JP2011516626A5 - - Google Patents
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- Publication number
- JP2011516626A5 JP2011516626A5 JP2010549716A JP2010549716A JP2011516626A5 JP 2011516626 A5 JP2011516626 A5 JP 2011516626A5 JP 2010549716 A JP2010549716 A JP 2010549716A JP 2010549716 A JP2010549716 A JP 2010549716A JP 2011516626 A5 JP2011516626 A5 JP 2011516626A5
- Authority
- JP
- Japan
- Prior art keywords
- sio
- average
- silicon
- per molecule
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001296 polysiloxane Polymers 0.000 claims description 30
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 17
- 229910052739 hydrogen Inorganic materials 0.000 claims description 17
- 239000001257 hydrogen Substances 0.000 claims description 17
- -1 polysiloxane Polymers 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- 239000003431 cross linking reagent Substances 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 14
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 13
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 12
- 125000006657 (C1-C10) hydrocarbyl group Chemical group 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- 125000001183 hydrocarbyl group Chemical class 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 125000003342 alkenyl group Chemical group 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 6
- 150000002894 organic compounds Chemical class 0.000 claims description 6
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 4
- 239000013464 silicone adhesive Substances 0.000 claims 7
- 239000011248 coating agent Substances 0.000 claims 6
- 238000000576 coating method Methods 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 238000004132 cross linking Methods 0.000 claims 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 229920002050 silicone resin Polymers 0.000 claims 2
- 239000004971 Cross linker Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3344608P | 2008-03-04 | 2008-03-04 | |
| US61/033,446 | 2008-03-04 | ||
| PCT/US2009/034835 WO2009111196A1 (en) | 2008-03-04 | 2009-02-23 | Silicone composition, silicone adhesive, coated and laminated substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011516626A JP2011516626A (ja) | 2011-05-26 |
| JP2011516626A5 true JP2011516626A5 (enExample) | 2013-10-24 |
Family
ID=40875049
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010549719A Expired - Fee Related JP5331825B2 (ja) | 2008-03-04 | 2009-02-23 | シリコーン組成物、シリコーン接着剤、塗装基板及び積層基板 |
| JP2010549716A Pending JP2011516626A (ja) | 2008-03-04 | 2009-02-23 | シリコーン組成物、シリコーン接着剤、被覆基板及び積層基板 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010549719A Expired - Fee Related JP5331825B2 (ja) | 2008-03-04 | 2009-02-23 | シリコーン組成物、シリコーン接着剤、塗装基板及び積層基板 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20110027584A1 (enExample) |
| EP (2) | EP2250221A1 (enExample) |
| JP (2) | JP5331825B2 (enExample) |
| KR (2) | KR101502312B1 (enExample) |
| CN (2) | CN101925656A (enExample) |
| WO (2) | WO2009111196A1 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100273011A1 (en) * | 1996-12-20 | 2010-10-28 | Bianxiao Zhong | Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates |
| CN101925656A (zh) * | 2008-03-04 | 2010-12-22 | 陶氏康宁公司 | 硅氧烷组合物,硅氧烷粘合剂,涂布和层压的基底 |
| KR101169032B1 (ko) | 2010-01-19 | 2012-07-26 | (주)에버텍엔터프라이즈 | 페이스-다운 실장형 반도체에 적용 가능한 다이본딩용 실리콘 조성물 |
| BR112012029624B1 (pt) * | 2010-05-21 | 2021-01-05 | Soxsols, Llc | palmilha para inserção em calçado e método para fazer palmilhas |
