CN105122957B - 焊料电路基板的制造方法、焊料电路基板和电子部件的安装方法 - Google Patents
焊料电路基板的制造方法、焊料电路基板和电子部件的安装方法 Download PDFInfo
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- CN105122957B CN105122957B CN201480019731.9A CN201480019731A CN105122957B CN 105122957 B CN105122957 B CN 105122957B CN 201480019731 A CN201480019731 A CN 201480019731A CN 105122957 B CN105122957 B CN 105122957B
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- solder
- resist
- circuit substrate
- manufacture method
- heating
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/03—Manufacturing methods
- H01L2224/034—Manufacturing methods by blanket deposition of the material of the bonding area
- H01L2224/0343—Manufacturing methods by blanket deposition of the material of the bonding area in solid form
- H01L2224/03442—Manufacturing methods by blanket deposition of the material of the bonding area in solid form using a powder
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- H01L2224/0347—Manufacturing methods using a lift-off mask
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- H01L2224/03849—Reflowing
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
- H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
- H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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- H—ELECTRICITY
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- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8121—Applying energy for connecting using a reflow oven
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Abstract
一种焊料电路基板的制造方法,其特征在于,依次进行以下工序:抗蚀剂形成工序,该工序由抗蚀剂部分地覆盖印刷布线板上的导电性电路电极表面;粘着部形成工序,该工序对所述导电性电路电极表面之中没有被抗蚀剂覆盖的部分赋予粘着性而形成粘着部;焊料附着工序,该工序使焊料粉末附着在所述粘着部;抗蚀剂除去工序,该工序除去所述抗蚀剂;和第1加热工序,该工序加热所述印刷布线板而使焊料粉末熔融。
Description
技术领域
本发明涉及焊料(钎料)电路基板的制造方法、焊料电路基板和电子部件的安装方法。本申请基于在2013年4月9日在日本提出的专利申请2013-081208要求优先权,并将其内容援引于此。
背景技术
近年来,在电路图案上焊料接合了IC元件、半导体芯片等电子部件的电子电路已实用化。该电路图案形成于塑料基板、陶瓷基板、或涂布了塑料等的绝缘性基板上。
作为在制造这样的电子电路时使电子部件的引线端子与电路图案的规定部分接合的方法,已知以下的方法。例如,已知在基板上的导电性电路电极的表面预先形成焊料层,将焊料糊或助焊剂印刷在该焊料层上的规定部分,然后,一边将引线端子与焊料糊的位置对合,一边将电子部件载置于焊料层上,进行回流焊(reflow),由此进行焊料接合的方法。另外,也已知采用倒装芯片焊接机进行的安装,即,将形成于焊料基板上的焊料层与形成于裸芯片(bare chip)侧的金的柱形凸块(stud bump)重叠加压并且加热,使焊料熔融而进行安装。
最近,随着电子产品的小型化,在细间距(fine pitch)化的基板上,搭载了例如150μm间距以下的FC(Flip Chip)等的细间距的电子部件。因此,期望在基板上形成有细间距的精细的电路图案的焊料电路基板。
