JP2011518104A - ルテニウム酸化物を有する、鉛を含有しない抵抗組成物 - Google Patents

ルテニウム酸化物を有する、鉛を含有しない抵抗組成物 Download PDF

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Publication number
JP2011518104A
JP2011518104A JP2011505228A JP2011505228A JP2011518104A JP 2011518104 A JP2011518104 A JP 2011518104A JP 2011505228 A JP2011505228 A JP 2011505228A JP 2011505228 A JP2011505228 A JP 2011505228A JP 2011518104 A JP2011518104 A JP 2011518104A
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JP
Japan
Prior art keywords
oxide
composition
borosilicate glass
thick film
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011505228A
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English (en)
Japanese (ja)
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JP2011518104A5 (https=
Inventor
エイチ．ラブランシュ マーク
ウォーレン ハン ケネス
ティー．ウォーカー アルフレッド
裕子 緒方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40823428&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2011518104(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2011518104A publication Critical patent/JP2011518104A/ja
Publication of JP2011518104A5 publication Critical patent/JP2011518104A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
    • H01C17/0654—Oxides of the platinum group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)
  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Conductive Materials (AREA)
JP2011505228A 2008-04-18 2009-04-17 ルテニウム酸化物を有する、鉛を含有しない抵抗組成物 Pending JP2011518104A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US4628208P 2008-04-18 2008-04-18
US61/046,282 2008-04-18
US12/425,048 2009-04-16
US12/425,048 US8257619B2 (en) 2008-04-18 2009-04-16 Lead-free resistive composition
PCT/US2009/040960 WO2009129463A1 (en) 2008-04-18 2009-04-17 Lead-free resistive compositions having ruthenium oxide

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014039076A Division JP2014144910A (ja) 2008-04-18 2014-02-28 ルテニウム酸化物を有する、鉛を含有しない抵抗組成物

Publications (2)

Publication Number Publication Date
JP2011518104A true JP2011518104A (ja) 2011-06-23
JP2011518104A5 JP2011518104A5 (https=) 2012-06-07

Family

ID=40823428

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011505228A Pending JP2011518104A (ja) 2008-04-18 2009-04-17 ルテニウム酸化物を有する、鉛を含有しない抵抗組成物
JP2014039076A Withdrawn JP2014144910A (ja) 2008-04-18 2014-02-28 ルテニウム酸化物を有する、鉛を含有しない抵抗組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014039076A Withdrawn JP2014144910A (ja) 2008-04-18 2014-02-28 ルテニウム酸化物を有する、鉛を含有しない抵抗組成物

Country Status (7)

Country Link
US (1) US8257619B2 (https=)
EP (1) EP2274249A1 (https=)
JP (2) JP2011518104A (https=)
KR (1) KR101258328B1 (https=)
CN (1) CN101990522B (https=)
TW (1) TW201000424A (https=)
WO (1) WO2009129463A1 (https=)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014154547A (ja) * 2013-02-04 2014-08-25 E.I.Du Pont De Nemours And Company 基板上で銅導体を形成する方法における銅ペースト組成物およびその使用
WO2016039108A1 (ja) * 2014-09-12 2016-03-17 昭栄化学工業株式会社 厚膜抵抗体及びその製造方法
WO2016039107A1 (ja) * 2014-09-12 2016-03-17 昭栄化学工業株式会社 抵抗組成物
JP2017048061A (ja) * 2015-08-31 2017-03-09 日本電気硝子株式会社 ガラスペースト組成物及び被膜形成ガラス部材の製造方法
WO2018074562A1 (ja) * 2016-10-20 2018-04-26 住友金属鉱山株式会社 抵抗ペースト及びその焼成により作製される抵抗体
WO2018150890A1 (ja) * 2017-02-17 2018-08-23 住友金属鉱山株式会社 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体

