JP2011530166A5 - - Google Patents
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- Publication number
- JP2011530166A5 JP2011530166A5 JP2011521112A JP2011521112A JP2011530166A5 JP 2011530166 A5 JP2011530166 A5 JP 2011530166A5 JP 2011521112 A JP2011521112 A JP 2011521112A JP 2011521112 A JP2011521112 A JP 2011521112A JP 2011530166 A5 JP2011530166 A5 JP 2011530166A5
- Authority
- JP
- Japan
- Prior art keywords
- cmp
- cmp method
- substrate
- hydrophilic
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 11
- -1 heterocyclic amine Chemical class 0.000 claims 7
- 238000005498 polishing Methods 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 6
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 4
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 4
- 239000004094 surface-active agent Substances 0.000 claims 4
- 239000000654 additive Substances 0.000 claims 3
- 230000000996 additive effect Effects 0.000 claims 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 239000008365 aqueous carrier Substances 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 claims 2
- 239000002736 nonionic surfactant Substances 0.000 claims 2
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- NEAQRZUHTPSBBM-UHFFFAOYSA-N 2-hydroxy-3,3-dimethyl-7-nitro-4h-isoquinolin-1-one Chemical compound C1=C([N+]([O-])=O)C=C2C(=O)N(O)C(C)(C)CC2=C1 NEAQRZUHTPSBBM-UHFFFAOYSA-N 0.000 claims 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000004982 aromatic amines Chemical class 0.000 claims 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims 1
- 150000002989 phenols Chemical class 0.000 claims 1
- 239000011164 primary particle Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229940124530 sulfonamide Drugs 0.000 claims 1
- 150000003456 sulfonamides Chemical class 0.000 claims 1
- 150000003573 thiols Chemical class 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/221,023 US8247327B2 (en) | 2008-07-30 | 2008-07-30 | Methods and compositions for polishing silicon-containing substrates |
| US12/221,023 | 2008-07-30 | ||
| PCT/US2009/004281 WO2010014180A2 (en) | 2008-07-30 | 2009-07-23 | Methods and compositions for polishing silicon-containing substrates |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014152992A Division JP5952352B2 (ja) | 2008-07-30 | 2014-07-28 | シリコン含有基材を研磨するための方法及び組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011530166A JP2011530166A (ja) | 2011-12-15 |
| JP2011530166A5 true JP2011530166A5 (https=) | 2012-02-02 |
| JP5628802B2 JP5628802B2 (ja) | 2014-11-19 |
Family
ID=41608845
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011521112A Expired - Fee Related JP5628802B2 (ja) | 2008-07-30 | 2009-07-23 | シリコン含有基材を研磨するための方法及び組成物 |
| JP2014152992A Active JP5952352B2 (ja) | 2008-07-30 | 2014-07-28 | シリコン含有基材を研磨するための方法及び組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014152992A Active JP5952352B2 (ja) | 2008-07-30 | 2014-07-28 | シリコン含有基材を研磨するための方法及び組成物 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US8247327B2 (https=) |
| EP (1) | EP2331649B1 (https=) |
| JP (2) | JP5628802B2 (https=) |
| KR (1) | KR101396000B1 (https=) |
| CN (1) | CN102149783B (https=) |
| IL (1) | IL210029A (https=) |
| MY (1) | MY149727A (https=) |
| SG (1) | SG189801A1 (https=) |
| TW (1) | TWI398917B (https=) |
| WO (1) | WO2010014180A2 (https=) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101268615B1 (ko) | 2008-12-11 | 2013-06-04 | 히타치가세이가부시끼가이샤 | Ｃｍｐ용 연마액 및 이것을 이용한 연마 방법 |
| JP5492603B2 (ja) * | 2010-03-02 | 2014-05-14 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びそれを用いた研磨方法 |
