JP2011526648A - 硬化性接着テープを形成する方法および導電性基板上に絶縁層を形成する方法 - Google Patents
硬化性接着テープを形成する方法および導電性基板上に絶縁層を形成する方法 Download PDFInfo
- Publication number
- JP2011526648A JP2011526648A JP2011516565A JP2011516565A JP2011526648A JP 2011526648 A JP2011526648 A JP 2011526648A JP 2011516565 A JP2011516565 A JP 2011516565A JP 2011516565 A JP2011516565 A JP 2011516565A JP 2011526648 A JP2011526648 A JP 2011526648A
- Authority
- JP
- Japan
- Prior art keywords
- silicone composition
- siloxane
- adhesive tape
- curable adhesive
- partially cured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Insulating Bodies (AREA)
- Adhesive Tapes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7593708P | 2008-06-26 | 2008-06-26 | |
| US61/075,937 | 2008-06-26 | ||
| PCT/US2009/048399 WO2009158383A2 (en) | 2008-06-26 | 2009-06-24 | Method of forming a curable adhesive tape and an insulating layer on a conductive substrate |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014214407A Division JP6043326B2 (ja) | 2008-06-26 | 2014-10-21 | 硬化性接着テープを形成する方法および導電性基材上に絶縁層を形成する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011526648A true JP2011526648A (ja) | 2011-10-13 |
| JP2011526648A5 JP2011526648A5 (enExample) | 2012-06-28 |
Family
ID=41334626
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011516565A Pending JP2011526648A (ja) | 2008-06-26 | 2009-06-24 | 硬化性接着テープを形成する方法および導電性基板上に絶縁層を形成する方法 |
| JP2014214407A Active JP6043326B2 (ja) | 2008-06-26 | 2014-10-21 | 硬化性接着テープを形成する方法および導電性基材上に絶縁層を形成する方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014214407A Active JP6043326B2 (ja) | 2008-06-26 | 2014-10-21 | 硬化性接着テープを形成する方法および導電性基材上に絶縁層を形成する方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20110104470A1 (enExample) |
| EP (1) | EP2291473B1 (enExample) |
| JP (2) | JP2011526648A (enExample) |
| CN (1) | CN102083926B (enExample) |
| WO (1) | WO2009158383A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018186165A1 (ja) * | 2017-04-06 | 2018-10-11 | 東レ・ダウコーニング株式会社 | 液状硬化性シリコーン接着剤組成物、その硬化物およびその用途 |
| US11279827B2 (en) | 2016-09-26 | 2022-03-22 | Dow Toray Co., Ltd. | Curing reactive silicone gel and use thereof |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101149806B1 (ko) * | 2010-02-19 | 2012-06-08 | 주식회사 코아비스 | 연료펌프모듈용 플랜지 및 그 제조 방법 |
| JP5046405B2 (ja) * | 2010-03-05 | 2012-10-10 | 信越化学工業株式会社 | 含フッ素オルガノポリシロキサン組成物及びその製造方法 |
| CN103483904B (zh) * | 2013-09-17 | 2015-08-05 | 韦丽梅 | 钛箐蓝塑料黑色印刷油墨制造方法 |
| EP3063821B1 (en) * | 2013-10-29 | 2018-08-22 | The Government of the United States of America as represented by the Secretary of the Navy | Cation-conductive conformal ultrathin polymer electrolytes |
| TW201638223A (zh) * | 2015-03-31 | 2016-11-01 | 羅傑斯公司 | 雙溫度固化型聚矽氧組合物、其製造方法及由其製備之物件 |
| DE102015213507A1 (de) * | 2015-07-17 | 2017-01-19 | Tesa Se | Klebeband, das insbesondere in einem Verfahren zum Formen eines Körpers in einer Form eingesetzt werden kann |
| GB201709852D0 (en) * | 2017-06-20 | 2017-08-02 | Advanced Insulation Plc | Thermal insulation structure |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51137751A (en) * | 1975-05-26 | 1976-11-27 | Shin Etsu Chem Co Ltd | Silico ne resin composition for use in laminating |
| JPS55133451A (en) * | 1979-04-03 | 1980-10-17 | Shin Etsu Polymer Co Ltd | Semicured silicone rubber molded article |