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* Cited by examiner, † Cited by third party
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US20140193647A1 (en) * 2011-03-24 2014-07-10 Bengurion University Of The Negev Research And Development Authority Coatings for solar applications
EP2751044B1 (en) * 2011-09-13 2020-04-22 Ferro Corporation Induction sealing of inorganic substrates
KR101351916B1 (ko) * 2011-11-01 2014-02-17 중원대학교 산학협력단 루테늄산염수용액을 이용한 이산화루테늄 제조 방법
KR101757089B1 (ko) * 2013-02-04 2017-07-11 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼 저항체, 유전체 등의 전자 부품용 무기 재료 페이스트 및 그 무기 재료 페이스트의 제조 방법
DE102015110607A1 (de) * 2015-07-01 2017-01-05 Epcos Ag Verfahren zur Herstellung eines elektrischen Bauelements
CN106601331A (zh) * 2016-10-25 2017-04-26 东莞珂洛赫慕电子材料科技有限公司 一种具有低tcr值的高温无铅钌浆及其制备方法
US10115505B2 (en) 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor
CN114930467B (zh) * 2020-01-16 2025-11-11 纳美仕有限公司 导电性膏、电极以及贴片电阻器
CN114831350A (zh) * 2021-02-02 2022-08-02 深圳麦克韦尔科技有限公司 发热组件及电子雾化装置

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JP2001196201A (ja) * 1999-10-28 2001-07-19 Sumitomo Metal Electronics Devices Inc 厚膜抵抗体
WO2004047124A1 (ja) * 2002-11-21 2004-06-03 Tdk Corporation 抵抗体ペースト、抵抗体および電子部品
JP2007103594A (ja) * 2005-10-03 2007-04-19 Shoei Chem Ind Co 抵抗体組成物並びに厚膜抵抗体

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EP0132810A1 (en) 1983-07-25 1985-02-13 E.I. Du Pont De Nemours And Company Borosilicate glass composition
US4651126A (en) * 1985-05-02 1987-03-17 Shailendra Kumar Electrical resistor material, resistor made therefrom and method of making the same
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US5534194A (en) * 1993-03-30 1996-07-09 E. I. Du Pont De Nemours And Company Thick film resistor composition containing pyrochlore and silver-containing binder
US5474711A (en) * 1993-05-07 1995-12-12 E. I. Du Pont De Nemours And Company Thick film resistor compositions
US5491118A (en) * 1994-12-20 1996-02-13 E. I. Du Pont De Nemours And Company Cadmium-free and lead-free thick film paste composition
WO1999063553A1 (en) 1998-05-29 1999-12-09 E.I. Du Pont De Nemours And Company Thick film resistor compositions for making heat-transfer tapes and use thereof
DE60021828D1 (de) * 1999-10-28 2005-09-15 Murata Manufacturing Co Dickschicht-Widerstand und Keramiksubstrat
JP2005244115A (ja) 2004-02-27 2005-09-08 Tdk Corp 抵抗体ペースト、抵抗体及び電子部品
CN100511496C (zh) * 2004-09-01 2009-07-08 Tdk株式会社 厚膜电阻浆料和厚膜电阻
TW200612443A (en) * 2004-09-01 2006-04-16 Tdk Corp Thick-film resistor paste and thick-film resistor
JP3800614B1 (ja) * 2004-09-01 2006-07-26 Ｔｄｋ株式会社 厚膜抵抗体ペーストおよび厚膜抵抗体
KR101258329B1 (ko) * 2008-04-18 2013-04-25 이 아이 듀폰 디 네모아 앤드 캄파니 Ｃｕ-함유 유리 프릿을 사용하는 저항 조성물

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JP2001196201A (ja) * 1999-10-28 2001-07-19 Sumitomo Metal Electronics Devices Inc 厚膜抵抗体
WO2004047124A1 (ja) * 2002-11-21 2004-06-03 Tdk Corporation 抵抗体ペースト、抵抗体および電子部品
JP2007103594A (ja) * 2005-10-03 2007-04-19 Shoei Chem Ind Co 抵抗体組成物並びに厚膜抵抗体

