JP2011252171A5 - - Google Patents
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- Publication number
- JP2011252171A5 JP2011252171A5 JP2011193376A JP2011193376A JP2011252171A5 JP 2011252171 A5 JP2011252171 A5 JP 2011252171A5 JP 2011193376 A JP2011193376 A JP 2011193376A JP 2011193376 A JP2011193376 A JP 2011193376A JP 2011252171 A5 JP2011252171 A5 JP 2011252171A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- mono
- solvent
- flux
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 claims 16
- 239000002904 solvent Substances 0.000 claims 13
- -1 tribromoadipic acid Chemical compound 0.000 claims 13
- 238000005219 brazing Methods 0.000 claims 12
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims 9
- 239000000203 mixture Substances 0.000 claims 9
- 239000003093 cationic surfactant Substances 0.000 claims 7
- 239000002736 nonionic surfactant Substances 0.000 claims 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 6
- 239000012190 activator Substances 0.000 claims 6
- 239000013543 active substance Substances 0.000 claims 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims 5
- 239000004094 surface-active agent Substances 0.000 claims 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims 5
- 235000019441 ethanol Nutrition 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims 3
- CYLVUSZHVURAOY-UHFFFAOYSA-N 2,2-dibromoethenylbenzene Chemical compound BrC(Br)=CC1=CC=CC=C1 CYLVUSZHVURAOY-UHFFFAOYSA-N 0.000 claims 3
- TZVFEYCDTGTUDG-UHFFFAOYSA-N 2,2-dibromopropanedioic acid Chemical compound OC(=O)C(Br)(Br)C(O)=O TZVFEYCDTGTUDG-UHFFFAOYSA-N 0.000 claims 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims 3
- DARJZZLTHVJRDJ-UHFFFAOYSA-N BrC(C(C(=O)O)(Br)Br)C(=O)O Chemical compound BrC(C(C(=O)O)(Br)Br)C(=O)O DARJZZLTHVJRDJ-UHFFFAOYSA-N 0.000 claims 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 3
- 239000001361 adipic acid Substances 0.000 claims 3
- 235000011037 adipic acid Nutrition 0.000 claims 3
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims 3
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical group O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims 3
- 150000002148 esters Chemical class 0.000 claims 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims 3
- 235000006408 oxalic acid Nutrition 0.000 claims 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 150000001298 alcohols Chemical class 0.000 claims 1
- 239000002518 antifoaming agent Substances 0.000 claims 1
- 230000003115 biocidal effect Effects 0.000 claims 1
- 239000003139 biocide Substances 0.000 claims 1
- 238000009835 boiling Methods 0.000 claims 1
- 125000002091 cationic group Chemical group 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 238000005260 corrosion Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical group OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 1
- 239000004210 ether based solvent Substances 0.000 claims 1
- 239000004088 foaming agent Substances 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 239000000025 natural resin Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000003381 stabilizer Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19708200P | 2000-04-13 | 2000-04-13 | |
| US60/197,082 | 2000-04-13 | ||
| US09/834,196 US6524398B2 (en) | 2000-04-13 | 2001-04-12 | Low-residue, low-solder-ball flux |
| US09/834,196 | 2001-04-12 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001583977A Division JP4854164B2 (ja) | 2000-04-13 | 2001-04-13 | カチオン性界面活性剤を含むろう接用フラックス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011252171A JP2011252171A (ja) | 2011-12-15 |
