BR0016118B1 - fundente para soldagem. - Google Patents

fundente para soldagem.

Info

Publication number
BR0016118B1
BR0016118B1 BRPI0016118-7A BR0016118A BR0016118B1 BR 0016118 B1 BR0016118 B1 BR 0016118B1 BR 0016118 A BR0016118 A BR 0016118A BR 0016118 B1 BR0016118 B1 BR 0016118B1
Authority
BR
Brazil
Prior art keywords
flux
resin
welding
coat
acidic
Prior art date
Application number
BRPI0016118-7A
Other languages
English (en)
Other versions
BR0016118A (pt
Inventor
Sanyogita Arora
Alvin F Schneider
Karen A Tellefsen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to BRPI0017633A priority Critical patent/BRPI0017633B1/pt
Publication of BR0016118A publication Critical patent/BR0016118A/pt
Publication of BR0016118B1 publication Critical patent/BR0016118B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31714—Next to natural gum, natural oil, rosin, lac or wax

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Disintegrating Or Milling (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
  • Nonmetallic Welding Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
BRPI0016118-7A 1999-12-03 2000-12-01 fundente para soldagem. BR0016118B1 (pt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
BRPI0017633A BRPI0017633B1 (pt) 1999-12-03 2000-12-01 processo para tratamento de painel de circuito impresso, bem como painel de circuito impresso

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16868999P 1999-12-03 1999-12-03
US17920200P 2000-01-31 2000-01-31
PCT/US2000/032720 WO2001039922A1 (en) 1999-12-03 2000-12-01 Soldering flux

Publications (2)

Publication Number Publication Date
BR0016118A BR0016118A (pt) 2002-11-26
BR0016118B1 true BR0016118B1 (pt) 2012-09-18

Family

ID=26864359

Family Applications (2)

Application Number Title Priority Date Filing Date
BRPI0016118-7A BR0016118B1 (pt) 1999-12-03 2000-12-01 fundente para soldagem.
BRPI0017633A BRPI0017633B1 (pt) 1999-12-03 2000-12-01 processo para tratamento de painel de circuito impresso, bem como painel de circuito impresso

Family Applications After (1)

Application Number Title Priority Date Filing Date
BRPI0017633A BRPI0017633B1 (pt) 1999-12-03 2000-12-01 processo para tratamento de painel de circuito impresso, bem como painel de circuito impresso

Country Status (11)

Country Link
US (1) US6599372B2 (pt)
EP (1) EP1237677B1 (pt)
JP (2) JP5071952B2 (pt)
KR (1) KR100715957B1 (pt)
AT (1) ATE302666T1 (pt)
AU (1) AU1811601A (pt)
BR (2) BR0016118B1 (pt)
CA (1) CA2393399C (pt)
DE (1) DE60022223T2 (pt)
MX (1) MXPA02005498A (pt)
WO (1) WO2001039922A1 (pt)

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BR0016118B1 (pt) * 1999-12-03 2012-09-18 fundente para soldagem.
TWI228132B (en) * 2001-09-26 2005-02-21 Nof Corp Soldering flux composition and solder paste
KR100460957B1 (ko) * 2002-08-26 2004-12-09 삼성전자주식회사 무연 합금 솔더의 솔더링 플럭스
US7740713B2 (en) * 2004-04-28 2010-06-22 International Business Machines Corporation Flux composition and techniques for use thereof
EP1808426A1 (en) * 2006-01-16 2007-07-18 DSMIP Assets B.V. Process for the preparation of alkynediols
US20070284412A1 (en) * 2006-05-31 2007-12-13 Prakash Anna M Solder flux composition
US7780801B2 (en) 2006-07-26 2010-08-24 International Business Machines Corporation Flux composition and process for use thereof
HUE031395T2 (en) * 2006-12-12 2017-07-28 Senju Metal Industry Co Soldering agent for lead-free solder
US20080156852A1 (en) * 2006-12-29 2008-07-03 Prakash Anna M Solder flux composition and process of using same
EP2183076A1 (en) * 2007-07-23 2010-05-12 Henkel Limited Solder flux
US7956114B2 (en) 2009-03-09 2011-06-07 Raytheon Company Water immiscible rosin mildly activated flux
CN101890595B (zh) * 2010-07-02 2012-07-04 厦门大学 一种用于无铅药芯焊丝的低松香免清洗助焊剂及其制备方法
KR101671525B1 (ko) * 2010-07-21 2016-11-17 동우 화인켐 주식회사 땜납용 플럭스 조성물
CN102581521A (zh) * 2012-02-03 2012-07-18 深圳市兴时达科技产品有限公司 无卤无铅免洗助焊剂及其制备方法
JP6098371B2 (ja) * 2012-06-05 2017-03-22 Jsr株式会社 回路の製造方法
US9277638B2 (en) * 2013-03-14 2016-03-01 Raytheon Company Gum rosin protective coating and methods of use
US8887981B2 (en) 2013-03-15 2014-11-18 Raytheon Company Temporary adhesive for component bonding
JP2015127060A (ja) * 2013-12-27 2015-07-09 株式会社日本スペリア社 はんだ用フラックス及びはんだ組成物
CN104148825B (zh) * 2014-08-12 2016-02-17 工业和信息化部电子第五研究所华东分所 一种无铅绿色助焊膏
CN104942480B (zh) * 2015-06-29 2016-08-24 东莞市千岛金属锡品有限公司 一种用于不锈钢软钎焊的固态助焊剂
US10939600B2 (en) 2018-11-28 2021-03-02 International Business Machines Corporation Flux residue detection
CN111531292A (zh) * 2020-05-15 2020-08-14 湖北省哈福生物化学有限公司 一种喷锡助焊剂及其制备方法
CN113249034B (zh) * 2021-05-10 2022-07-01 广东风华高新科技股份有限公司 一种覆膜剂及其应用

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US4009816A (en) 1975-09-02 1977-03-01 Alpha Metals, Inc. Method and apparatus for increasing efficiency of a foam fluxer used in wave soldering of printed wiring boards
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US4143005A (en) 1977-09-19 1979-03-06 Rca Corporation Extrudable, non-flowing and non-aqueous solvent soluble hold down compound for printed wiring board assembly
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GB2071550B (en) 1980-03-17 1984-02-29 Multicore Solders Ltd Soft solder material for use in the formation of a solder bath
JPS56141997A (en) * 1980-03-17 1981-11-05 Multicore Solders Ltd Solder material for forming solder bath
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BR0016118B1 (pt) * 1999-12-03 2012-09-18 fundente para soldagem.

Also Published As

Publication number Publication date
MXPA02005498A (es) 2004-09-10
KR20020060775A (ko) 2002-07-18
EP1237677A1 (en) 2002-09-11
US20010042775A1 (en) 2001-11-22
BRPI0017633B1 (pt) 2016-10-04
DE60022223T2 (de) 2006-06-14
CA2393399C (en) 2011-11-22
WO2001039922A1 (en) 2001-06-07
BR0016118A (pt) 2002-11-26
JP5071952B2 (ja) 2012-11-14
KR100715957B1 (ko) 2007-05-09
US6599372B2 (en) 2003-07-29
DE60022223D1 (de) 2005-09-29
WO2001039922B1 (en) 2001-11-15
EP1237677B1 (en) 2005-08-24
JP2003515456A (ja) 2003-05-07
AU1811601A (en) 2001-06-12
CA2393399A1 (en) 2001-06-07
JP2011212748A (ja) 2011-10-27
ATE302666T1 (de) 2005-09-15

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 18/09/2012, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 19A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.