在上述的电子部件的接合方法中,为了由焊料膜形成电路图案(以下记为焊料电路),采用了镀敷法、热风整平(HAL)法、或将焊料粉末的糊印刷在基板上并对该糊进行回流焊的方法等。但是,在镀敷法中,难以增厚焊料层,因此电子部件对电路图案的接合强度减弱,电子部件有可能从基板剥离。另外,在HAL法、进行焊料糊的印刷和回流焊的方法中,难以形成细间距的电路图案。
因此,作为确保焊料层的厚度、并且形成与细间距化对应的焊料电路的方法,例如在专利文献1中公开了下述方法:在印刷布线板上的金属电路露出部选择性地形成赋予了粘着性的粘着部,使焊料粉末附着在该粘着部后,加热印刷布线板,使焊料粉末熔融而形成焊料电路。
在制造形成有上述那样的焊料电路的焊料电路基板时,不需要在金属电路表面整体上形成焊料层。即,形成焊料层的可以仅是在金属电路的表面上接合电子部件的部分,如果在该部分以外的金属电路的表面形成焊料层,则会浪费作为焊料层的材料的焊料合金。
另外,焊料合金在熔融时因表面张力的影响而向金属电路的宽度宽的部分移动,因此该部分的焊料层厚度变大。如果由此焊料电路基板的焊料层厚度发生偏差,则具有在焊料层的形成工序后进行的电子部件的接合工序中,电子部件的引线端子与电路图案的接合强度发生偏差等的不良影响。
因此,在采用专利文献1中记载的焊料电路形成方法制造焊料电路基板时,用阻焊剂(solder resist)覆盖金属电路电极的表面之中除了接合电子部件的部位以外的部分的情况较多。
具体而言,首先,如图1(a)所示,在基板1的表面形成由金属构成的电路图案2。接着,如图1(b)所示,用阻焊剂4覆盖除了与电子部件的接合部位3以外的电路图案2的表面。然后,如图1(c)所示,对接合部位3的电路图案2的表面赋予粘着性而形成粘着部5。接着,如图1(d)所示,使焊料粉末6附着在粘着部5。通过使该焊料粉末6熔融,如图1(e)所示形成焊料层7,来制造焊料电路基板8。
然后,如图1(f)所示,在焊料层7上,将与电子部件9的电极部10的位置对合,利用倒装芯片焊接机加热并且加压,使由焊料层7形成的焊料电路11熔化。并且,如图1(g)所示,制造电子部件9与焊料电路基板8的熔化后的焊料电路13接合了的安装基板12。再者,设置于电极部分10的突起部被称为柱形凸块,是为了使与焊料层7的接合稳定化而设置的。
在先技术文献
专利文献
专利文献1:日本特开平7-7244号公报
发明内容
但是,在采用专利文献1记载的焊料电路形成方法制造焊料电路基板时,为了将焊料电路的图案微细化,需要图1(b)所示的阻焊剂4的图案也微细化。但是,一般所使用的阻焊剂的图案的微细化存在极限。
另外,通常在图1(g)所示的电子部件9与阻焊剂4之间填充有用于固定电子部件9的树脂,但如果变为细间距,则不得不缩小电子部件9的电极部10,成为难以取得充分的间隔的状态。
特别是如果在作为电子部件使用裸芯片时变为细间距,则由于形成于裸芯片的柱形凸块的影响而需要将电极部形成为2列以上。但是,会成为电子部件的电极部越发变小,越发难以取得电子部件与基板的间隔的状态。
即,为了实施图1(b)、(e)所示的工序,作为阻焊剂,使用在能够精度良好地应用光刻技术的同时,可承受焊料的熔融温度的树脂。焊料的熔融温度通常超过200℃,但可承受那样的温度的树脂的种类受限,在该受限的种类的树脂之中,能够应用于采用光刻技术的微细的图案化的树脂较少。
本发明的课题是解决上述问题,提供采用能够仅在必要的微细部分形成焊料层和/或焊料凸块的技术的焊料电路基板的制造方法、焊料电路基板和电子部件的安装方法。
本发明人为解决上述课题而认真努力研究的结果,完成了本发明。即,本发明涉及下述内容。
(1)一种焊料电路基板的制造方法,其特征在于,依次进行以下工序:抗蚀剂形成工序,该工序由抗蚀剂部分地覆盖印刷布线板上的导电性电路电极表面;粘着部形成工序,该工序对所述导电性电路电极表面之中没有被抗蚀剂覆盖的部分赋予粘着性而形成粘着部;焊料附着工序,该工序使焊料粉末附着在所述粘着部;抗蚀剂除去工序,该工序除去所述抗蚀剂;和第1加热工序,该工序加热所述印刷布线板而使焊料粉末熔融。
(2)一种焊料电路基板的制造方法,其特征在于,依次进行以下工序:抗蚀剂形成工序,该工序由抗蚀剂部分地覆盖印刷布线板上的导电性电路电极表面;粘着部形成工序,该工序对所述导电性电路电极表面之中没有被抗蚀剂覆盖的部分赋予粘着性而形成粘着部;抗蚀剂除去工序,该工序除去所述抗蚀剂;焊料附着工序,该工序使焊料粉末附着在所述粘着部;和第1加热工序,该工序加热所述印刷布线板而使焊料粉末熔融。
(3)根据前项(1)或(2)所述的焊料电路基板的制造方法,其特征在于,在所述焊料附着工序后紧接着设置第2加热工序。
(4)根据前项(1)~(3)的任一项所述的焊料电路基板的制造方法,其特征在于,在所述抗蚀剂除去工序与所述第1加热工序之间设置对所述焊料粉末涂布助焊剂(钎剂:flux)的工序。
(5)根据前项(1)~(4)的任一项所述的焊料电路基板的制造方法,其特征在于,所述抗蚀剂为碱显影型,在所述抗蚀剂除去工序中使用碱性液除去所述抗蚀剂。
(6)根据前项(2)~(5)的任一项所述的焊料电路基板的制造方法,其特征在于,所述焊料粉末是Sn-Pb系焊料粉末,第1加热工序中的加热温度为200℃~350℃的范围内,第2加热工序中的加热温度为100℃~180℃的范围内。
(7)根据前项(2)~(5)的任一项所述的焊料电路基板的制造方法,其特征在于,所述焊料粉末是Sn-Ag系焊料粉末,第1加热工序中的加热温度为250℃~350℃的范围内,第2加热工序中的加热温度为100℃~180℃的范围内。
