KR20100137423A - 실리콘 조성물, 실리콘 접착제, 피복 및 적층된 기판 - Google Patents
실리콘 조성물, 실리콘 접착제, 피복 및 적층된 기판 Download PDFInfo
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- KR20100137423A KR20100137423A KR1020107018286A KR20107018286A KR20100137423A KR 20100137423 A KR20100137423 A KR 20100137423A KR 1020107018286 A KR1020107018286 A KR 1020107018286A KR 20107018286 A KR20107018286 A KR 20107018286A KR 20100137423 A KR20100137423 A KR 20100137423A
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- Prior art keywords
- sio
- silicone
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- resin
- silicon
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- 239000000758 substrate Substances 0.000 title claims abstract description 113
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 86
- 239000000203 mixture Substances 0.000 title claims abstract description 78
- 239000013464 silicone adhesive Substances 0.000 title claims abstract description 56
- 238000000576 coating method Methods 0.000 title claims description 4
- 239000004447 silicone coating Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 claims abstract description 77
- 239000011347 resin Substances 0.000 claims abstract description 77
- 239000003054 catalyst Substances 0.000 claims abstract description 25
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 20
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 18
- 238000006459 hydrosilylation reaction Methods 0.000 claims abstract description 17
- 239000004971 Cross linker Substances 0.000 claims abstract description 15
- 239000011247 coating layer Substances 0.000 claims description 54
- 239000000853 adhesive Substances 0.000 claims description 37
- 230000001070 adhesive effect Effects 0.000 claims description 37
- -1 polysiloxane Polymers 0.000 claims description 31
- 239000011521 glass Substances 0.000 claims description 22
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 22
- 150000002894 organic compounds Chemical class 0.000 claims description 19
- 229920002050 silicone resin Polymers 0.000 claims description 17
- 125000001931 aliphatic group Chemical group 0.000 claims description 13
- 125000003342 alkenyl group Chemical group 0.000 claims description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 239000001257 hydrogen Substances 0.000 claims description 11
- 239000010703 silicon Substances 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 10
- 239000003431 cross linking reagent Substances 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 22
- 239000000047 product Substances 0.000 description 14
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- 239000002184 metal Substances 0.000 description 13
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
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- 125000004432 carbon atom Chemical group C* 0.000 description 5
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- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
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Images
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Cited By (1)
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| KR20170023010A (ko) * | 2014-06-24 | 2017-03-02 | 헨켈 아게 운트 코. 카게아아 | 1k uv 및 열 경화성 고온 탈결합가능한 접착제 |
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| US20100273011A1 (en) * | 1996-12-20 | 2010-10-28 | Bianxiao Zhong | Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates |
| WO2009111199A1 (en) * | 2008-03-04 | 2009-09-11 | Dow Corning Corporation | Silicone composition, silicone adhesive, coated and laminated substrates |
| KR101169032B1 (ko) | 2010-01-19 | 2012-07-26 | (주)에버텍엔터프라이즈 | 페이스-다운 실장형 반도체에 적용 가능한 다이본딩용 실리콘 조성물 |
| ES2726774T3 (es) * | 2010-05-21 | 2019-10-09 | Soxsols Llc | Plantilla para calzado |
| KR20130097732A (ko) | 2010-08-23 | 2013-09-03 | 다우 코닝 코포레이션 | 포스포실록산 수지와, 포스포실록산 수지를 포함하는 경화성 실리콘 조성물, 자립 필름 및 라미네이트 |