| JP2011252171A5 true JP2011252171A5 (enExample) | 2013-01-17 |
Family
ID=26892528
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001583977A Expired - Fee Related JP4854164B2 (ja) | 2000-04-13 | 2001-04-13 | カチオン性界面活性剤を含むろう接用フラックス |
| JP2011193376A Pending JP2011252171A (ja) | 2000-04-13 | 2011-09-05 | カチオン性界面活性剤を含むろう接用フラックス |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001583977A Expired - Fee Related JP4854164B2 (ja) | 2000-04-13 | 2001-04-13 | カチオン性界面活性剤を含むろう接用フラックス |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6524398B2 (enExample) |
| JP (2) | JP4854164B2 (enExample) |
| KR (1) | KR100786593B1 (enExample) |
| CN (1) | CN1235719C (enExample) |
| AU (1) | AU2001251756A1 (enExample) |
| BR (1) | BR0110075A (enExample) |
| CA (1) | CA2405957C (enExample) |
| MX (1) | MXPA02010148A (enExample) |
| WO (1) | WO2001087535A2 (enExample) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020061556A (ko) * | 2002-05-29 | 2002-07-24 | (주)케이트론 | 수평 핫에어 레블러법에 의한 납땜시 사용되는 수용성플럭스 및 오일의 제조방법 |
| US7108755B2 (en) * | 2002-07-30 | 2006-09-19 | Motorola, Inc. | Simplification of ball attach method using super-saturated fine crystal flux |
| CN1307024C (zh) * | 2004-05-09 | 2007-03-28 | 邓和升 | 高黏附力无铅焊锡膏 |
| US7052558B1 (en) * | 2005-04-08 | 2006-05-30 | Chemicals And Metals Technologies, Inc. | Solder paste flux composition |
| US7767032B2 (en) * | 2006-06-30 | 2010-08-03 | W.C. Heraeus Holding GmbH | No-clean low-residue solder paste for semiconductor device applications |
| US20080156852A1 (en) * | 2006-12-29 | 2008-07-03 | Prakash Anna M | Solder flux composition and process of using same |
| US9566668B2 (en) * | 2007-01-04 | 2017-02-14 | Alpha Metals, Inc. | Flux formulations |
| US7794531B2 (en) * | 2007-01-08 | 2010-09-14 | Enthone Inc. | Organic solderability preservative comprising high boiling temperature alcohol |
| US9596980B2 (en) * | 2007-04-25 | 2017-03-21 | Karl Storz Endovision, Inc. | Endoscope system with pivotable arms |
| US8591399B2 (en) * | 2007-04-25 | 2013-11-26 | Karl Storz Endovision, Inc. | Surgical method utilizing transluminal endoscope and instruments |
| CN100528462C (zh) * | 2007-07-17 | 2009-08-19 | 西安理工大学 | 用于SnAgCu系无铅焊膏的低松香免清洗助焊剂及其制备方法 |
| DE112010004602B4 (de) * | 2009-10-22 | 2020-01-30 | Mitsubishi Gas Chemical Co., Inc. | Verfahren zur Herstellung einer feinen Struktur unter Einsatz einer Verarbeitungsflüssigkeit zur Verhinderung eines Musterzusammenbruchs |
| TWI500467B (zh) * | 2010-01-08 | 2015-09-21 | Arakawa Chem Ind | 無鉛焊劑用助熔劑組成物及無鉛焊劑膏 |
| CN102059477B (zh) * | 2010-11-29 | 2012-10-03 | 广州有色金属研究院 | 一种适用于无银无铅焊料的无卤素助焊剂 |
| US9815149B2 (en) | 2011-02-25 | 2017-11-14 | International Business Machines Corporation | Flux composition and techniques for use thereof |
| US9579738B2 (en) | 2011-02-25 | 2017-02-28 | International Business Machines Corporation | Flux composition and techniques for use thereof |
| US8434666B2 (en) * | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
| CN102357746A (zh) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | 一种无铅焊锡丝用低含量改性松香型无卤助焊剂 |
| CN102581522A (zh) * | 2012-02-28 | 2012-07-18 | 河南科技大学 | 一种ZnSn系无铅钎料用松香基助焊剂及制备方法 |
| JP5531188B2 (ja) * | 2012-03-12 | 2014-06-25 | 株式会社弘輝 | フラックス、はんだ組成物および電子回路実装基板の製造方法 |
| CN103358053A (zh) * | 2013-06-22 | 2013-10-23 | 宁波市鄞州品达电器焊料有限公司 | 环保无卤无烟助焊剂的制备方法 |
| CN103350291A (zh) * | 2013-06-27 | 2013-10-16 | 东莞市和阳电子科技有限公司 | 一种助焊剂 |