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014154547A (ja) * 2013-02-04 2014-08-25 E.I.Du Pont De Nemours And Company 基板上で銅導体を形成する方法における銅ペースト組成物およびその使用
CN107293352B (zh) * 2014-09-12 2019-06-14 昭荣化学工业株式会社 厚膜电阻体及其制造方法
KR101738326B1 (ko) 2014-09-12 2017-05-19 소에이 가가쿠 고교 가부시키가이샤 저항 조성물
JP5988124B2 (ja) * 2014-09-12 2016-09-07 昭栄化学工業株式会社 厚膜抵抗体及びその製造方法
JP5988123B2 (ja) * 2014-09-12 2016-09-07 昭栄化学工業株式会社 抵抗組成物
CN106104711A (zh) * 2014-09-12 2016-11-09 昭荣化学工业株式会社 厚膜电阻体及其制造方法
US10446290B2 (en) 2014-09-12 2019-10-15 Shoei Chemical Inc. Resistive composition
US9892828B2 (en) 2014-09-12 2018-02-13 Shoei Chemical Inc. Thick film resistor and production method for same
TWI587320B (zh) * 2014-09-12 2017-06-11 昭榮化學工業股份有限公司 Resistance composition
KR101747621B1 (ko) 2014-09-12 2017-06-14 소에이 가가쿠 고교 가부시키가이샤 후막 저항체 및 그 제조방법
CN107293352A (zh) * 2014-09-12 2017-10-24 昭荣化学工业株式会社 厚膜电阻体及其制造方法
WO2016039107A1 (ja) * 2014-09-12 2016-03-17 昭栄化学工業株式会社 抵抗組成物
US9805839B2 (en) 2014-09-12 2017-10-31 Shoei Chemical Inc. Resistive composition
US10403421B2 (en) 2014-09-12 2019-09-03 Shoei Chemical Inc. Thick film resistor and production method for same
WO2016039108A1 (ja) * 2014-09-12 2016-03-17 昭栄化学工業株式会社 厚膜抵抗体及びその製造方法
CN106104711B (zh) * 2014-09-12 2018-06-15 昭荣化学工业株式会社 厚膜电阻体及其制造方法
JP2017048061A (ja) * 2015-08-31 2017-03-09 日本電気硝子株式会社 ガラスペースト組成物及び被膜形成ガラス部材の製造方法
WO2018074562A1 (ja) * 2016-10-20 2018-04-26 住友金属鉱山株式会社 抵抗ペースト及びその焼成により作製される抵抗体
JP2018067478A (ja) * 2016-10-20 2018-04-26 住友金属鉱山株式会社 抵抗ペースト及びその焼成により作製される抵抗体
KR20190072540A (ko) * 2016-10-20 2019-06-25 스미토모 긴조쿠 고잔 가부시키가이샤 저항 페이스트 및 그의 소성에 의해 제작되는 저항체
KR102384488B1 (ko) 2016-10-20 2022-04-08 스미토모 긴조쿠 고잔 가부시키가이샤 저항 페이스트 및 그의 소성에 의해 제작되는 저항체
WO2018150890A1 (ja) * 2017-02-17 2018-08-23 住友金属鉱山株式会社 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体
JP2018133539A (ja) * 2017-02-17 2018-08-23 住友金属鉱山株式会社 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体
KR20190117546A (ko) * 2017-02-17 2019-10-16 스미토모 긴조쿠 고잔 가부시키가이샤 저항체용 조성물 및 이것을 포함한 저항체 페이스트와 그것을 이용한 후막 저항체
KR102420736B1 (ko) * 2017-02-17 2022-07-14 스미토모 긴조쿠 고잔 가부시키가이샤 저항체용 조성물 및 이것을 포함한 저항체 페이스트와 그것을 이용한 후막 저항체

Also Published As

Publication number Publication date
TW201000424A (en) 2010-01-01
KR20100134767A (ko) 2010-12-23
US8257619B2 (en) 2012-09-04
KR101258328B1 (ko) 2013-04-25
CN101990522A (zh) 2011-03-23
CN101990522B (zh) 2014-05-07
WO2009129463A1 (en) 2009-10-22
JP2014144910A (ja) 2014-08-14
US20110089381A1 (en) 2011-04-21
EP2274249A1 (en) 2011-01-19

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