| JP5648567B2 (ja) * | 2010-05-07 | 2015-01-07 | 日立化成株式会社 | Ｃｍｐ用研磨液及びこれを用いた研磨方法 |
| US9070632B2 (en) * | 2010-10-07 | 2015-06-30 | Basf Se | Aqueous polishing composition and process for chemically mechanically polishing substrates having patterned or unpatterned low-k dielectric layers |
| MY163010A (en) * | 2011-01-11 | 2017-07-31 | Cabot Microelectronics Corp | Metal-passivating cmp compositions and methods |
| CN102816530B (zh) * | 2011-06-08 | 2016-01-27 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| CN104364331A (zh) * | 2012-05-23 | 2015-02-18 | 巴斯夫欧洲公司 | 包括在包含特定非离子表面活性剂的化学机械抛光组合物存在下进行iii-v族材料的化学机械抛光的制造半导体装置的方法 |
| WO2014034358A1 (ja) * | 2012-08-30 | 2014-03-06 | 日立化成株式会社 | 研磨剤、研磨剤セット及び基体の研磨方法 |
| EP2952550A4 (en) * | 2013-02-01 | 2016-09-28 | Fujimi Inc | SURFACE LENS POLISHING COMPOSITION |
| JP5820404B2 (ja) * | 2013-02-05 | 2015-11-24 | 株式会社東芝 | 平坦化方法及び平坦化装置 |
| JP6209845B2 (ja) * | 2013-04-11 | 2017-10-11 | 日立化成株式会社 | 研磨液、研磨液セット及び基体の研磨方法 |
| KR102225154B1 (ko) | 2013-06-12 | 2021-03-09 | 쇼와덴코머티리얼즈가부시끼가이샤 | Cmp용 연마액 및 연마 방법 |
| EP2826827B1 (en) * | 2013-07-18 | 2019-06-12 | Basf Se | CMP composition comprising abrasive particles containing ceria |
| JP2016175949A (ja) * | 2013-08-09 | 2016-10-06 | コニカミノルタ株式会社 | Ｃｍｐ用研磨液 |
| US9279067B2 (en) * | 2013-10-10 | 2016-03-08 | Cabot Microelectronics Corporation | Wet-process ceria compositions for polishing substrates, and methods related thereto |
| US9281210B2 (en) * | 2013-10-10 | 2016-03-08 | Cabot Microelectronics Corporation | Wet-process ceria compositions for polishing substrates, and methods related thereto |
| CN104745085B (zh) * | 2013-12-25 | 2018-08-21 | 安集微电子（上海）有限公司 | 一种用于钴阻挡层抛光的化学机械抛光液 |
| SG11201610969UA (en) * | 2014-07-09 | 2017-02-27 | Hitachi Chemical Co Ltd | Cmp polishing liquid, and polishing method |
| US20160053381A1 (en) * | 2014-08-22 | 2016-02-25 | Cabot Microelectronics Corporation | Germanium chemical mechanical polishing |
| JP6456633B2 (ja) * | 2014-09-05 | 2019-01-23 | 三菱重工サーマルシステムズ株式会社 | ターボ冷凍機 |
| US9530655B2 (en) * | 2014-09-08 | 2016-12-27 | Taiwan Semiconductor Manufacting Company, Ltd. | Slurry composition for chemical mechanical polishing of Ge-based materials and devices |
| JP6396740B2 (ja) * | 2014-09-29 | 2018-09-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び研磨方法 |
| JP6879995B2 (ja) * | 2015-07-13 | 2021-06-02 | シーエムシー マテリアルズ，インコーポレイティド | 誘電体基板を加工するための方法及び組成物 |
| US10619075B2 (en) | 2015-07-13 | 2020-04-14 | Cabot Microelectronics Corporation | Self-stopping polishing composition and method for bulk oxide planarization |
| JP6599176B2 (ja) | 2015-08-28 | 2019-10-30 | 三菱重工サーマルシステムズ株式会社 | ターボ冷凍装置 |
| US20170066944A1 (en) * | 2015-09-03 | 2017-03-09 | Cabot Microelectronics Corporation | Methods and compositions for processing dielectric substrate |
| WO2017069202A1 (ja) * | 2015-10-23 | 2017-04-27 | ニッタ・ハース株式会社 | 研磨用組成物 |
| KR102574851B1 (ko) * | 2015-12-17 | 2023-09-06 | 솔브레인 주식회사 | 화학기계적 연마 슬러리 조성물 |
| US10286518B2 (en) * | 2017-01-31 | 2019-05-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| US20180244955A1 (en) | 2017-02-28 | 2018-08-30 | Versum Materials Us, Llc | Chemical Mechanical Planarization of Films Comprising Elemental Silicon |
| JP7028592B2 (ja) * | 2017-09-19 | 2022-03-02 | 株式会社フジミインコーポレーテッド | 表面処理組成物、表面処理組成物の製造方法、表面処理方法、および半導体基板の製造方法 |
| WO2019069370A1 (ja) | 2017-10-03 | 2019-04-11 | 日立化成株式会社 | 研磨液、研磨液セット、研磨方法及び欠陥抑制方法 |
| WO2020202471A1 (ja) * | 2019-04-02 | 2020-10-08 | 日立化成株式会社 | 研磨液、研磨液セット、研磨方法及び欠陥抑制方法 |
