CN101990522B - 具有氧化钌的无铅电阻器组合物 - Google Patents

具有氧化钌的无铅电阻器组合物 Download PDF

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Publication number
CN101990522B
CN101990522B CN200980112902.1A CN200980112902A CN101990522B CN 101990522 B CN101990522 B CN 101990522B CN 200980112902 A CN200980112902 A CN 200980112902A CN 101990522 B CN101990522 B CN 101990522B
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CN
China
Prior art keywords
weight
oxidation thing
alpha
borosilicate glass
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
CN200980112902.1A
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English (en)
Chinese (zh)
Other versions
CN101990522A (zh
Inventor
M·H·拉布兰切
K·W·杭
A·T·沃克
緖方裕子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronics Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN101990522A publication Critical patent/CN101990522A/zh
Application granted granted Critical
Publication of CN101990522B publication Critical patent/CN101990522B/zh
Ceased legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02—Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04—Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/22—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions containing two or more distinct frits having different compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of oxides
    • H01C17/0654—Oxides of the platinum group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Glass Compositions (AREA)
  • Non-Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Conductive Materials (AREA)
CN200980112902.1A 2008-04-18 2009-04-17 具有氧化钌的无铅电阻器组合物 Ceased CN101990522B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US4628208P 2008-04-18 2008-04-18
US61/046,282 2008-04-18
US12/425,048 2009-04-16
US12/425,048 US8257619B2 (en) 2008-04-18 2009-04-16 Lead-free resistive composition
PCT/US2009/040960 WO2009129463A1 (en) 2008-04-18 2009-04-17 Lead-free resistive compositions having ruthenium oxide

Publications (2)

Publication Number Publication Date
CN101990522A CN101990522A (zh) 2011-03-23
CN101990522B true CN101990522B (zh) 2014-05-07

Family

ID=40823428

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980112902.1A Ceased CN101990522B (zh) 2008-04-18 2009-04-17 具有氧化钌的无铅电阻器组合物

Country Status (7)

Country Link
US (1) US8257619B2 (https=)
EP (1) EP2274249A1 (https=)
JP (2) JP2011518104A (https=)
KR (1) KR101258328B1 (https=)
CN (1) CN101990522B (https=)
TW (1) TW201000424A (https=)
WO (1) WO2009129463A1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140193647A1 (en) * 2011-03-24 2014-07-10 Bengurion University Of The Negev Research And Development Authority Coatings for solar applications
EP2751044B1 (en) * 2011-09-13 2020-04-22 Ferro Corporation Induction sealing of inorganic substrates
KR101351916B1 (ko) * 2011-11-01 2014-02-17 중원대학교 산학협력단 루테늄산염수용액을 이용한 이산화루테늄 제조 방법
KR101757089B1 (ko) * 2013-02-04 2017-07-11 고쿠리츠켄큐카이하츠호진 상교기쥬츠 소고켄큐쇼 저항체, 유전체 등의 전자 부품용 무기 재료 페이스트 및 그 무기 재료 페이스트의 제조 방법
US9236155B2 (en) * 2013-02-04 2016-01-12 E I Du Pont De Nemours And Company Copper paste composition and its use in a method for forming copper conductors on substrates
US9805839B2 (en) 2014-09-12 2017-10-31 Shoei Chemical Inc. Resistive composition
KR101747621B1 (ko) * 2014-09-12 2017-06-14 소에이 가가쿠 고교 가부시키가이샤 후막 저항체 및 그 제조방법
DE102015110607A1 (de) * 2015-07-01 2017-01-05 Epcos Ag Verfahren zur Herstellung eines elektrischen Bauelements
JP2017048061A (ja) * 2015-08-31 2017-03-09 日本電気硝子株式会社 ガラスペースト組成物及び被膜形成ガラス部材の製造方法
JP6708093B2 (ja) * 2016-10-20 2020-06-10 住友金属鉱山株式会社 抵抗ペースト及びその焼成により作製される抵抗体
CN106601331A (zh) * 2016-10-25 2017-04-26 东莞珂洛赫慕电子材料科技有限公司 一种具有低tcr值的高温无铅钌浆及其制备方法
JP6931455B2 (ja) * 2017-02-17 2021-09-08 住友金属鉱山株式会社 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体
US10115505B2 (en) 2017-02-23 2018-10-30 E I Du Pont De Nemours And Company Chip resistor
CN114930467B (zh) * 2020-01-16 2025-11-11 纳美仕有限公司 导电性膏、电极以及贴片电阻器
CN114831350A (zh) * 2021-02-02 2022-08-02 深圳麦克韦尔科技有限公司 发热组件及电子雾化装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0132810A1 (en) * 1983-07-25 1985-02-13 E.I. Du Pont De Nemours And Company Borosilicate glass composition
WO1993023855A1 (en) * 1992-05-11 1993-11-25 E.I. Du Pont De Nemours And Company Thick film resistor composition
US5474711A (en) * 1993-05-07 1995-12-12 E. I. Du Pont De Nemours And Company Thick film resistor compositions
US5534194A (en) * 1993-03-30 1996-07-09 E. I. Du Pont De Nemours And Company Thick film resistor composition containing pyrochlore and silver-containing binder
WO1999063553A1 (en) * 1998-05-29 1999-12-09 E.I. Du Pont De Nemours And Company Thick film resistor compositions for making heat-transfer tapes and use thereof
JP2005244115A (ja) * 2004-02-27 2005-09-08 Tdk Corp 抵抗体ペースト、抵抗体及び電子部品
CN1744239A (zh) * 2004-09-01 2006-03-08 Tdk株式会社 厚膜电阻浆料和厚膜电阻