(8)根据前项(1)~(7)的任一项所述的焊料电路基板的制造方法,其特征在于,所述导电性电路电极由铜合金构成,在所述粘着部形成工序中,通过所述铜合金与苯并三唑系衍生物、萘并三唑系衍生物、咪唑系衍生物、苯并咪唑系衍生物、巯基苯并噻唑系衍生物、苯并噻唑硫代脂肪酸系衍生物的反应,对没有被所述抗蚀剂覆盖的部分赋予粘着性。
(9)一种焊料电路基板,是采用前项(1)~(8)的任一项所述的焊料电路基板的制造方法制作的。
(10)一种电子部件的安装方法,其特征在于,包括以下工序:电子部件载置工序,该工序将电子部件载置于前项(9)所述的焊料电路基板;和电子部件接合工序,该工序对所述焊料粉末进行回流焊而将所述电子部件的电极部分与所述焊料电路基板接合。
根据本发明的实施方式的一方式,在使焊料粉末附着在粘着部后除去抗蚀剂、或在除去抗蚀剂后使焊料粉末附着在粘着部,然后使焊料粉末熔融。因此,在焊料熔融时,在基板上不存在抗蚀剂,不需要使用耐热性的抗蚀剂。因此,能够扩大抗蚀剂的选择范围,例如能够选择最适合于细间距的抗蚀剂。由此,能够形成细间距化的焊料电路。另外,由于在电子部件的安装部分不存在阻焊剂,因此能够使电子部件的柱形凸块较低。
附图说明
图1是表示以往的焊料电路基板的制造方法的图,(a)~(g)是截面图。
图2是表示作为本发明的第一实施方式的焊料电路基板的制造方法的图,(a)~(h)是截面图。
图3是表示以往的焊料电路基板的制造方法的图,(a)~(c)是截面图。
图4是表示作为本发明的实施方式的焊料电路基板的制造方法的图,(a)~(c)是截面图。
具体实施方式
以下,参照图2对作为本发明的实施方式的焊料电路基板的制造方法进行说明。再者,以下的说明中使用的附图是示意性的,长度、宽度和厚度的比率等不一定与实际的情形相同。
本实施方式的焊料电路基板的制造方法(以下简称为“制造方法”),至少具备以下工序:抗蚀剂形成工序,该工序由抗蚀剂部分地覆盖印刷布线板上的导电性电路电极表面;粘着部形成工序,该工序对导电性电路电极表面之中没有被抗蚀剂覆盖的部分赋予粘着性而形成粘着部;焊料附着工序,该工序使焊料粉末附着在粘着部;抗蚀剂除去工序,该工序除去抗蚀剂;和第1加热工序,该工序加热印刷布线板而将焊料粉末熔融。另外,本实施方式的制造方法中,在焊料附着工序后紧接着具备用于提高焊料粉末对粘着部的附着力的第2加热工序。进而,在本实施方式的制造方法中,在第1加热工序之后具备将电子部件的电极部分与焊料电路基板的焊料电路接合的电子部件接合工序。以下,对各工序依次进行说明。
预先准备如图2(a)所示的印刷布线板23。作为印刷布线板23,可以使用在基板24上利用金属等的导电性物质形成了电路图案(导电性电路电极)25的单面印刷布线板、双面印刷布线板、多层印刷布线板或柔性印刷布线板等。具体而言,可举出在塑料基板、塑料薄膜基板、玻璃布基板、纸基质环氧树脂基板、陶瓷基板等上层叠了金属板的基板,或对金属基材被覆了塑料或陶瓷等而成的绝缘基板。另外,作为导电性物质,可举出例如铜或铜合金,但不限定于此,只要是能够通过后述的粘着性赋予化合物而赋予粘着性的物质即可。这样的导电性物质,除了铜以外,有包含例如Ni、Sn、Ni-Al、焊料合金等的物质。
[抗蚀剂形成工序]
首先,如图2(b)所示,用抗蚀剂27覆盖除了印刷布线板24的与电子部件的接合部位26以外的电路图案25的表面25a。如后所述,由于在使焊料粉末熔融前除去抗蚀剂27,因此作为抗蚀剂27不需要使用相对于焊料的熔融温度具有耐热性的阻焊剂。作为本实施方式的制造方法中使用的抗蚀剂27,使用具有在之后说明的粘着部形成工序中能够充分保护电路图案25的表面25a之中不赋予粘着性的部分的性质、且不使粘着性赋予化合物变质的抗蚀剂。即,作为抗蚀剂27,可以使用即使不具有在焊料粉末的熔融温度下的耐热性,也能够应用于采用了光刻技术的微细的图案化的抗蚀剂。由此,能够在基板24上形成细间距化了的微细的图案的接合部位26。
另外,在本实施方式的制造方法中,优选使用不使在电路图案25的表面25a进行反应的粘着性赋予化合物变质的抗蚀剂27。由于后面例示的粘着性赋予化合物具有耐碱性,因此作为抗蚀剂27,优选使用由碱显影型的材质、即碱可溶性树脂构成的抗蚀剂。作为这样的抗蚀剂,可举出例如PVA系光致抗蚀剂、聚氧化稀系光致抗蚀剂、聚醚酯系光致抗蚀剂等。另外,作为抗蚀剂27的显影液,可举出例如氢氧化四甲基铵(TMAH)、氢氧化四丁基铵(TBAH)、铵盐等。
[粘着部形成工序]
接着,如图2(c)所示,通过对电子部件的接合部位(没有被抗蚀剂27覆盖的部分)26的电路图案25的表面25a赋予粘着性,形成粘着部28。具体而言,如以下说明的那样,通过在接合部位26的电路图案25的表面25a使粘着性赋予化合物反应,能够形成粘着部28。
在本实施方式的制造方法中,优选使用相对于形成电路图案25的导电性物质反应性强的粘着性赋予化合物。在作为导电性物质使用铜的情况下,作为优选的粘着性赋予化合物,可举出例如苯并三唑系衍生物、萘并三唑系衍生物、咪唑系衍生物、苯并咪唑系衍生物、巯基苯并噻唑系衍生物和苯并噻唑硫代脂肪酸等。这些粘着性赋予化合物,特别是相对于铜的反应性强,但对其它导电性物质也能够赋予粘着性。
在本实施方式的制造方法中优选使用的苯并三唑系衍生物由通式(1)表示。
其中,通式(1)的R1~R4独立地为氢原子、碳原子数为1~16的烷基、烷氧基、F、Br、Cl、I、氰基、氨基或OH基。
