JP2011212748A5 - - Google Patents
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- Publication number
- JP2011212748A5 JP2011212748A5 JP2011123827A JP2011123827A JP2011212748A5 JP 2011212748 A5 JP2011212748 A5 JP 2011212748A5 JP 2011123827 A JP2011123827 A JP 2011123827A JP 2011123827 A JP2011123827 A JP 2011123827A JP 2011212748 A5 JP2011212748 A5 JP 2011212748A5
- Authority
- JP
- Japan
- Prior art keywords
- water
- flux
- circuit board
- printed circuit
- aqueous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 claims 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 21
- 238000000034 method Methods 0.000 claims 16
- 229920005989 resin Polymers 0.000 claims 15
- 239000011347 resin Substances 0.000 claims 15
- 238000005476 soldering Methods 0.000 claims 12
- 239000011248 coating agent Substances 0.000 claims 9
- 238000000576 coating method Methods 0.000 claims 9
- 239000006185 dispersion Substances 0.000 claims 8
- 239000007787 solid Substances 0.000 claims 8
- 239000004094 surface-active agent Substances 0.000 claims 8
- 239000012190 activator Substances 0.000 claims 7
- 230000002378 acidificating effect Effects 0.000 claims 6
- HBKBEZURJSNABK-MWJPAGEPSA-N 2,3-dihydroxypropyl (1r,4ar,4br,10ar)-1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylate Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(=O)OCC(O)CO HBKBEZURJSNABK-MWJPAGEPSA-N 0.000 claims 4
- 125000000129 anionic group Chemical group 0.000 claims 4
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 claims 4
- 229920003002 synthetic resin Polymers 0.000 claims 4
- 239000000057 synthetic resin Substances 0.000 claims 4
- 229920005992 thermoplastic resin Polymers 0.000 claims 4
- 239000003945 anionic surfactant Substances 0.000 claims 3
- 150000004820 halides Chemical class 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 150000007524 organic acids Chemical class 0.000 claims 3
- 238000009736 wetting Methods 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- -1 pentaerythritol ester Chemical class 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16868999P | 1999-12-03 | 1999-12-03 | |
| US60/168,689 | 1999-12-03 | ||
| US17920200P | 2000-01-31 | 2000-01-31 | |
| US60/179,202 | 2000-01-31 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001541644A Division JP5071952B2 (ja) | 1999-12-03 | 2000-12-01 | ハンダ付け用フラックス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011212748A JP2011212748A (ja) | 2011-10-27 |
| JP2011212748A5 true JP2011212748A5 (enExample) | 2012-07-26 |
Family
ID=26864359
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001541644A Expired - Fee Related JP5071952B2 (ja) | 1999-12-03 | 2000-12-01 | ハンダ付け用フラックス |
| JP2011123827A Pending JP2011212748A (ja) | 1999-12-03 | 2011-06-01 | ハンダ付け用フラックス |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001541644A Expired - Fee Related JP5071952B2 (ja) | 1999-12-03 | 2000-12-01 | ハンダ付け用フラックス |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US6599372B2 (enExample) |
| EP (1) | EP1237677B1 (enExample) |
| JP (2) | JP5071952B2 (enExample) |
| KR (1) | KR100715957B1 (enExample) |
| AT (1) | ATE302666T1 (enExample) |
| AU (1) | AU1811601A (enExample) |
| BR (2) | BRPI0017633B1 (enExample) |
| CA (1) | CA2393399C (enExample) |
| DE (1) | DE60022223T2 (enExample) |
| MX (1) | MXPA02005498A (enExample) |
| WO (1) | WO2001039922A1 (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE302666T1 (de) * | 1999-12-03 | 2005-09-15 | Frys Metals Inc Dba Alpha Metals Inc | Weichlotflussmittel |
| TWI228132B (en) * | 2001-09-26 | 2005-02-21 | Nof Corp | Soldering flux composition and solder paste |
| KR100460957B1 (ko) * | 2002-08-26 | 2004-12-09 | 삼성전자주식회사 | 무연 합금 솔더의 솔더링 플럭스 |
| US7740713B2 (en) * | 2004-04-28 | 2010-06-22 | International Business Machines Corporation | Flux composition and techniques for use thereof |
