JP5625470B2 - 接合方法 - Google Patents

接合方法 Download PDF

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Publication number
JP5625470B2
JP5625470B2 JP2010108805A JP2010108805A JP5625470B2 JP 5625470 B2 JP5625470 B2 JP 5625470B2 JP 2010108805 A JP2010108805 A JP 2010108805A JP 2010108805 A JP2010108805 A JP 2010108805A JP 5625470 B2 JP5625470 B2 JP 5625470B2
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JP
Japan
Prior art keywords
bonding
substrate
bonding film
film
bonded
Prior art date
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Expired - Fee Related
Application number
JP2010108805A
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English (en)
Japanese (ja)
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JP2011235532A (ja
JP2011235532A5 (enExample
Inventor
佳史 伊藤
佳史 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Publication date
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Priority to JP2010108805A priority Critical patent/JP5625470B2/ja
Publication of JP2011235532A publication Critical patent/JP2011235532A/ja
Publication of JP2011235532A5 publication Critical patent/JP2011235532A5/ja
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Expired - Fee Related legal-status Critical Current
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  • Lining Or Joining Of Plastics Or The Like (AREA)
JP2010108805A 2010-05-10 2010-05-10 接合方法 Expired - Fee Related JP5625470B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010108805A JP5625470B2 (ja) 2010-05-10 2010-05-10 接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010108805A JP5625470B2 (ja) 2010-05-10 2010-05-10 接合方法

Publications (3)

Publication Number Publication Date
JP2011235532A JP2011235532A (ja) 2011-11-24
JP2011235532A5 JP2011235532A5 (enExample) 2013-08-29
JP5625470B2 true JP5625470B2 (ja) 2014-11-19

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ID=45324043

Family Applications (1)

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JP2010108805A Expired - Fee Related JP5625470B2 (ja) 2010-05-10 2010-05-10 接合方法

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JP (1) JP5625470B2 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10543662B2 (en) 2012-02-08 2020-01-28 Corning Incorporated Device modified substrate article and methods for making
US10014177B2 (en) 2012-12-13 2018-07-03 Corning Incorporated Methods for processing electronic devices
TWI617437B (zh) 2012-12-13 2018-03-11 康寧公司 促進控制薄片與載體間接合之處理
US10086584B2 (en) 2012-12-13 2018-10-02 Corning Incorporated Glass articles and methods for controlled bonding of glass sheets with carriers
US9340443B2 (en) 2012-12-13 2016-05-17 Corning Incorporated Bulk annealing of glass sheets
US10046542B2 (en) 2014-01-27 2018-08-14 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
KR20160145062A (ko) 2014-04-09 2016-12-19 코닝 인코포레이티드 디바이스 변경된 기판 물품 및 제조 방법
US9773678B2 (en) * 2014-07-10 2017-09-26 Kabushiki Kaisha Toyota Jidoshokki Semiconductor substrate and method for manufacturing semiconductor substrate
TWI689630B (zh) * 2014-11-05 2020-04-01 美商康寧公司 底部向上電解質通孔鍍覆方法
WO2016187186A1 (en) 2015-05-19 2016-11-24 Corning Incorporated Articles and methods for bonding sheets with carriers
EP3313799B1 (en) 2015-06-26 2022-09-07 Corning Incorporated Methods and articles including a sheet and a carrier
TW201825623A (zh) 2016-08-30 2018-07-16 美商康寧公司 用於片材接合的矽氧烷電漿聚合物
TWI821867B (zh) 2016-08-31 2023-11-11 美商康寧公司 具以可控制式黏結的薄片之製品及製作其之方法
CN111372772A (zh) 2017-08-18 2020-07-03 康宁股份有限公司 使用聚阳离子聚合物的临时结合
JP7053214B2 (ja) 2017-10-17 2022-04-12 スリーエム イノベイティブ プロパティズ カンパニー 伸長可能フィルム及び表面コーティング組成物
WO2019118660A1 (en) 2017-12-15 2019-06-20 Corning Incorporated Method for treating a substrate and method for making articles comprising bonded sheets
US10917966B2 (en) 2018-01-29 2021-02-09 Corning Incorporated Articles including metallized vias

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008307873A (ja) * 2007-06-18 2008-12-25 Seiko Epson Corp 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置
JP2009035721A (ja) * 2007-07-11 2009-02-19 Seiko Epson Corp 接合膜付き基材、接合方法および接合体

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Publication number Publication date
JP2011235532A (ja) 2011-11-24

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