由通式(1)表示的苯并三唑系衍生物,一般地R1~R4的碳原子数越多,粘着性就越强。因此,R1~R4的碳原子数优选为5~16。
在本实施方式的制造方法中优选使用的萘并三唑系衍生物由通式(2)表示。
其中,通式(2)的R5~R10独立地为氢原子、碳原子数为1~16、优选碳原子数为5~16的烷基、烷氧基、F、Br、Cl、I、氰基、氨基或OH基。
在本实施方式的制造方法中优选使用的咪唑系衍生物由通式(3)表示。
其中,通式(3)的R11、R12独立地为氢原子、碳原子数为1~16的烷基、烷氧基、F、Br、Cl、I、氰基、氨基或OH基。
在本实施方式的制造方法中优选使用的苯并咪唑系衍生物由通式(4)表示。
其中,通式(4)的R13~R17独立地为氢原子、碳原子数为1~16的烷基、烷氧基、F、Br、Cl、I、氰基、氨基或OH基。
关于由通式(3)以及通式(4)表示的咪唑系衍生物以及苯并咪唑系衍生物,也是R11~R17的碳原子数越多,粘着性就越强。因此,R11~R17的碳原子数优选为5~16。
在本实施方式的制造方法中优选使用的巯基苯并噻唑系衍生物由通式(5)表示。
其中,通式(5)的R18~R21独立地为氢原子、碳原子数为1~16、优选碳原子数为5~16的烷基、烷氧基、F、Br、Cl、I、氰基、氨基或OH基。
在本实施方式的制造方法中优选使用的苯并噻唑硫代脂肪酸系衍生物由通式(6)表示。
其中,通式(6)的R22~R26独立地为氢原子、碳原子数为1~16、优选碳原子数为1或2的烷基、烷氧基、F、Br、Cl、I、氰基、氨基或OH基。
优选:使上述的粘着性赋予化合物溶解于水或酸性水中,在优选调整为pH3~4左右的微酸性的状态下进行反应。作为用于调整这样的粘着性赋予化合物溶液的pH值的物质,如果导电性物质为金属,则可举出例如盐酸、硫酸、硝酸、磷酸等无机酸、或甲酸、乙酸、丙酸、苹果酸、草酸、丙二酸、琥珀酸、酒石酸等有机酸。
在使粘着性赋予化合物溶解时,粘着性赋予化合物的浓度根据溶解性、使用状况适当设定即可,并不严密地限定,但作为整体优选为0.05质量%~20质量%的范围内。如果设定为该范围内的浓度,则容易操作粘着性赋予化合物。另一方面,如果成为低于该范围的浓度,则粘着部28的生成变得不充分,因此不优选。
接着,使图2(b)所示的印刷布线板23浸渍于粘着性赋予化合物溶液中,或者向接合部位26的电路图案25的表面25a注入粘着性赋予化合物溶液。由此,如图2(c)所示对接合部位26的电路图案25的表面25a赋予粘着性,形成粘着部28。
使粘着性赋予化合物反应时的优选的温度,根据粘着性赋予化合物的浓度、导电性物质的种类而变化,因此不特别限定。但是,使粘着性赋予化合物反应时的温度,优选稍高于室温,优选为30℃~60℃的范围。由此,粘着部28的生成速度、生成量变得适当。
另外,使粘着性赋予化合物反应时的浸渍时间不特别限定,但从工作效率的方面出发,优选调整其它条件使得浸渍时间为5秒~5分钟左右的范围。
再者,从粘着部28的生成速度、生成量等的生成效率更加提高的方面出发,优选在粘着性赋予化合物溶液中共存浓度为100~1000ppm左右的铜离子。
接着,将粘着部28水洗,并使其干燥。在本实施方式的制造方法中,在抗蚀剂形成工序中以与细间距对应的方式将抗蚀剂27微细地图案化,因此如图2(c)所示,得到在细间距化了的接合部位26的电路图案25的表面25a形成有粘着部28的印刷布线板29。
[焊料附着工序]
接着,采用将焊料粉末撒在印刷布线板29上等的方法,使焊料粉末30附着在粘着部28。然后,除去多余的焊料粉末,得到图2(d)所示的印刷布线板31。
作为在本实施方式的制造方法中使用的焊料粉末30,可举出例如由Sn-Pb系、Sn-Ag系、Sn-Pb-Ag系、Sn-Pb-Bi系、Sn-Pb-Bi-Ag系、Sn-Pb-Cd系的焊料合金构成的粉末。另外,从最近的产业废弃物中的Pb排除的方面出发,作为焊料粉末30,优选使用由不含Pb的Sn-In系、Sn-Bi系、In-Ag系、In-Bi系、Sn-Zn系、Sn-Ag系、Sn-Cu系、Sn-Sb系、Sn-Au系、Sn-Bi-Ag-Cu系、Sn-Ge系、Sn-Bi-Cu系、Sn-Cu-Sb-Ag系、Sn-Ag-Zn系、Sn-Cu-Ag系、Sn-Bi-Sb系、Sn-Bi-Sb-Zn系、Sn-Bi-Cu-Zn系、Sn-Ag-Sb系、Sn-Ag-Sb-Zn系、Sn-Ag-Cu-Zn系、Sn-Zn-Bi系的焊料合金构成的粉末。
作为焊料粉末30的金属组成,以Sn为63质量%、Pb为37质量%的共晶焊料(以下记为63Sn/37Pb)为中心,可举出96.5Sn/3.5Ag、62Sn/36Pb/2Ag、62.6Sn/37Pb/0.4Ag、60Sn/40Pb、50Sn/50Pb、30Sn/70Pb、25Sn/75Pb、10Sn/88Pb/2Ag、46Sn/8Bi/46Pb、57Sn/3Bi/40Pb、42Sn/42Pb/14Bi/2Ag、45Sn/40Pb/15Bi、50Sn/32Pb/18Cd、48Sn/52In、43Sn/57Bi、97In/3Ag、58Sn/42In、95In/5Bi、60Sn/40Bi、91Sn/9Zn、96.5Sn/3.5Ag、99.3Sn/0.7Cu、95Sn/5Sb、20Sn/80Au、90Sn/10Ag、90Sn/7.5Bi/2Ag/0.5Cu、97Sn/3Cu、99Sn/1Ge、92Sn/7.5Bi/0.5Cu、97Sn/2Cu/0.8Sb/0.2Ag、95.5Sn/3.5Ag/1Zn、95.5Sn/4Cu/0.5Ag、52Sn/45Bi/3Sb、51Sn/45Bi/3Sb/1Zn、85Sn/10Bi/5Sb、84Sn/10Bi/5Sb/1Zn、88.2Sn/10Bi/0.8Cu/1Zn、89Sn/4Ag/7Sb、88Sn/4Ag/7Sb/1Zn、98Sn/1Ag/1Sb、97Sn/1Ag/1Sb/1Zn、91.2Sn/2Ag/0.8Cu/6Zn、89Sn/8Zn/3Bi、86Sn/8Zn/6Bi、89.1Sn/2Ag/0.9Cu/8Zn等。另外,焊料粉末30也可以是混合有2种以上的不同的金属组成的焊料粉末的焊料粉末。
