013341A5 true JP2012013341A5 (enExample) 2013-05-02
JP5658928B2 JP5658928B2 (ja) 2015-01-28

Family

ID=45402234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010151563A Expired - Fee Related JP5658928B2 (ja) 2010-07-02 2010-07-02 多室型熱処理装置

Country Status (6)

Country Link
US (1) US20130153547A1 (enExample)
EP (1) EP2589910A4 (enExample)
JP (1) JP5658928B2 (enExample)
KR (1) KR20130045343A (enExample)
CN (1) CN103038593B (enExample)
WO (1) WO2012002532A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9731990B2 (en) * 2013-05-30 2017-08-15 Johns Manville Submerged combustion glass melting systems and methods of use
JP6515370B2 (ja) * 2014-05-29 2019-05-22 株式会社Ihi 冷却装置及び多室型熱処理装置
JP6418830B2 (ja) 2014-07-25 2018-11-07 株式会社Ihi 冷却装置及び多室型熱処理装置
JP6418832B2 (ja) 2014-07-28 2018-11-07 株式会社Ihi 熱処理装置用の搬送装置及び熱処理装置
JP6297471B2 (ja) * 2014-11-10 2018-03-20 中外炉工業株式会社 熱処理設備
DE112015005248B4 (de) 2014-11-20 2019-07-11 Ihi Corporation Wärmebehandlungsvorrichtung und kühlvorrichtung
JP6596703B2 (ja) * 2015-03-04 2019-10-30 株式会社Ｉｈｉ 多室型熱処理装置
DE112016002361T5 (de) 2015-05-26 2018-02-22 Ihi Corporation Wärmebehandlungsvorrichtung
JP6721466B2 (ja) * 2016-09-12 2020-07-15 株式会社Ihi 熱処理装置
FR3073937B1 (fr) 2017-11-21 2020-08-14 Ceritherm Installation de traitement thermique pour la fabrication de produits industriels.
CN115096076B (zh) * 2021-04-07 2025-03-11 江苏天海特种装备有限公司 乙炔瓶填料蒸养固化用隧道式推杆加热炉的连续固化工艺
CN114197056B (zh) * 2022-01-14 2024-07-09 浙江大学杭州国际科创中心 一种半导体材料退火装置及退火方法
PL448051A1 (pl) * 2024-03-20 2025-09-22 Seco/Warwick Spółka Akcyjna Piec próżniowy z chłodzeniem w wodzie

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3403451A (en) * 1965-03-30 1968-10-01 Fluid Energy Proc & Equipment Method for drying or treating wet solid and semisolid materials
US3886760A (en) * 1970-09-03 1975-06-03 Stephen Wyden Method of indirect heat exchange
NO135672C (enExample) * 1972-11-21 1977-05-11 Prolizenz Ag
DE4005956C1 (enExample) * 1990-02-26 1991-06-06 Siegfried Dipl.-Ing. Dr. 5135 Selfkant De Straemke
JP3310997B2 (ja) * 1991-11-28 2002-08-05 株式会社日立製作所 連続処理装置
CN100367461C (zh) * 1993-11-05 2008-02-06 株式会社半导体能源研究所 一种制造薄膜晶体管和电子器件的方法
JP3490791B2 (ja) * 1994-12-20 2004-01-26 光洋サーモシステム株式会社 多室熱処理炉
US6059507A (en) * 1997-04-21 2000-05-09 Brooks Automation, Inc. Substrate processing apparatus with small batch load lock
JPH11153386A (ja) * 1997-11-25 1999-06-08 Ishikawajima Harima Heavy Ind Co Ltd 多室式マルチ冷却真空炉
JP3820950B2 (ja) * 2001-10-03 2006-09-13 大同特殊鋼株式会社 雰囲気熱処理炉とそのシーズニング方法
US8530359B2 (en) * 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
US7841582B2 (en) * 2004-06-02 2010-11-30 Applied Materials, Inc. Variable seal pressure slit valve doors for semiconductor manufacturing equipment
US9799536B2 (en) * 2005-02-07 2017-10-24 Planar Semiconductor, Inc. Apparatus and method for cleaning flat objects in a vertical orientation with pulsed liquid jet
US7845891B2 (en) * 2006-01-13 2010-12-07 Applied Materials, Inc. Decoupled chamber body
US8124907B2 (en) * 2006-08-04 2012-02-28 Applied Materials, Inc. Load lock chamber with decoupled slit valve door seal compartment
US20090001057A1 (en) * 2007-06-29 2009-01-01 Cheng-Hsin Ma Dual damascene trench depth detection and control using voltage impedance RF probe
US20110155192A1 (en) * 2008-02-27 2011-06-30 Nadeem Ahmad System and apparatus for automatic built-in vehicle washing and other operations
JP2010014290A (ja) * 2008-07-01 2010-01-21 Ihi Corp 多室型熱処理炉
JP2010038531A (ja) * 2008-07-10 2010-02-18 Ihi Corp 熱処理装置
US20100024847A1 (en) * 2008-08-01 2010-02-04 Breese Ronald G Semiconductor wafer cleaning with dilute acids
JP5203986B2 (ja) * 2009-01-19 2013-06-05 東京エレクトロン株式会社 フォーカスリングの加熱方法、プラズマエッチング方法、プラズマエッチング装置及びコンピュータ記憶媒体

Similar Documents

Publication Publication Date Title
JP2012013341A5 (enExample)
JP5658928B2 (ja) 多室型熱処理装置
ES2716381T3 (es) Dispositivo de transporte para piezas de acero de paredes delgadas, calientes
KR20200069216A (ko) 고온 오븐용 온도조절기
JP5470471B2 (ja) 搬送装置及び搬送熱処理システム
CN103472610B (zh) 一种基板干燥装置及基板清洗系统
JP2021009923A (ja) 加熱処理装置及び加熱処理方法
CN104916740B (zh) 退火氧化设备
CN204509407U (zh) 一种淬火炉热回收装置
TW201631619A (zh) 電感耦合型電漿處理裝置
JP2005011911A (ja) 加熱装置及び加熱方法
JP5401015B2 (ja) 連続式焼成炉
KR20140001829U (ko) 열처리 장치
TWI351724B (en) Annealing apparatus
JP2011066318A (ja) 熱処理装置
CN110491805A (zh) 半导体处理设备及半导体处理方法
KR102100757B1 (ko) 유도가열을 이용한 스팀발생장치，이를 이용한 스팀 세정 시스템
TW200916850A (en) Cooling device for sheet treated product and heat treatment system mounting the device
JP6440436B2 (ja) 円筒状板材コイルの熱処理設備および熱処理方法
CN104048503B (zh) 一种电路板隧道烘烤炉
CN219607743U (zh) 一种利用退火余热升温降低设备能耗装置
JP2011241469A (ja) 熱処理炉
TW202023009A (zh) 高溫烘箱的溫度調整設備
JP6274448B2 (ja) 焼成炉及びコーティング方法
KR100786583B1 (ko) 챔버의 척 냉각장치