| EP1808426A1 (en) * | 2006-01-16 | 2007-07-18 | DSMIP Assets B.V. | Process for the preparation of alkynediols |
| US20070284412A1 (en) * | 2006-05-31 | 2007-12-13 | Prakash Anna M | Solder flux composition |
| US7780801B2 (en) | 2006-07-26 | 2010-08-24 | International Business Machines Corporation | Flux composition and process for use thereof |
| KR101163427B1 (ko) * | 2006-12-12 | 2012-07-13 | 센주긴조쿠고교 가부시키가이샤 | 납프리 땜납용 플럭스와 납땜 방법 |
| US20080156852A1 (en) * | 2006-12-29 | 2008-07-03 | Prakash Anna M | Solder flux composition and process of using same |
| KR20100132480A (ko) * | 2007-07-23 | 2010-12-17 | 헨켈 리미티드 | 땜납 플럭스 |
| US7956114B2 (en) | 2009-03-09 | 2011-06-07 | Raytheon Company | Water immiscible rosin mildly activated flux |
| CN101890595B (zh) * | 2010-07-02 | 2012-07-04 | 厦门大学 | 一种用于无铅药芯焊丝的低松香免清洗助焊剂及其制备方法 |
| KR101671525B1 (ko) * | 2010-07-21 | 2016-11-17 | 동우 화인켐 주식회사 | 땜납용 플럭스 조성물 |
| CN102581521A (zh) * | 2012-02-03 | 2012-07-18 | 深圳市兴时达科技产品有限公司 | 无卤无铅免洗助焊剂及其制备方法 |
| JP6098371B2 (ja) * | 2012-06-05 | 2017-03-22 | Jsr株式会社 | 回路の製造方法 |
| US9277638B2 (en) | 2013-03-14 | 2016-03-01 | Raytheon Company | Gum rosin protective coating and methods of use |
| US8887981B2 (en) | 2013-03-15 | 2014-11-18 | Raytheon Company | Temporary adhesive for component bonding |
| JP2015127060A (ja) * | 2013-12-27 | 2015-07-09 | 株式会社日本スペリア社 | はんだ用フラックス及びはんだ組成物 |
| CN104148825B (zh) * | 2014-08-12 | 2016-02-17 | 工业和信息化部电子第五研究所华东分所 | 一种无铅绿色助焊膏 |
| CN104942480B (zh) * | 2015-06-29 | 2016-08-24 | 东莞市千岛金属锡品有限公司 | 一种用于不锈钢软钎焊的固态助焊剂 |
| JP6840108B2 (ja) * | 2018-06-14 | 2021-03-10 | 千住金属工業株式会社 | フラックス、ソルダーペースト、基板、電子機器及び基板製造方法 |
| US10939600B2 (en) | 2018-11-28 | 2021-03-02 | International Business Machines Corporation | Flux residue detection |
| CN111531292A (zh) * | 2020-05-15 | 2020-08-14 | 湖北省哈福生物化学有限公司 | 一种喷锡助焊剂及其制备方法 |
| CN113249034B (zh) * | 2021-05-10 | 2022-07-01 | 广东风华高新科技股份有限公司 | 一种覆膜剂及其应用 |
| US20230321769A1 (en) * | 2022-04-11 | 2023-10-12 | Honeywell International Inc. | Micronized flux for jet valve dispenser |
| KR20240172808A (ko) | 2023-06-02 | 2024-12-10 | 인펠 주식회사 | 납땜용 플럭스를 대체하기 위한 친환경 액상 유기 조성물 |
Family Cites Families (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3674896A (en) * | 1966-07-28 | 1972-07-04 | Union Carbide Corp | Bonding with ammonium polymer salts |
| US3963529A (en) * | 1970-12-07 | 1976-06-15 | Matsushita Electric Industrial Co., Ltd. | Soldering flux |
| US3895973A (en) * | 1973-12-17 | 1975-07-22 | Chevron Res | Activated soldering flux |
| US4009816A (en) | 1975-09-02 | 1977-03-01 | Alpha Metals, Inc. | Method and apparatus for increasing efficiency of a foam fluxer used in wave soldering of printed wiring boards |
| GB1550648A (en) | 1976-06-11 | 1979-08-15 | Multicore Solders Ltd | Soft soldering |
| US4143005A (en) | 1977-09-19 | 1979-03-06 | Rca Corporation | Extrudable, non-flowing and non-aqueous solvent soluble hold down compound for printed wiring board assembly |
| GB1594804A (en) | 1978-05-23 | 1981-08-05 | Multicore Solders Ltd | Soft soldering |
| GB2071550B (en) * | 1980-03-17 | 1984-02-29 | Multicore Solders Ltd | Soft solder material for use in the formation of a solder bath |
| DE3110319A1 (de) | 1980-03-17 | 1982-01-07 | Multicore Solders Ltd., Hemel Hempstead, Hertfordshire | Weichlotmaterial und verwendung desselben fuer loetbaeder |
| JPS5772771A (en) * | 1980-10-22 | 1982-05-07 | Toppan Printing Co Ltd | Method for coating flux on wiring substrate for soldering |
| US4380518A (en) | 1982-01-04 | 1983-04-19 | Western Electric Company, Inc. | Method of producing solder spheres |
| US4472537A (en) | 1982-09-17 | 1984-09-18 | Corning Glass Works | Thermoplastic inks for decorating purposes |
| US4895606A (en) * | 1989-02-23 | 1990-01-23 | Ashraf Jafri | Formulations for soldering flux |
| US5004509A (en) | 1990-05-04 | 1991-04-02 | Delco Electronics Corporation | Low residue soldering flux |