本实施方式的制造方法中的焊料粉末30的平均粒径,只要基于由日本工业标准(JIS)规定的规格适当设定即可。再者,在JIS中一般关于焊料粉末的粒径,通过筛分规定了63~22μm、45~22μm和38~22μm等的规格。
[第2加热工序]
在本实施方式的制造方法中,优选在图2(d)所示的附着工序之后紧接着设置第2加热工序。第2加热工序是用于提高焊料粉末30向粘着部28的保持力的工序。因此,通过进行第2加热工序,在第2加热工序之后的各工序中,焊料粉末30难以从粘着部28脱离。
第2加热工序的温度优选为100℃~180℃。特别是在焊料粉末为Sn-Pb系焊料粉末或Sn-Ag系焊料粉末时优选为该温度范围。通过设为该温度范围,能够使粘着部28的附着力更加提高。
另外,如上述那样,作为导电性物质使用铜,并且作为粘着性赋予化合物使用萘并三唑系衍生物、苯并三唑系衍生物、咪唑系衍生物、苯并咪唑系衍生物、巯基苯并噻唑系衍生物以及苯并噻唑硫代脂肪酸等的情况下,优选将本工序中的印刷布线板31的加热温度设为100~180℃的范围内,将加热时间设为30~120秒的范围内。根据该条件,可更加提高粘着部28的附着力。
[抗蚀剂除去工序]
接着,将印刷布线板31的抗蚀剂27剥离。抗蚀剂27的剥离液的种类,只要是不使焊料粉末30和粘着部28溶解及变性的剥离液,就不特别限定。另外,如上述那样,作为粘着性赋予化合物使用萘并三唑系衍生物、苯并三唑系衍生物、咪唑系衍生物、苯并咪唑系衍生物、巯基苯并噻唑系衍生物以及苯并噻唑硫代脂肪酸等的情况下,使用不使这些粘着性赋予化合物变性的剥离液。作为这样的剥离液,可举出例如氢氧化四甲基铵(TMAH)、氢氧化钠水溶液、氢氧化四丁基铵(TBAH)、铵盐等的碱性剥离液。
另外,在抗蚀剂为碱显影型的情况下,优选在抗蚀剂除去工序中,使用碱性液除去抗蚀剂。如上述那样,抗蚀剂优选为碱显影型。因此,通过使用碱性液能够容易地进行抗蚀剂的除去。另外,如果使用碱性液,则能够在具有耐碱性的粘着层中抑制焊料粉末的脱落。
通过本工序,如图2(e)所示,得到将抗蚀剂27剥离了的印刷布线板32。在抗蚀剂形成工序和粘着部形成工序中,形成细间距化了的微细的图案的粘着部28,因此在印刷布线板32上,焊料粉末30以细间距而形成。
再者,在本实施方式的制造方法中,也可以在粘着部形成工序之后进行抗蚀剂除去工序,然后进行焊料附着工序。采用这样的制造方法也可得到印刷布线板32。
另外,在本实施方式的制造方法中,也可以在抗蚀剂除去工序与下面说明的第1加热工序之间设置对焊料粉末30涂布助焊剂的工序。通过该工序,能够提高第1加热工序中的焊料粉末30的熔融性。作为对焊料粉末30涂布的助焊剂,可以使用松香等。
[第1加热工序]
接着,使印刷布线板32的焊料粉末30熔融,如图2(f)所示,得到在接合部位26的电路图案25的表面25a形成有焊料层33的焊料电路基板34。焊料层33是之后构成焊料电路的层。
使焊料粉末30熔融时的加热温度和加热时间,只要考虑焊料粉末30的合金组成和粒径适当设定即可。例如,在作为焊料粉末30使用由91Sn/9Zn、89Sn/8Zn/3Bi、86Sn/8Zn/6Bi等Sn-Zn系的焊料合金构成的粉末的情况下,优选:加热温度设为210~230℃、优选设为210~220℃,加热时间设为30~60秒、优选设为30~40秒。另外,在作为焊料粉末30使用由Sn-Pb系的焊料合金构成的粉末的情况下,优选:加热温度设为200~350℃、优选设为200~250℃,加热时间设为30~60秒、优选设为30~40秒。另外,在作为焊料粉末30使用由Sn-Ag系的焊料合金构成的粉末的情况下,优选:加热温度设为250~350℃、优选设为220~270℃,加热时间设为30~60秒、优选设为30~40秒。
根据这样的条件,焊料粉末30被良好地熔融。另外,在本工序中通过焊料粉末30的表面张力和粘着部28的附着力,可几乎不会从粘着部28扩展地形成适度的焊料厚度的焊料层33。
使用其它合金系的焊料粉末30的情况下的加热温度,优选设为焊料合金的熔点+20℃~焊料合金的熔点+50℃,更优选设为合金的熔点+20℃~合金的熔点+30℃。通常将加热温度设为200℃~350℃的范围内,并将加热时间设为与上述同样的范围即可。
[电子部件接合工序]
接着,在作为电子部件35安装细间距的裸芯片的情况下,使用倒装芯片焊接机等,如图2(g)所示将焊料层33与形成于裸芯片的电极上的凸块36的位置对合,一边加热一边加压。通过该工序,如图2(h)所示,得到焊料熔融而与焊料电路37连接了的安装基板38。
