JP5625470B2 - 接合方法 - Google Patents

接合方法 Download PDF

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Publication number
JP5625470B2
JP5625470B2 JP2010108805A JP2010108805A JP5625470B2 JP 5625470 B2 JP5625470 B2 JP 5625470B2 JP 2010108805 A JP2010108805 A JP 2010108805A JP 2010108805 A JP2010108805 A JP 2010108805A JP 5625470 B2 JP5625470 B2 JP 5625470B2
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JP
Japan
Prior art keywords
bonding
substrate
bonding film
film
bonded
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Expired - Fee Related
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JP2010108805A
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English (en)
Japanese (ja)
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JP2011235532A5 (enExample
JP2011235532A (ja
Inventor
佳史 伊藤
佳史 伊藤
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2010108805A priority Critical patent/JP5625470B2/ja
Publication of JP2011235532A publication Critical patent/JP2011235532A/ja
Publication of JP2011235532A5 publication Critical patent/JP2011235532A5/ja
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  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2010108805A 2010-05-10 2010-05-10 接合方法 Expired - Fee Related JP5625470B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010108805A JP5625470B2 (ja) 2010-05-10 2010-05-10 接合方法

Applications Claiming Priority (1)

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JP2010108805A JP5625470B2 (ja) 2010-05-10 2010-05-10 接合方法

Publications (3)

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JP2011235532A JP2011235532A (ja) 2011-11-24
JP2011235532A5 JP2011235532A5 (enExample) 2013-08-29
JP5625470B2 true JP5625470B2 (ja) 2014-11-19

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JP2010108805A Expired - Fee Related JP5625470B2 (ja) 2010-05-10 2010-05-10 接合方法

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JP (1) JP5625470B2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
CN106132688B (zh) 2014-01-27 2020-07-14 康宁股份有限公司 用于薄片与载体的受控粘结的制品和方法
EP3129221A1 (en) 2014-04-09 2017-02-15 Corning Incorporated Device modified substrate article and methods for making
CN106489187B (zh) * 2014-07-10 2019-10-25 株式会社希克斯 半导体基板和半导体基板的制造方法
CN107112279A (zh) * 2014-11-05 2017-08-29 康宁股份有限公司 从下往上的电解导通镀覆方法
CN107635769B (zh) 2015-05-19 2020-09-15 康宁股份有限公司 使片材与载体粘结的制品和方法
US11905201B2 (en) 2015-06-26 2024-02-20 Corning Incorporated Methods and articles including a sheet and a carrier
TWI892429B (zh) 2016-08-30 2025-08-01 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI810161B (zh) 2016-08-31 2023-08-01 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
WO2019036710A1 (en) 2017-08-18 2019-02-21 Corning Incorporated TEMPORARY BINDING USING POLYCATIONIC POLYMERS
JP7053214B2 (ja) 2017-10-17 2022-04-12 スリーエム イノベイティブ プロパティズ カンパニー 伸長可能フィルム及び表面コーティング組成物
JP7431160B2 (ja) 2017-12-15 2024-02-14 コーニング インコーポレイテッド 基板を処理するための方法および結合されたシートを含む物品を製造するための方法
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307873A (ja) * 2007-06-18 2008-12-25 Seiko Epson Corp 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置
JP4337935B2 (ja) * 2007-07-11 2009-09-30 セイコーエプソン株式会社 接合体および接合方法

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JP2011235532A (ja) 2011-11-24

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