| US11162079B2 (en) | 2019-05-10 | 2021-11-02 | The Regents Of The University Of California | Blood type O Rh-hypo-immunogenic pluripotent cells |
| WO2020231882A2 (en) | 2019-05-10 | 2020-11-19 | The Regents Of The University Of California | Modified pluripotent cells |
| CN113004798B (zh) * | 2019-12-19 | 2024-04-12 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| JP7596653B2 (ja) * | 2020-06-29 | 2024-12-10 | Ａｇｃ株式会社 | 研磨剤及び研磨方法 |
| WO2022070801A1 (ja) * | 2020-09-29 | 2022-04-07 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびその利用 |
| KR102731706B1 (ko) * | 2021-09-10 | 2024-11-15 | 성균관대학교산학협력단 | 연마 조성물 및 이를 이용한 연마 방법 |
| CN114350264B (zh) * | 2022-02-18 | 2023-06-02 | 河北工业大学 | 一种用于钴互连结构钴膜cmp粗抛的碱性抛光液及其制备方法 |
| CN115851134B (zh) * | 2022-10-27 | 2024-09-10 | 万华化学集团电子材料有限公司 | 一种高精度硅片抛光组合物及其应用 |
| CN119039991B (zh) * | 2024-10-30 | 2025-06-03 | 西安蓝桥新能源科技有限公司 | 一种用于硅片碱刻蚀抛光的添加剂、反应液及方法与应用 |
| CN121450242A (zh) * | 2026-01-04 | 2026-02-03 | 珠海基石科技有限公司 | 平整化组合物及其制备方法、应用、平整化工艺和电子器件 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6022264A (en) | 1997-02-10 | 2000-02-08 | Rodel Inc. | Polishing pad and methods relating thereto |
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| JP2002528903A (ja) | 1998-10-23 | 2002-09-03 | アーチ・スペシャルティ・ケミカルズ・インコーポレイテッド | 活性剤溶液を含有し、化学機械的に磨くためのスラリーシステム |
| JP2001007059A (ja) * | 1999-06-18 | 2001-01-12 | Hitachi Chem Co Ltd | Ｃｍｐ研磨剤及び基板の研磨方法 |
| EP1369906B1 (en) * | 2001-02-20 | 2012-06-27 | Hitachi Chemical Company, Ltd. | Polishing compound and method for polishing substrate |
| US20030162398A1 (en) * | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
| US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
| US6974777B2 (en) * | 2002-06-07 | 2005-12-13 | Cabot Microelectronics Corporation | CMP compositions for low-k dielectric materials |
| US7071105B2 (en) * | 2003-02-03 | 2006-07-04 | Cabot Microelectronics Corporation | Method of polishing a silicon-containing dielectric |
| JP2004247605A (ja) * | 2003-02-14 | 2004-09-02 | Toshiba Corp | Ｃｍｐ用スラリーおよび半導体装置の製造方法 |
| JP4267546B2 (ja) | 2004-04-06 | 2009-05-27 | 花王株式会社 | 基板の製造方法 |
| JP2006269910A (ja) * | 2005-03-25 | 2006-10-05 | Fuji Photo Film Co Ltd | 金属用研磨液及びこれを用いた研磨方法 |
| US7662753B2 (en) * | 2005-05-12 | 2010-02-16 | Halliburton Energy Services, Inc. | Degradable surfactants and methods for use |
| CN101496143B (zh) * | 2006-07-28 | 2011-04-06 | 昭和电工株式会社 | 研磨组合物 |
| KR100814416B1 (ko) * | 2006-09-28 | 2008-03-18 | 삼성전자주식회사 | 고 평탄화 슬러리 조성물 및 이를 이용한 화학 기계적 연마방법 |
| US7456107B2 (en) * | 2006-11-09 | 2008-11-25 | Cabot Microelectronics Corporation | Compositions and methods for CMP of low-k-dielectric materials |
-
2008
- 2008-07-30 US US12/221,023 patent/US8247327B2/en active Active
-
2009
- 2009-06-30 TW TW098122070A patent/TWI398917B/zh active
- 2009-07-23 KR KR1020117004512A patent/KR101396000B1/ko active Active
- 2009-07-23 CN CN200980130098XA patent/CN102149783B/zh active Active
- 2009-07-23 EP EP09803244.4A patent/EP2331649B1/en not_active Not-in-force
- 2009-07-23 MY MYPI2011000348A patent/MY149727A/en unknown
- 2009-07-23 JP JP2011521112A patent/JP5628802B2/ja not_active Expired - Fee Related
- 2009-07-23 WO PCT/US2009/004281 patent/WO2010014180A2/en not_active Ceased
- 2009-07-23 SG SG2013029426A patent/SG189801A1/en unknown
-
2010
- 2010-12-15 IL IL210029A patent/IL210029A/en not_active IP Right Cessation
-
2012
- 2012-07-20 US US13/554,829 patent/US8597540B2/en active Active
-
2014
- 2014-07-28 JP JP2014152992A patent/JP5952352B2/ja active Active
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