| JPS57196415A (en) * | 1981-05-28 | 1982-12-02 | Nitto Electric Ind Co | Insulating tape |
| JPS58174482A (ja) * | 1982-04-07 | 1983-10-13 | Toshiba Silicone Co Ltd | 金属と加熱硬化型ポリオルガノシロキサン組成物との接着方法 |
| JPH04211487A (ja) * | 1990-01-16 | 1992-08-03 | Dow Corning Corp | シリコーン感圧接着剤組成物 |
| JPH0565417A (ja) * | 1990-12-03 | 1993-03-19 | Dow Corning Corp | 硬化性オルガノシロキサン組成物 |
| JP2004123952A (ja) * | 2002-10-04 | 2004-04-22 | Shin Etsu Chem Co Ltd | シリコーン接着剤及びシリコーン接着フイルム |
| JP2006137787A (ja) * | 2004-11-10 | 2006-06-01 | Shin Etsu Chem Co Ltd | 自己接着性加熱硬化促進型液状シリコーンゴム組成物 |
| JP2007191629A (ja) * | 2006-01-20 | 2007-08-02 | Shin Etsu Chem Co Ltd | 熱硬化性組成物 |
| JP2007326312A (ja) * | 2006-06-08 | 2007-12-20 | Shin Etsu Chem Co Ltd | シリコーン粘着層を含む積層体 |
| JP2009302207A (ja) * | 2008-06-11 | 2009-12-24 | Shin-Etsu Chemical Co Ltd | 半導体ウエハ用保護フィルム |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4144219A (en) * | 1969-05-08 | 1979-03-13 | Norton Company | Polyurethane adhesive composition and use thereof |
| US4128909A (en) * | 1976-08-11 | 1978-12-12 | Nagaoka Co. Ltd. | Roller for cleaning phonograph records |
| US4329275A (en) * | 1979-07-27 | 1982-05-11 | Toshiba Silicone Co., Ltd. | Heat-curable polysiloxane composition |
| GB2222171B (en) * | 1988-06-17 | 1992-01-29 | Shinetsu Polymer Co | Method for the preparation of an integral rubber article having electrically insulating and conductive parts |
| US4929669A (en) * | 1988-12-27 | 1990-05-29 | Dow Corning Corporation | Organosiloxane compositions yielding elastomers with improved recovery following prolonged compression |
| US5006373A (en) * | 1989-06-19 | 1991-04-09 | General Electric Company | Method and apparatus for coating fibers with thermoplastics |
| US5082886A (en) * | 1989-08-28 | 1992-01-21 | General Electric Company | Low compression set, oil and fuel resistant, liquid injection moldable, silicone rubber |
| US5108791A (en) * | 1989-11-03 | 1992-04-28 | Dow Corning Corporation | Heat-curable silicone compositions having improved bath life |
| EP0431881B1 (en) * | 1989-12-05 | 1995-06-28 | Shin-Etsu Chemical Co., Ltd. | Fabric material coated with a self-adhesive silicone rubber |
| EP0508372B1 (en) * | 1991-04-09 | 1996-02-28 | Shin-Etsu Chemical Co., Ltd. | Siloxane coating composition for air bag |
| JP2630169B2 (ja) * | 1992-05-22 | 1997-07-16 | 信越化学工業株式会社 | シリコーンゴム組成物及びその硬化物 |
| JP3188319B2 (ja) * | 1992-08-18 | 2001-07-16 | 鐘淵化学工業株式会社 | 硬化性組成物 |
| US5366809A (en) * | 1993-09-02 | 1994-11-22 | Dow Corning Corporation | Silicone pressure-sensitive adhesives |
| US5863625A (en) * | 1995-11-17 | 1999-01-26 | Highland Industries, Inc. | Stable silicone coated fabric without adhesion promoter |
| US5700532A (en) * | 1995-11-17 | 1997-12-23 | Highland Industries, Inc. | Stable silicone coated fabric without adhesion promoter |
| DE19546581C2 (de) * | 1995-12-13 | 2000-01-20 | Silu Verwaltung Ag | Vorrichtung zum Aufbringen von klebendem Montageband |
| DE19629063A1 (de) * | 1996-07-17 | 1998-01-22 | Wacker Chemie Gmbh | Flüssigsiliconkautschuk mit niedrigem Druckverformungsrest |
| US6004817A (en) * | 1997-04-04 | 1999-12-21 | 3M Innovative Properties Company | Method for measuring stress levels in polymeric compositions |
| JP3482115B2 (ja) * | 1997-10-13 | 2003-12-22 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性シリコーン組成物および電子部品 |
