JP2011526648A5 - - Google Patents

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Publication number
JP2011526648A5
JP2011526648A5 JP2011516565A JP2011516565A JP2011526648A5 JP 2011526648 A5 JP2011526648 A5 JP 2011526648A5 JP 2011516565 A JP2011516565 A JP 2011516565A JP 2011516565 A JP2011516565 A JP 2011516565A JP 2011526648 A5 JP2011526648 A5 JP 2011526648A5
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JP
Japan
Prior art keywords
silicone composition
partially cured
reaction intermediate
conductive substrate
cured reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011516565A
Other languages
English (en)
Japanese (ja)
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JP2011526648A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/048399 external-priority patent/WO2009158383A2/en
Publication of JP2011526648A publication Critical patent/JP2011526648A/ja
Publication of JP2011526648A5 publication Critical patent/JP2011526648A5/ja
Pending legal-status Critical Current

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JP2011516565A 2008-06-26 2009-06-24 硬化性接着テープを形成する方法および導電性基板上に絶縁層を形成する方法 Pending JP2011526648A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7593708P 2008-06-26 2008-06-26
US61/075,937 2008-06-26
PCT/US2009/048399 WO2009158383A2 (en) 2008-06-26 2009-06-24 Method of forming a curable adhesive tape and an insulating layer on a conductive substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014214407A Division JP6043326B2 (ja) 2008-06-26 2014-10-21 硬化性接着テープを形成する方法および導電性基材上に絶縁層を形成する方法

Publications (2)

Publication Number Publication Date
JP2011526648A JP2011526648A (ja) 2011-10-13
JP2011526648A5 true JP2011526648A5 (enExample) 2012-06-28

Family

ID=41334626

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011516565A Pending JP2011526648A (ja) 2008-06-26 2009-06-24 硬化性接着テープを形成する方法および導電性基板上に絶縁層を形成する方法
JP2014214407A Active JP6043326B2 (ja) 2008-06-26 2014-10-21 硬化性接着テープを形成する方法および導電性基材上に絶縁層を形成する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014214407A Active JP6043326B2 (ja) 2008-06-26 2014-10-21 硬化性接着テープを形成する方法および導電性基材上に絶縁層を形成する方法

Country Status (5)

Country Link
US (1) US20110104470A1 (enExample)
EP (1) EP2291473B1 (enExample)
JP (2) JP2011526648A (enExample)
CN (1) CN102083926B (enExample)
WO (1) WO2009158383A2 (enExample)

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KR101149806B1 (ko) * 2010-02-19 2012-06-08 주식회사 코아비스 연료펌프모듈용 플랜지 및 그 제조 방법
JP5046405B2 (ja) * 2010-03-05 2012-10-10 信越化学工業株式会社 含フッ素オルガノポリシロキサン組成物及びその製造方法
CN103483904B (zh) * 2013-09-17 2015-08-05 韦丽梅 钛箐蓝塑料黑色印刷油墨制造方法
EP3063821B1 (en) * 2013-10-29 2018-08-22 The Government of the United States of America as represented by the Secretary of the Navy Cation-conductive conformal ultrathin polymer electrolytes
TW201638223A (zh) * 2015-03-31 2016-11-01 羅傑斯公司 雙溫度固化型聚矽氧組合物、其製造方法及由其製備之物件
DE102015213507A1 (de) * 2015-07-17 2017-01-19 Tesa Se Klebeband, das insbesondere in einem Verfahren zum Formen eines Körpers in einer Form eingesetzt werden kann
KR102279871B1 (ko) 2016-09-26 2021-07-21 듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤 경화 반응성 실리콘 겔 및 이의 용도
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GB201709852D0 (en) * 2017-06-20 2017-08-02 Advanced Insulation Plc Thermal insulation structure

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