| WO2012027337A1 (en) | 2010-08-23 | 2012-03-01 | Dow Corning Corporation | Phosphosiloxane resins, and curable silicone compositions, free-standing films, and laminates comprising the phosphosiloxane resins |
| EP2638106A1 (en) | 2010-11-09 | 2013-09-18 | Dow Corning Corporation | Hydrosilylation cured silicone resins plasticized by organophosphorous compounds |
| CN103328575A (zh) * | 2010-12-08 | 2013-09-25 | 道康宁公司 | 适合形成封装物的包含二氧化钛纳米粒子的硅氧烷组合物 |
| CN103370360A (zh) * | 2010-12-08 | 2013-10-23 | 道康宁公司 | 适合形成封装物的硅氧烷组合物 |
| CN103889712B (zh) * | 2011-10-18 | 2015-07-08 | 旭硝子株式会社 | 层叠体、层叠体的制造方法及带有电子器件用构件的玻璃基板的制造方法 |
| US20140322519A1 (en) * | 2011-11-08 | 2014-10-30 | Dow Corning Corporation | Organopolysiloxane compositions and surface modification of cured silicone elastomers |
| CN103666367B (zh) * | 2012-09-19 | 2015-06-17 | 广东恒大新材料科技有限公司 | 一种led有机硅灌封胶及其应用 |
| CN105339456B (zh) * | 2013-07-03 | 2018-08-07 | 汉高知识产权控股有限责任公司 | 高温可脱粘粘合剂 |
| GB2520535A (en) * | 2013-11-25 | 2015-05-27 | Essex Safety Glass Ltd | Laminated glazings |
| JP6443350B2 (ja) * | 2014-02-07 | 2018-12-26 | Agc株式会社 | ガラス積層体 |
| CN103821008B (zh) * | 2014-03-12 | 2016-09-07 | 李江群 | 三层结构的有机硅合成革及其制备方法 |
| JP6479862B2 (ja) * | 2014-06-24 | 2019-03-06 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA | 一成分型のuvおよび熱硬化高温剥離可能な接着剤 |
| JP6613682B2 (ja) * | 2015-07-28 | 2019-12-04 | セイコーエプソン株式会社 | 電子デバイス、液体吐出ヘッド。 |
| FR3056444A1 (fr) | 2016-09-27 | 2018-03-30 | Compagnie Generale Des Etablissements Michelin | Roue elastique non pneumatique incorporant un stratifie a base de caoutchouc silicone et de composite fibre-resine |
| FR3056442A1 (fr) * | 2016-09-27 | 2018-03-30 | Compagnie Generale Des Etablissements Michelin | Produit stratifie a base de caoutchouc silicone et de composite fibre-resine |
| TWI742160B (zh) * | 2016-09-30 | 2021-10-11 | 美商道康寧公司 | 橋接聚矽氧樹脂、膜、電子裝置及相關方法 |
| TWI747956B (zh) | 2016-09-30 | 2021-12-01 | 美商道康寧公司 | 橋接聚矽氧樹脂、膜、電子裝置及相關方法 |
| CN110088207B (zh) * | 2016-11-11 | 2022-10-14 | 陶氏东丽株式会社 | 可固化硅酮组合物和使用其的光学半导体装置 |
| TW201829672A (zh) * | 2017-02-10 | 2018-08-16 | 美商道康寧公司 | 可固化組成物及經塗佈基材 |
| US20210095171A1 (en) * | 2018-02-19 | 2021-04-01 | Dow Toray Co., Ltd. | Silicone pressure-sensitive adhesive composition and laminate |
| KR102471220B1 (ko) * | 2018-08-17 | 2022-11-25 | 와커 헤미 아게 | 가교성 오르가노실록산 조성물 |
| TWI844552B (zh) * | 2018-09-10 | 2024-06-11 | 美商陶氏有機矽公司 | 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成 |
| CN119875379A (zh) * | 2025-03-28 | 2025-04-25 | 广东双利电缆有限公司 | 一种耐火硅橡胶及其制备方法和电缆 |
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| US7553915B2 (en) * | 2005-12-06 | 2009-06-30 | Shin-Etsu Chemical Co., Ltd. | Silicone composition and cured product |
| CN101925656A (zh) * | 2008-03-04 | 2010-12-22 | 陶氏康宁公司 | 硅氧烷组合物,硅氧烷粘合剂,涂布和层压的基底 |
-
2009
- 2009-02-23 CN CN2009801030054A patent/CN101925656A/zh active Pending
- 2009-02-23 JP JP2010549719A patent/JP5331825B2/ja not_active Expired - Fee Related
- 2009-02-23 CN CN2009801076236A patent/CN101959961B/zh not_active Expired - Fee Related
- 2009-02-23 KR KR1020107019784A patent/KR101502312B1/ko not_active Expired - Fee Related
- 2009-02-23 US US12/918,353 patent/US20110027584A1/en not_active Abandoned
- 2009-02-23 WO PCT/US2009/034835 patent/WO2009111196A1/en not_active Ceased
- 2009-02-23 WO PCT/US2009/034841 patent/WO2009111199A1/en not_active Ceased
- 2009-02-23 EP EP20090718476 patent/EP2250221A1/en not_active Withdrawn
- 2009-02-23 EP EP20090718020 patent/EP2265674A1/en not_active Withdrawn
- 2009-02-23 KR KR1020107018286A patent/KR20100137423A/ko not_active Ceased
- 2009-02-23 JP JP2010549716A patent/JP2011516626A/ja active Pending
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