作为使用电阻器、电容器、变压器、电感器、过滤器、振荡器、振动器等作为图2(g)和图2(h)所示的电子部件35,将电子部件35与焊料电路基板34接合的方法,可以采用例如表面安装技术(SMT)。在SMT中,首先,采用丝网印刷法将焊料糊涂布于电路图案25的表面25a的接合部位26。接着,将芯片部件、QFP等的电子部件35载置于未图示的焊料糊上,通过回流焊热源一并进行焊料接合。作为这样的回流焊过程中的回流焊热源,可以使用热风炉、红外线炉、蒸汽冷凝钎焊装置、光束钎焊装置等。
上述的回流焊的过程的条件,根据焊料粉末30和焊料糊的金属组成而不同,因此考虑其金属组成适当设定即可。例如,在作为焊料粉末30和焊料糊使用91Sn/9Zn、89Sn/8Zn/3Bi、86Sn/8Zn/6Bi等Sn-Zn系的焊料合金的情况下,优选进行预加热和回流焊这2段工序。这样的2段工序中的各工序的条件,优选:将预加热温度设为130~180℃、优选为130~150℃,将预加热时间设为60~120秒、优选为60~90秒。另外,优选:将回流焊温度设为210~230℃、优选为210~220℃,将回流焊时间设为30~60秒、优选为30~40秒。再者,其它合金系的焊料粉末30和焊料糊的回流焊温度,设为使用的合金的熔点+20℃~使用的合金的熔点+50℃,优选设为合金的熔点+20℃~合金的熔点+30℃,此外的预加热温度、预加热时间、回流焊时间设为与上述同样的范围即可。
上述的回流焊过程,可以在氮气中、大气中的任一种气氛中进行。在氮气中进行回流焊的情况下,通过将氧浓度设为5体积%以下、优选设为0.5体积%以下,与在大气中进行回流焊的情况相比,能够提高焊料糊对焊料层33的润湿性,并且抑制焊料球的发生,进行稳定的处理。
在回流焊过程后,通过冷却焊料电路基板34,完成表面安装。这样的采用SMT进行的电子部件的接合,可以对印刷布线板24的两面进行。
如上述说明的那样,根据本实施方式的焊料电路基板的制造方法,在粘着部形成工序与第1加热工序之间进行抗蚀剂除去工序,因此能够在使涂布于电路图案25的表面25a的接合部位26的焊料粉末30熔融前除去抗蚀剂27。由此,在抗蚀剂形成工序中,能够使用即使相对于焊料的熔融温度不具有耐热性也能够应用于进行微细的图案化的光刻技术的抗蚀剂27。并且,能够以20μm水平的微细的图案将抗蚀剂27图案化。其结果,使印刷布线板23的电路图案25的表面25a的没有被抗蚀剂覆盖的部分、即电子部件的接合部位26细间距化,在接合部位26依次形成的粘着部28和焊料粒子30的图案也细间距化。同时,焊料的使用量也被抑制为最小限度。这样,在第1加热工序完成时,可得到形成有与细间距对应的微细的图案的焊料层33的焊料电路基板34。
接着,对在电极间具有电极部的细间距化了的裸芯片的接合工序进行说明。在形成有2列电极的裸芯片中,通常形成图3(a)的焊料电路基板17,如图3(b)所示,在以覆盖电路图案的方式而形成了的焊料凸块15上,将与形成于电子部件18的电极部分的柱形凸块19的位置对合,并且利用倒装芯片焊接机一边加热一边加压。虽然取决于加热加压条件和位置偏差,但由于电极16的间隔窄,因此如图3(b)所示,有时焊料会与相邻的电极16接触。此时如果焊料完全熔融,则可得到图3(c)所示的具有焊料电路20的安装基板22,但有时在一部分处如电极21那样架桥。
与此相对,在本实施方式的制造方法中,通过在基板39上的电路图案40的电极表面每隔1个就形成抗蚀剂层(省略图示),能够制作每隔1个电极就形成了焊料层的图4(a)所示的焊料电路基板42。将该焊料电路基板42的形成了焊料层的电极41和电子部件43的电极部44,如图4(b)所示利用倒装芯片焊接机一边加热一边加压,则可得到如图4(c)所示那样焊料熔融而与焊料电路回路45连接了的、不发生架桥的安装基板46。
以上,对本发明的优选实施方式进行了详细描述,但本发明并不限定于所涉及的特定实施方式,可以在权利要求书所记载的本发明的要旨的范围内进行各种变形和变更。
实施例
以下,通过实施例对本发明进行说明,但本发明并不限定于此。
(实施例1)
作为导电性物质使用铜,来制作了印刷布线板(以下简称为“印刷布线板”)。由导电性物质构成的印刷布线板的电路图案的线宽为25μm,最窄的电路图案的间隔为25μm。准备了在该印刷布线板上贴附了光致抗蚀剂(型号:H-7034,日立化成株式会社制)的基板。使用光掩模将印刷布线板进行紫外线曝光后,使用碱性显影液例如1%碳酸钠水溶液将印刷布线板图案化。在导电性电路电极表面上没有被抗蚀剂覆盖的区域,每隔1个电极就将尺寸设为25×80μm。
作为粘着性赋予化合物溶液,使用了利用乙酸将通式(3)的R12的烷基为C11H23、R11为氢原子的咪唑系化合物的2质量%水溶液的pH值调整为约4的溶液。将该咪唑系化合物水溶液加温至40℃,使利用盐酸水溶液进行了预处理的印刷布线板在其中浸渍3分钟后,在抗蚀剂的开口区域形成了粘着部。
接着,将印刷布线板水洗后,使其干燥。将平均粒径约为10μm、合金组成为63Sn/37Pb的焊料粉末撒在该印刷布线板上,轻轻涂刷使其选择性地附着在粘着部上。然后,将印刷布线板在120℃下加热10分钟后,使用碱性剥离液3%氢氧化钠水溶液,将形成于印刷布线板表面的光致抗蚀剂剥离。将聚合松香涂布于印刷布线板的焊料粉末配置部分后,将印刷布线板放入240℃的烘箱中,使焊料粉末熔融。接着,得到了在由铜构成的电路图案的焊料粉末附着部分形成有约10μm的共晶焊料层的焊料电路基板。
接着,将形成了焊料凸块的印刷布线板设置于倒装芯片焊接机,加热至160℃。以将在裸芯片的电极(间距:100μm)上形成了柱形凸块(直径50μm×高度80μm)的芯片的电极与印刷布线板的电极对合的方式,将裸芯片加热至230℃并进行了安装。