| US4994119A (en) | 1990-05-09 | 1991-02-19 | International Business Machines Corporation | Water soluble soldering flux |
| CA2053759A1 (en) * | 1990-10-31 | 1992-05-01 | Raymond L. Turner | Water-soluble flux for cored solder |
| JPH04220192A (ja) * | 1990-12-14 | 1992-08-11 | Senju Metal Ind Co Ltd | 低残渣はんだペースト |
| US5127571A (en) * | 1991-10-31 | 1992-07-07 | International Business Machines Corporation | Water soluble soldering preflux and method of application |
| US5211764A (en) | 1992-11-10 | 1993-05-18 | At&T Bell Laboratories | Solder paste and method of using the same |
| US5297721A (en) | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
| IL109623A0 (en) | 1993-05-17 | 1994-08-26 | Rohm & Haas | Thickening composition for aqueous systems |
| US5568894A (en) | 1993-06-04 | 1996-10-29 | Electrovert Ltd. | Applying flux to a solder wave for wave soldering an element |
| US5507882A (en) | 1994-02-28 | 1996-04-16 | Delco Electronics Corporation | Low residue water-based soldering flux and process for soldering with same |
| JPH07251290A (ja) * | 1994-03-16 | 1995-10-03 | Fujitsu Ltd | インジウムはんだペースト |
| US5571340A (en) | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
| US5538175A (en) | 1994-11-21 | 1996-07-23 | At&T Corp. | Adjustment of a solder wave process in real-time |
| JP3787857B2 (ja) | 1995-03-10 | 2006-06-21 | タムラ化研株式会社 | 回路基板はんだ付け用フラックス及び回路基板 |
| US5844309A (en) | 1995-03-20 | 1998-12-01 | Fujitsu Limited | Adhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the composition |
| US5560537A (en) | 1995-04-11 | 1996-10-01 | Vlt Corporation | Automatic soldering |
| US5869209A (en) | 1995-11-01 | 1999-02-09 | Advanced Technology Research Corporation | Hologram recording apparatus and method |
| JPH09192882A (ja) * | 1996-01-12 | 1997-07-29 | Uchihashi Estec Co Ltd | はんだ付け用液状フラックス |
| JPH09192883A (ja) * | 1996-01-17 | 1997-07-29 | Asahi Chem Res Lab Ltd | フラックス組成物 |
| US5688356A (en) | 1996-11-06 | 1997-11-18 | Olin Corporation | Water-based urethane adhesive |
| US6085960A (en) | 1997-03-04 | 2000-07-11 | Samsung Electronics Co., Ltd. | Apparatus for measuring the height of a solder wave |
| US6119915A (en) | 1997-05-07 | 2000-09-19 | Mcms, Inc. | Alignment fixture for solder-wave machines |
| JP3758821B2 (ja) * | 1997-06-18 | 2006-03-22 | 株式会社アサヒ化学研究所 | 水系フラックス組成物 |
| US6159304A (en) * | 1997-07-03 | 2000-12-12 | Matsushita Electric Industrial Co., Ltd. | Solder paste |
| JP3797763B2 (ja) * | 1997-09-08 | 2006-07-19 | 富士通テン株式会社 | フラックス組成物 |
| JP3311282B2 (ja) * | 1997-10-13 | 2002-08-05 | 株式会社東芝 | 金属部材の接合方法及び接合体 |
| ATE302666T1 (de) * | 1999-12-03 | 2005-09-15 | Frys Metals Inc Dba Alpha Metals Inc | Weichlotflussmittel |
-
2000
- 2000-12-01 AT AT00980918T patent/ATE302666T1/de not_active IP Right Cessation
- 2000-12-01 WO PCT/US2000/032720 patent/WO2001039922A1/en not_active Ceased
- 2000-12-01 DE DE60022223T patent/DE60022223T2/de not_active Expired - Lifetime
- 2000-12-01 CA CA2393399A patent/CA2393399C/en not_active Expired - Fee Related
- 2000-12-01 AU AU18116/01A patent/AU1811601A/en not_active Abandoned
- 2000-12-01 US US09/728,264 patent/US6599372B2/en not_active Expired - Lifetime
- 2000-12-01 EP EP00980918A patent/EP1237677B1/en not_active Expired - Lifetime
- 2000-12-01 MX MXPA02005498A patent/MXPA02005498A/es active IP Right Grant
- 2000-12-01 BR BRPI0017633A patent/BRPI0017633B1/pt not_active IP Right Cessation
- 2000-12-01 JP JP2001541644A patent/JP5071952B2/ja not_active Expired - Fee Related
- 2000-12-01 BR BRPI0016118-7A patent/BR0016118B1/pt not_active IP Right Cessation
- 2000-12-01 KR KR1020027007126A patent/KR100715957B1/ko not_active Expired - Fee Related
-
2011
- 2011-06-01 JP JP2011123827A patent/JP2011212748A/ja active Pending
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