| DE10037884A1 (de) * | 2000-08-03 | 2002-02-21 | Henkel Kgaa | Verfahren zur beschleunigten Klebstoffaushärtung |
| US20050062024A1 (en) * | 2003-08-06 | 2005-03-24 | Bessette Michael D. | Electrically conductive pressure sensitive adhesives, method of manufacture, and use thereof |
| JP4619710B2 (ja) * | 2004-07-02 | 2011-01-26 | 東レ・ダウコーニング株式会社 | シリコーン系感圧接着剤および粘着テープ |
| DE102005055769A1 (de) * | 2005-11-21 | 2007-05-24 | Tesa Ag | Verfahren zur temporären Fixierung eines polymeren Schichtmaterials auf rauen Oberflächen |
| US7718256B1 (en) * | 2006-04-05 | 2010-05-18 | Northrop Grumman Corporation | Thermal interface material for electronic assemblies |
| JP5534640B2 (ja) * | 2007-12-27 | 2014-07-02 | 東レ・ダウコーニング株式会社 | シリコーン系感圧接着剤組成物、感圧接着シートおよびシリコーンゴム積層体 |
-
2009
- 2009-06-24 EP EP09770916.6A patent/EP2291473B1/en active Active
- 2009-06-24 US US13/000,389 patent/US20110104470A1/en not_active Abandoned
- 2009-06-24 WO PCT/US2009/048399 patent/WO2009158383A2/en not_active Ceased
- 2009-06-24 JP JP2011516565A patent/JP2011526648A/ja active Pending
- 2009-06-24 CN CN200980123820.7A patent/CN102083926B/zh active Active
-
2014
- 2014-10-21 JP JP2014214407A patent/JP6043326B2/ja active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51137751A (en) * | 1975-05-26 | 1976-11-27 | Shin Etsu Chem Co Ltd | Silico ne resin composition for use in laminating |
| JPS55133451A (en) * | 1979-04-03 | 1980-10-17 | Shin Etsu Polymer Co Ltd | Semicured silicone rubber molded article |
| JPS57196415A (en) * | 1981-05-28 | 1982-12-02 | Nitto Electric Ind Co | Insulating tape |
| JPS58174482A (ja) * | 1982-04-07 | 1983-10-13 | Toshiba Silicone Co Ltd | 金属と加熱硬化型ポリオルガノシロキサン組成物との接着方法 |
| JPH04211487A (ja) * | 1990-01-16 | 1992-08-03 | Dow Corning Corp | シリコーン感圧接着剤組成物 |
| JPH0565417A (ja) * | 1990-12-03 | 1993-03-19 | Dow Corning Corp | 硬化性オルガノシロキサン組成物 |
| JP2004123952A (ja) * | 2002-10-04 | 2004-04-22 | Shin Etsu Chem Co Ltd | シリコーン接着剤及びシリコーン接着フイルム |
| JP2006137787A (ja) * | 2004-11-10 | 2006-06-01 | Shin Etsu Chem Co Ltd | 自己接着性加熱硬化促進型液状シリコーンゴム組成物 |
| JP2007191629A (ja) * | 2006-01-20 | 2007-08-02 | Shin Etsu Chem Co Ltd | 熱硬化性組成物 |
| JP2007326312A (ja) * | 2006-06-08 | 2007-12-20 | Shin Etsu Chem Co Ltd | シリコーン粘着層を含む積層体 |
| JP2009302207A (ja) * | 2008-06-11 | 2009-12-24 | Shin-Etsu Chemical Co Ltd | 半導体ウエハ用保護フィルム |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11279827B2 (en) | 2016-09-26 | 2022-03-22 | Dow Toray Co., Ltd. | Curing reactive silicone gel and use thereof |
| WO2018186165A1 (ja) * | 2017-04-06 | 2018-10-11 | 東レ・ダウコーニング株式会社 | 液状硬化性シリコーン接着剤組成物、その硬化物およびその用途 |
| JPWO2018186165A1 (ja) * | 2017-04-06 | 2020-02-13 | ダウ・東レ株式会社 | 液状硬化性シリコーン接着剤組成物、その硬化物およびその用途 |
| US11396616B2 (en) | 2017-04-06 | 2022-07-26 | Dow Toray Co., Ltd. | Liquid curable silicone adhesive composition, cured product thereof, and use thereof |
| JP7150702B2 (ja) | 2017-04-06 | 2022-10-11 | ダウ・東レ株式会社 | 液状硬化性シリコーン接着剤組成物、その硬化物およびその用途 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2291473B1 (en) | 2016-08-17 |
| EP2291473A2 (en) | 2011-03-09 |
| JP6043326B2 (ja) | 2016-12-14 |
| CN102083926B (zh) | 2014-05-28 |
| WO2009158383A2 (en) | 2009-12-30 |
| WO2009158383A3 (en) | 2010-03-25 |
| CN102083926A (zh) | 2011-06-01 |
| JP2015110740A (ja) | 2015-06-18 |
| US20110104470A1 (en) | 2011-05-05 |
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