(实施例2)
除了没有进行焊料粉末附着后的印刷布线板的加热(第2加热工序)以外,以与实施例1同样的工序和条件在印刷布线板上安装了裸芯片。
(比较例)
使用没有贴附光致抗蚀剂的基板作为印刷布线板,没有用抗蚀剂覆盖电路图案就赋予粘着性,使焊料粉末附着。此外通过与实施例1同样的工序和条件在印刷布线板上安装了裸芯片。
(实施例1、实施例2和比较例的评价)
在通过上述的工序安装了裸芯片的焊料电路基板中,如表1所示,在实施例1、实施例2和比较例中形成了具有相同程度的凸块高度的微小凸块。实施例1,通过进行第二加热工序,在光致抗蚀剂的剥离工序中抑制了焊料粉末的脱落,因此确保了凸块高度。另外,在倒装芯片安装中,在印刷布线板上形成了光致抗蚀剂的实施例1和实施例2的安装基板良好,但在印刷布线板上没有形成光致抗蚀剂的比较例的安装基板,确认到架桥的发生。
表1
在上述说明的实施例1和实施例2中,在使焊料粉末附着于粘着部之后除去光致抗蚀剂,然后使焊料粉末熔融,因此在焊料熔融时,基板上不存在抗蚀剂,不需要使用耐热性的抗蚀剂。因此,根据本发明,由表1所示的评价结果可知,能够形成细间距化的良好的焊料电路,能够使电子部件的柱形凸块较低。
附图标记说明
2、25、40…电路图案(导电性电路电极),3、26…接合部位(没有被抗蚀剂覆盖的部分),4、27…抗蚀剂,5、28…粘着部,6、30…焊料粉末,8、12、23、29、31、32、34、38…印刷布线板,25a…表面,17、34…焊料电路基板。
Claims (10)
1.一种焊料电路基板的制造方法,其特征在于,依次进行以下工序:
抗蚀剂形成工序,该工序由抗蚀剂部分地覆盖印刷布线板上的导电性电路电极表面;
粘着部形成工序,该工序对所述导电性电路电极表面之中没有被抗蚀剂覆盖的部分赋予粘着性而形成粘着部;
焊料附着工序,该工序使焊料粉末附着在所述粘着部;
抗蚀剂除去工序,该工序除去所述抗蚀剂;和
第1加热工序,该工序加热所述印刷布线板而使焊料粉末熔融。
2.一种焊料电路基板的制造方法,其特征在于,依次进行以下工序:
抗蚀剂形成工序,该工序由抗蚀剂部分地覆盖印刷布线板上的导电性电路电极表面;
粘着部形成工序,该工序对所述导电性电路电极表面之中没有被抗蚀剂覆盖的部分赋予粘着性而形成粘着部;
抗蚀剂除去工序,该工序除去所述抗蚀剂;
焊料附着工序,该工序使焊料粉末附着在所述粘着部;和
第1加热工序,该工序加热所述印刷布线板而使焊料粉末熔融。
3.根据权利要求1或2所述的焊料电路基板的制造方法,其特征在于,在所述焊料附着工序后紧接着设置第2加热工序。
4.根据权利要求1或2所述的焊料电路基板的制造方法,其特征在于,在所述抗蚀剂除去工序与所述第1加热工序之间设置对所述焊料粉末涂布助焊剂的工序。
5.根据权利要求1或2所述的焊料电路基板的制造方法,其特征在于,所述抗蚀剂为碱显影型,
在所述抗蚀剂除去工序中使用碱性液除去所述抗蚀剂。
6.根据权利要求3所述的焊料电路基板的制造方法,其特征在于,所述焊料粉末是Sn-Pb系焊料粉末,
第1加热工序中的加热温度为200℃~350℃的范围内,
第2加热工序中的加热温度为100℃~180℃的范围内。
7.根据权利要求3所述的焊料电路基板的制造方法,其特征在于,所述焊料粉末是Sn-Ag系焊料粉末,
第1加热工序中的加热温度为250℃~350℃的范围内,
第2加热工序中的加热温度为100℃~180℃的范围内。
8.根据权利要求1或2所述的焊料电路基板的制造方法,其特征在于,所述导电性电路电极由铜合金构成,
在所述粘着部形成工序中,通过所述铜合金与苯并三唑系衍生物、萘并三唑系衍生物、咪唑系衍生物、苯并咪唑系衍生物、巯基苯并噻唑系衍生物、苯并噻唑硫代脂肪酸系衍生物的反应,对没有被所述抗蚀剂覆盖的部分赋予粘着性。
9.一种焊料电路基板,是采用权利要求1或2所述的焊料电路基板的制造方法制成的。
10.一种电子部件的安装方法,其特征在于,包括以下工序:
电子部件载置工序,该工序将电子部件载置于权利要求9所述的焊料电路基板上;和
电子部件接合工序,该工序对所述焊料粉末进行回流焊而将所述电子部件的电极部分与所述焊料电路基板接合。
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EP (1) | EP2986089A4 (zh) |
JP (1) | JP6210619B2 (zh) |
KR (1) | KR20150132477A (zh) |
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US20150373845A1 (en) * | 2014-06-24 | 2015-12-24 | Panasonic Intellectual Property Management Co., Ltd. | Electronic component mounting structure and method of manufacturing electronic component mounting structure |
JP2017208485A (ja) * | 2016-05-19 | 2017-11-24 | 昭和電工株式会社 | 電子部品の実装方法 |
TWI632653B (zh) * | 2017-02-15 | 2018-08-11 | 財團法人工業技術研究院 | 電子封裝結構 |
