JPS55133451A - Semicured silicone rubber molded article - Google Patents
Semicured silicone rubber molded articleInfo
- Publication number
- JPS55133451A JPS55133451A JP4017279A JP4017279A JPS55133451A JP S55133451 A JPS55133451 A JP S55133451A JP 4017279 A JP4017279 A JP 4017279A JP 4017279 A JP4017279 A JP 4017279A JP S55133451 A JPS55133451 A JP S55133451A
- Authority
- JP
- Japan
- Prior art keywords
- semicured
- vinyl group
- molded article
- 000cst
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
Abstract
PURPOSE: The title semicured molded article usable for insulating tapes, free from surface tack, comprising a specific diorganopolysiloxane, vinyl group-containing organopolysiloxane, organohydrogenpolysiloxane, etc.
CONSTITUTION: (A) 100pts.wt. of a diorganopolysiloxane having a viscosity ≥1,000,000cSt (at 25°C) of the average composition formula I, is mixed with (B) 5W80pts.wt. of a vinyl group-containing organopolysiloxane of formula II having two or more vinyl groups and a viscosity of 100W500,000cSt (at 25°C), (C) a liquid organohydrogenpolysiloxane of formula III having 3 or more Si-H bonds in one molecule in an amount to give 0.5W1.2 hydrogen atoms per vinyl group of (B), (D) 10W200pts.wt. of an inorganic filler, (E) a catalytic amount, calculated as Pt of 5W1,000ppm, of platinum or its compound, and (F) 0.01W15pts.wt. of an organic peroxide. The resulting mixture is then incorporated with 0.1W5pts.wt. of a blowing agent and semicured at room temperatureW80°C.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4017279A JPS601892B2 (en) | 1979-04-03 | 1979-04-03 | Semi-cured silicone rubber molded products |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4017279A JPS601892B2 (en) | 1979-04-03 | 1979-04-03 | Semi-cured silicone rubber molded products |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55133451A true JPS55133451A (en) | 1980-10-17 |
JPS601892B2 JPS601892B2 (en) | 1985-01-18 |
Family
ID=12573343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4017279A Expired JPS601892B2 (en) | 1979-04-03 | 1979-04-03 | Semi-cured silicone rubber molded products |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS601892B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57191902A (en) * | 1981-05-21 | 1982-11-25 | Hitachi Cable | Thermal conductive insulating sheet |
EP0084321A2 (en) * | 1982-01-16 | 1983-07-27 | Bayer Ag | Cross-linkable graft polymer dispersions from organosiloxanes containing hydrogen-siloxane and Si-vinyl groups |
JPH03119061A (en) * | 1989-09-30 | 1991-05-21 | Shiigeru:Kk | Preparation of gel porous material and silicone gel porous material |
EP0465906A2 (en) * | 1990-06-25 | 1992-01-15 | Dow Corning Toray Silicone Company, Limited | Method of manufacturing silicone rubber moldings |
JPH0436355A (en) * | 1990-05-31 | 1992-02-06 | Toray Dow Corning Silicone Co Ltd | Silicone rubber composition |
JPH04220463A (en) * | 1990-03-15 | 1992-08-11 | General Electric Co <Ge> | Transparent silicone coating material which prevents splinter scattering |
JPH0565414A (en) * | 1991-09-05 | 1993-03-19 | Toshiba Silicone Co Ltd | Thermosetting silicone rubber composition, rubber laminate using the same composition and its production |
JP2007024948A (en) * | 2005-07-12 | 2007-02-01 | Konica Minolta Business Technologies Inc | Separating device, toner fixing device, and image forming apparatus |
JP2011526648A (en) * | 2008-06-26 | 2011-10-13 | ダウ・コーニング・コーポレイション | Method for forming curable adhesive tape and method for forming insulating layer on conductive substrate |
JP2018510240A (en) * | 2015-03-31 | 2018-04-12 | ロジャーズ コーポレーション | Dual temperature curable silicone composition, method of manufacture, and article prepared therefrom |
-
1979
- 1979-04-03 JP JP4017279A patent/JPS601892B2/en not_active Expired
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57191902A (en) * | 1981-05-21 | 1982-11-25 | Hitachi Cable | Thermal conductive insulating sheet |
EP0084321A2 (en) * | 1982-01-16 | 1983-07-27 | Bayer Ag | Cross-linkable graft polymer dispersions from organosiloxanes containing hydrogen-siloxane and Si-vinyl groups |
US4463127A (en) * | 1982-01-16 | 1984-07-31 | Bayer Aktiengesellschaft | Crosslinkable graft polymer dispersion of organopolysiloxanes containing hydrogen-siloxane groups and Si-vinyl groups |
JPH03119061A (en) * | 1989-09-30 | 1991-05-21 | Shiigeru:Kk | Preparation of gel porous material and silicone gel porous material |
JPH04220463A (en) * | 1990-03-15 | 1992-08-11 | General Electric Co <Ge> | Transparent silicone coating material which prevents splinter scattering |
JPH0436355A (en) * | 1990-05-31 | 1992-02-06 | Toray Dow Corning Silicone Co Ltd | Silicone rubber composition |
EP0465906A2 (en) * | 1990-06-25 | 1992-01-15 | Dow Corning Toray Silicone Company, Limited | Method of manufacturing silicone rubber moldings |
US5160670A (en) * | 1990-06-25 | 1992-11-03 | Dow Corning Toray Silicone Co., Ltd. | Method of manufacturing silicone rubber moldings |
JPH0565414A (en) * | 1991-09-05 | 1993-03-19 | Toshiba Silicone Co Ltd | Thermosetting silicone rubber composition, rubber laminate using the same composition and its production |
JP2007024948A (en) * | 2005-07-12 | 2007-02-01 | Konica Minolta Business Technologies Inc | Separating device, toner fixing device, and image forming apparatus |
JP2011526648A (en) * | 2008-06-26 | 2011-10-13 | ダウ・コーニング・コーポレイション | Method for forming curable adhesive tape and method for forming insulating layer on conductive substrate |
JP2015110740A (en) * | 2008-06-26 | 2015-06-18 | ダウ・コーニング・コーポレイション | Forming method of curable adhesive tape and forming method of insulating layer on conductive substrate |
JP2018510240A (en) * | 2015-03-31 | 2018-04-12 | ロジャーズ コーポレーション | Dual temperature curable silicone composition, method of manufacture, and article prepared therefrom |
JP2021152185A (en) * | 2015-03-31 | 2021-09-30 | ロジャーズ コーポレーション | Dual temperature curable silicone compositions, methods of manufacture, and articles prepared therefrom |
US11530305B2 (en) | 2015-03-31 | 2022-12-20 | Rogers Corporation | Dual temperature curable silicone compositions, methods of manufacture, and articles prepared therefrom |
Also Published As
Publication number | Publication date |
---|---|
JPS601892B2 (en) | 1985-01-18 |
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