| JP6253371B2 (ja) * | 2013-11-28 | 2017-12-27 | 株式会社日本スペリア社 | はんだ付け用フラックス |
| EP2886244A1 (de) * | 2013-12-17 | 2015-06-24 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur Befestigung eines Bauteils auf einem Substrat |
| CN103817461A (zh) * | 2014-03-17 | 2014-05-28 | 苏州龙腾万里化工科技有限公司 | 一种树脂芯助焊剂 |
| CN103862199A (zh) * | 2014-03-24 | 2014-06-18 | 吉安谊盛电子材料有限公司 | 一种光伏焊带专用助焊剂 |
| CN103862198B (zh) * | 2014-03-24 | 2016-08-17 | 吉安谊盛电子材料有限公司 | 一种太阳能自动焊接专用助焊剂 |
| CN103862200A (zh) * | 2014-03-24 | 2014-06-18 | 吉安谊盛电子材料有限公司 | 一种太阳能组件焊接专用助焊剂 |
| CN104985354A (zh) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | 无铅焊料助焊剂及其制备方法 |
| JP6383768B2 (ja) * | 2015-09-30 | 2018-08-29 | 株式会社タムラ製作所 | はんだ組成物および電子基板の製造方法 |
| WO2017141404A1 (ja) | 2016-02-18 | 2017-08-24 | 千住金属工業株式会社 | フラックス |
| JP6274344B1 (ja) | 2017-05-25 | 2018-02-07 | 千住金属工業株式会社 | フラックス |
| CN108356445A (zh) * | 2018-01-30 | 2018-08-03 | 深圳市合明科技有限公司 | 环保助焊剂及其制备方法和应用 |
| JP6861688B2 (ja) * | 2018-11-19 | 2021-04-21 | 株式会社タムラ製作所 | 無残渣フラックス組成物及びソルダペースト |
| CN110076479B (zh) * | 2019-03-25 | 2021-04-27 | 武汉谊盛新材料科技有限公司 | 铅酸蓄电池极群铸焊中性助焊剂及其制备方法 |
| JP7759026B2 (ja) * | 2020-03-31 | 2025-10-23 | 日産化学株式会社 | 仮接着剤残留物洗浄剤組成物及び加工された半導体基板の製造方法 |
| JP6892620B1 (ja) * | 2020-09-01 | 2021-06-23 | 千住金属工業株式会社 | フラックスおよびソルダペースト |
| CN114535864A (zh) * | 2020-11-25 | 2022-05-27 | 海太半导体（无锡）有限公司 | 一种延长助焊剂活性的催化剂 |
| CN113582862B (zh) * | 2021-08-31 | 2023-11-10 | 广州安赛化工有限公司 | 一种用于制备多功能冷却水杀生剂的松香基季铵盐、其制备方法及其应用 |
| CN114248042B (zh) * | 2022-01-07 | 2023-04-07 | 苏州唯特偶电子材料科技有限公司 | 无结晶型光伏组件串焊机专用助焊剂 |
| CN116252014B (zh) * | 2023-02-11 | 2024-04-19 | 广东哈福技术股份有限公司 | 一种喷锡助焊剂及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2880125A (en) | 1956-07-30 | 1959-03-31 | Jordan | Flux compositions and processes for soldering and metal coating |
| US3158120A (en) | 1960-10-17 | 1964-11-24 | Fairmount Chem | Core solder |
| US3734791A (en) | 1970-10-23 | 1973-05-22 | Ibm | Surfactant-containing soldering fluxes |
| US4089804A (en) | 1976-12-30 | 1978-05-16 | Ciba-Geigy Corporation | Method of improving fluorinated surfactants |
| US4460414A (en) | 1983-10-31 | 1984-07-17 | Scm Corporation | Solder paste and vehicle therefor |
| JPS62199289A (ja) * | 1986-02-26 | 1987-09-02 | Senjiyu Kinzoku Kogyo Kk | クリ−ムはんだ |
| US5297721A (en) | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
| MX9400876A (es) * | 1993-02-05 | 1994-08-31 | Litton Systems Inc | Solucion de fundente para soldadura, en espuma, libre de resina de trementina, baja en residuos y proceso de soldadura que la emplea. |
| US5571340A (en) | 1994-09-09 | 1996-11-05 | Fry's Metals, Inc. | Rosin-free, low VOC, no-clean soldering flux and method using the same |
-
2001
- 2001-04-12 US US09/834,196 patent/US6524398B2/en not_active Expired - Lifetime
- 2001-04-13 AU AU2001251756A patent/AU2001251756A1/en not_active Abandoned
- 2001-04-13 JP JP2001583977A patent/JP4854164B2/ja not_active Expired - Fee Related
- 2001-04-13 BR BR0110075-0A patent/BR0110075A/pt active Search and Examination
- 2001-04-13 KR KR1020027013729A patent/KR100786593B1/ko not_active Expired - Fee Related
- 2001-04-13 WO PCT/US2001/040518 patent/WO2001087535A2/en not_active Ceased
- 2001-04-13 CA CA002405957A patent/CA2405957C/en not_active Expired - Fee Related
- 2001-04-13 MX MXPA02010148A patent/MXPA02010148A/es active IP Right Grant
- 2001-04-13 CN CNB018093698A patent/CN1235719C/zh not_active Expired - Fee Related
-
2011
- 2011-09-05 JP JP2011193376A patent/JP2011252171A/ja active Pending
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