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4051074A (en) * 1975-10-29 1977-09-27 Shoei Kagaku Kogyo Kabushiki Kaisha Resistor composition and method for its manufacture
US4312770A (en) * 1979-07-09 1982-01-26 General Motors Corporation Thick film resistor paste and resistors therefrom
US4651126A (en) * 1985-05-02 1987-03-17 Shailendra Kumar Electrical resistor material, resistor made therefrom and method of making the same
US5491118A (en) * 1994-12-20 1996-02-13 E. I. Du Pont De Nemours And Company Cadmium-free and lead-free thick film paste composition
JP3731803B2 (ja) * 1999-10-28 2006-01-05 株式会社村田製作所 厚膜抵抗体
DE60021828D1 (de) * 1999-10-28 2005-09-15 Murata Manufacturing Co Dickschicht-Widerstand und Keramiksubstrat
CN100538921C (zh) * 2002-11-21 2009-09-09 Tdk株式会社 电阻器糊料、电阻器及电子部件
TW200612443A (en) * 2004-09-01 2006-04-16 Tdk Corp Thick-film resistor paste and thick-film resistor
JP3800614B1 (ja) * 2004-09-01 2006-07-26 Ｔｄｋ株式会社 厚膜抵抗体ペーストおよび厚膜抵抗体
JP2007103594A (ja) * 2005-10-03 2007-04-19 Shoei Chem Ind Co 抵抗体組成物並びに厚膜抵抗体
KR101258329B1 (ko) * 2008-04-18 2013-04-25 이 아이 듀폰 디 네모아 앤드 캄파니 Ｃｕ-함유 유리 프릿을 사용하는 저항 조성물

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0132810A1 (en) * 1983-07-25 1985-02-13 E.I. Du Pont De Nemours And Company Borosilicate glass composition
WO1993023855A1 (en) * 1992-05-11 1993-11-25 E.I. Du Pont De Nemours And Company Thick film resistor composition
US5534194A (en) * 1993-03-30 1996-07-09 E. I. Du Pont De Nemours And Company Thick film resistor composition containing pyrochlore and silver-containing binder
US5474711A (en) * 1993-05-07 1995-12-12 E. I. Du Pont De Nemours And Company Thick film resistor compositions
WO1999063553A1 (en) * 1998-05-29 1999-12-09 E.I. Du Pont De Nemours And Company Thick film resistor compositions for making heat-transfer tapes and use thereof
JP2005244115A (ja) * 2004-02-27 2005-09-08 Tdk Corp 抵抗体ペースト、抵抗体及び電子部品
CN1744239A (zh) * 2004-09-01 2006-03-08 Tdk株式会社 厚膜电阻浆料和厚膜电阻

Also Published As

Publication number Publication date
TW201000424A (en) 2010-01-01
KR20100134767A (ko) 2010-12-23
US8257619B2 (en) 2012-09-04
KR101258328B1 (ko) 2013-04-25
CN101990522A (zh) 2011-03-23
JP2011518104A (ja) 2011-06-23
WO2009129463A1 (en) 2009-10-22
JP2014144910A (ja) 2014-08-14
US20110089381A1 (en) 2011-04-21
EP2274249A1 (en) 2011-01-19

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20200628

Address after: Delaware, USA

Patentee after: DuPont Electronics

Address before: Delaware, USA

Patentee before: E. I. DU PONT DE NEMOURS AND Co.

IW01 Full invalidation of patent right
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20201116

Decision number of declaring invalidation: 46749

Granted publication date: 20140507