JP2011235532A5 - - Google Patents
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- Publication number
- JP2011235532A5 JP2011235532A5 JP2010108805A JP2010108805A JP2011235532A5 JP 2011235532 A5 JP2011235532 A5 JP 2011235532A5 JP 2010108805 A JP2010108805 A JP 2010108805A JP 2010108805 A JP2010108805 A JP 2010108805A JP 2011235532 A5 JP2011235532 A5 JP 2011235532A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- bonding film
- substrate
- film
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 125000000962 organic group Chemical group 0.000 claims description 2
- 125000004429 atom Chemical group 0.000 claims 5
- 238000000862 absorption spectrum Methods 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000011343 solid material Substances 0.000 claims 1
- 230000003213 activating effect Effects 0.000 description 2
- 230000009849 deactivation Effects 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010108805A JP5625470B2 (ja) | 2010-05-10 | 2010-05-10 | 接合方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010108805A JP5625470B2 (ja) | 2010-05-10 | 2010-05-10 | 接合方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011235532A JP2011235532A (ja) | 2011-11-24 |
| JP2011235532A5 true JP2011235532A5 (enExample) | 2013-08-29 |
| JP5625470B2 JP5625470B2 (ja) | 2014-11-19 |
Family
ID=45324043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010108805A Expired - Fee Related JP5625470B2 (ja) | 2010-05-10 | 2010-05-10 | 接合方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5625470B2 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
| TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
| US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
| US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
| US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
| CN106132688B (zh) | 2014-01-27 | 2020-07-14 | 康宁股份有限公司 | 用于薄片与载体的受控粘结的制品和方法 |
| EP3129221A1 (en) | 2014-04-09 | 2017-02-15 | Corning Incorporated | Device modified substrate article and methods for making |
| CN106489187B (zh) * | 2014-07-10 | 2019-10-25 | 株式会社希克斯 | 半导体基板和半导体基板的制造方法 |
| CN107112279A (zh) * | 2014-11-05 | 2017-08-29 | 康宁股份有限公司 | 从下往上的电解导通镀覆方法 |
| CN107635769B (zh) | 2015-05-19 | 2020-09-15 | 康宁股份有限公司 | 使片材与载体粘结的制品和方法 |
| US11905201B2 (en) | 2015-06-26 | 2024-02-20 | Corning Incorporated | Methods and articles including a sheet and a carrier |
| TWI892429B (zh) | 2016-08-30 | 2025-08-01 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
| TWI810161B (zh) | 2016-08-31 | 2023-08-01 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
| WO2019036710A1 (en) | 2017-08-18 | 2019-02-21 | Corning Incorporated | TEMPORARY BINDING USING POLYCATIONIC POLYMERS |
| JP7053214B2 (ja) | 2017-10-17 | 2022-04-12 | スリーエム イノベイティブ プロパティズ カンパニー | 伸長可能フィルム及び表面コーティング組成物 |
| JP7431160B2 (ja) | 2017-12-15 | 2024-02-14 | コーニング インコーポレイテッド | 基板を処理するための方法および結合されたシートを含む物品を製造するための方法 |
| US10917966B2 (en) | 2018-01-29 | 2021-02-09 | Corning Incorporated | Articles including metallized vias |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008307873A (ja) * | 2007-06-18 | 2008-12-25 | Seiko Epson Corp | 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 |
| JP4337935B2 (ja) * | 2007-07-11 | 2009-09-30 | セイコーエプソン株式会社 | 接合体および接合方法 |
-
2010
- 2010-05-10 JP JP2010108805A patent/JP5625470B2/ja not_active Expired - Fee Related
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