JP2011516626A5 - - Google Patents

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Publication number
JP2011516626A5
JP2011516626A5 JP2010549716A JP2010549716A JP2011516626A5 JP 2011516626 A5 JP2011516626 A5 JP 2011516626A5 JP 2010549716 A JP2010549716 A JP 2010549716A JP 2010549716 A JP2010549716 A JP 2010549716A JP 2011516626 A5 JP2011516626 A5 JP 2011516626A5
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JP
Japan
Prior art keywords
sio
average
silicon
per molecule
resin
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Pending
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JP2010549716A
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English (en)
Japanese (ja)
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JP2011516626A (ja
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Priority claimed from PCT/US2009/034835 external-priority patent/WO2009111196A1/en
Publication of JP2011516626A publication Critical patent/JP2011516626A/ja
Publication of JP2011516626A5 publication Critical patent/JP2011516626A5/ja
Pending legal-status Critical Current

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JP2010549716A 2008-03-04 2009-02-23 シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板 Pending JP2011516626A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US3344608P 2008-03-04 2008-03-04
US61/033,446 2008-03-04
PCT/US2009/034835 WO2009111196A1 (en) 2008-03-04 2009-02-23 Silicone composition, silicone adhesive, coated and laminated substrates

Publications (2)

Publication Number Publication Date
JP2011516626A JP2011516626A (ja) 2011-05-26
JP2011516626A5 true JP2011516626A5 (enExample) 2013-10-24

Family

ID=40875049

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010549716A Pending JP2011516626A (ja) 2008-03-04 2009-02-23 シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板
JP2010549719A Expired - Fee Related JP5331825B2 (ja) 2008-03-04 2009-02-23 シリコーン組成物、シリコーン接着剤、塗装基板及び積層基板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010549719A Expired - Fee Related JP5331825B2 (ja) 2008-03-04 2009-02-23 シリコーン組成物、シリコーン接着剤、塗装基板及び積層基板

Country Status (6)

Country Link
US (1) US20110027584A1 (enExample)
EP (2) EP2265674A1 (enExample)
JP (2) JP2011516626A (enExample)
KR (2) KR20100137423A (enExample)
CN (2) CN101925656A (enExample)
WO (2) WO2009111199A1 (enExample)

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TWI742160B (zh) * 2016-09-30 2021-10-11 美商道康寧公司 橋接聚矽氧樹脂、膜、電子裝置及相關方法
TWI747956B (zh) * 2016-09-30 2021-12-01 美商道康寧公司 橋接聚矽氧樹脂、膜、電子裝置及相關方法
CN110088207B (zh) * 2016-11-11 2022-10-14 陶氏东丽株式会社 可固化硅酮组合物和使用其的光学半导体装置
TW201829672A (zh) 2017-02-10 2018-08-16 美商道康寧公司 可固化組成物及經塗佈基材
KR20200120918A (ko) * 2018-02-19 2020-10-22 다우 도레이 캄파니 리미티드 실리콘 감압 접착제 조성물 및 적층체
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CN119875379A (zh) * 2025-03-28 2025-04-25 广东双利电缆有限公司 一种耐火硅橡胶及其制备方法和电缆

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