| US9012547B2 (en) | 2010-11-09 | 2015-04-21 | Dow Corning Corporation | Hydrosilylation cured silicone resins plasticized by organophosphorous compounds |
| KR20130140815A (ko) * | 2010-12-08 | 2013-12-24 | 다우 코닝 코포레이션 | 봉지재의 형성에 적합한 실록산 조성물 |
| US20140008697A1 (en) * | 2010-12-08 | 2014-01-09 | Brian R. Harkness | Siloxane Compositions Including Titanium Dioxide Nanoparticles Suitable For Forming Encapsulants |
| JP5924344B2 (ja) * | 2011-10-18 | 2016-05-25 | 旭硝子株式会社 | 積層体、積層体の製造方法、および、電子デバイス用部材付きガラス基板の製造方法 |
| WO2013070897A1 (en) * | 2011-11-08 | 2013-05-16 | Dongchan Ahn | Organopolysiloxane compositions and surface modification of cured silicone elastomers |
| CN103666367B (zh) * | 2012-09-19 | 2015-06-17 | 广东恒大新材料科技有限公司 | 一种led有机硅灌封胶及其应用 |
| EP3017012B1 (en) * | 2013-07-03 | 2018-03-21 | Henkel IP & Holding GmbH | High temperature debondable adhesive |
| GB2520535A (en) * | 2013-11-25 | 2015-05-27 | Essex Safety Glass Ltd | Laminated glazings |
| KR20160119080A (ko) * | 2014-02-07 | 2016-10-12 | 아사히 가라스 가부시키가이샤 | 유리 적층체 |
| CN103821008B (zh) * | 2014-03-12 | 2016-09-07 | 李江群 | 三层结构的有机硅合成革及其制备方法 |
| JP6613682B2 (ja) * | 2015-07-28 | 2019-12-04 | セイコーエプソン株式会社 | 電子デバイス、液体吐出ヘッド。 |
| FR3056444A1 (fr) | 2016-09-27 | 2018-03-30 | Compagnie Generale Des Etablissements Michelin | Roue elastique non pneumatique incorporant un stratifie a base de caoutchouc silicone et de composite fibre-resine |
| FR3056442A1 (fr) * | 2016-09-27 | 2018-03-30 | Compagnie Generale Des Etablissements Michelin | Produit stratifie a base de caoutchouc silicone et de composite fibre-resine |
| TWI742160B (zh) | 2016-09-30 | 2021-10-11 | 美商道康寧公司 | 橋接聚矽氧樹脂、膜、電子裝置及相關方法 |
| TWI747956B (zh) * | 2016-09-30 | 2021-12-01 | 美商道康寧公司 | 橋接聚矽氧樹脂、膜、電子裝置及相關方法 |
| JPWO2018088316A1 (ja) * | 2016-11-11 | 2019-10-03 | ダウ・東レ株式会社 | 硬化性シリコーン組成物およびそれを用いた光半導体装置 |
| TW201829672A (zh) * | 2017-02-10 | 2018-08-16 | 美商道康寧公司 | 可固化組成物及經塗佈基材 |
| EP3757186A4 (en) * | 2018-02-19 | 2021-11-24 | Dow Toray Co., Ltd. | PRESSURE SENSITIVE SILICONE ADHESIVE COMPOSITION AND LAYER PRODUCT |
| US12110393B2 (en) * | 2018-08-17 | 2024-10-08 | Wacker Chemie Ag | Crosslinkable organopolysiloxane compositions |
| TWI844552B (zh) * | 2018-09-10 | 2024-06-11 | 美商陶氏有機矽公司 | 用於生產光學聚矽氧總成之方法、及藉其生產之光學聚矽氧總成 |
| CN119875379A (zh) * | 2025-03-28 | 2025-04-25 | 广东双利电缆有限公司 | 一种耐火硅橡胶及其制备方法和电缆 |
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2009
- 2009-02-23 WO PCT/US2009/034841 patent/WO2009111199A1/en not_active Ceased
- 2009-02-23 EP EP20090718476 patent/EP2250221A1/en not_active Withdrawn
- 2009-02-23 JP JP2010549719A patent/JP5331825B2/ja not_active Expired - Fee Related
- 2009-02-23 CN CN2009801030054A patent/CN101925656A/zh active Pending
- 2009-02-23 WO PCT/US2009/034835 patent/WO2009111196A1/en not_active Ceased
- 2009-02-23 JP JP2010549716A patent/JP2011516626A/ja active Pending
- 2009-02-23 EP EP20090718020 patent/EP2265674A1/en not_active Withdrawn
- 2009-02-23 CN CN2009801076236A patent/CN101959961B/zh not_active Expired - Fee Related
- 2009-02-23 KR KR1020107019784A patent/KR101502312B1/ko not_active Expired - Fee Related
- 2009-02-23 KR KR1020107018286A patent/KR20100137423A/ko not_active Ceased
- 2009-02-23 US US12/918,353 patent/US20110027584A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20170023010A (ko) * | 2014-06-24 | 2017-03-02 | 헨켈 아게 운트 코. 카게아아 | 1k uv 및 열 경화성 고온 탈결합가능한 접착제 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5331825B2 (ja) | 2013-10-30 |
| US20110027584A1 (en) | 2011-02-03 |
| KR101502312B1 (ko) | 2015-03-18 |
| CN101959961A (zh) | 2011-01-26 |
| KR20100123855A (ko) | 2010-11-25 |
| CN101925656A (zh) | 2010-12-22 |
| WO2009111199A1 (en) | 2009-09-11 |
| WO2009111196A1 (en) | 2009-09-11 |
| CN101959961B (zh) | 2013-10-30 |
| EP2265674A1 (en) | 2010-12-29 |
| JP2011516626A (ja) | 2011-05-26 |
| JP2011517707A (ja) | 2011-06-16 |
| EP2250221A1 (en) | 2010-11-17 |
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