US11114387B2 (en) | 2017-02-15 | 2021-09-07 | Industrial Technology Research Institute | Electronic packaging structure |
CN106937482A (zh) * | 2017-03-31 | 2017-07-07 | 柳州译海网络科技有限公司 | 一种节能减排的电子产品生产制造方法 |
US11127706B2 (en) * | 2018-09-28 | 2021-09-21 | Intel Corporation | Electronic package with stud bump electrical connections |
CN110504939A (zh) * | 2019-08-29 | 2019-11-26 | 北京康特睿科光电科技有限公司 | 一种晶体振荡器及其制造方法 |
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CN101569248A (zh) * | 2006-12-27 | 2009-10-28 | 昭和电工株式会社 | 制备导电电路板的方法 |
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US5159171A (en) * | 1991-09-03 | 1992-10-27 | Motorola, Inc. | Method and apparatus for solder laser printing |
US5556023A (en) * | 1992-10-30 | 1996-09-17 | Showa Denko K.K. | Method of forming solder film |
US6476487B2 (en) * | 1992-10-30 | 2002-11-05 | Showa Denko K.K. | Solder circuit |
JP2592757B2 (ja) * | 1992-10-30 | 1997-03-19 | 昭和電工株式会社 | はんだ回路基板及びその形成方法 |
JP2681738B2 (ja) * | 1993-05-12 | 1997-11-26 | 昭和電工株式会社 | 連続的はんだ回路形成法 |
JPH0794853A (ja) * | 1993-09-25 | 1995-04-07 | Tanaka Kikinzoku Kogyo Kk | プリント配線板の金属端子上への半田コーティング方法 |
JP3563500B2 (ja) * | 1995-08-14 | 2004-09-08 | 昭和電工株式会社 | 粉末はんだ付きシート及びはんだ回路の形成方法 |
JPH11103155A (ja) * | 1997-09-29 | 1999-04-13 | Matsushita Electric Works Ltd | ハンダバンプ形成方法 |
JP4087876B2 (ja) * | 1998-08-10 | 2008-05-21 | 富士通株式会社 | ハンダバンプの形成方法 |
JP3678048B2 (ja) * | 1999-04-05 | 2005-08-03 | 松下電器産業株式会社 | 半田プリコート方法および半田プリコート基板 |
JP3819806B2 (ja) * | 2002-05-17 | 2006-09-13 | 富士通株式会社 | バンプ電極付き電子部品およびその製造方法 |
JP4576270B2 (ja) * | 2005-03-29 | 2010-11-04 | 昭和電工株式会社 | ハンダ回路基板の製造方法 |
US20090041990A1 (en) * | 2005-09-09 | 2009-02-12 | Showa Denko K.K. | Method for attachment of solder powder to electronic circuit board and soldered electronic circuit board |
JP5093766B2 (ja) * | 2007-01-31 | 2012-12-12 | 株式会社タムラ製作所 | 導電性ボール等搭載半導体パッケージ基板の製造方法 |
JP5187341B2 (ja) * | 2010-04-14 | 2013-04-24 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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EP2986089A4 (en) | 2017-02-01 |
WO2014168175A1 (ja) | 2014-10-16 |
US20160219721A1 (en) | 2016-07-28 |
CN105122957A (zh) | 2015-12-02 |
KR20150132477A (ko) | 2015-11-25 |
EP2986089A1 (en) | 2016-02-17 |
JP6210619B2 (ja) | 2017-10-11 |
JP2014204070A (ja) | 2014-10-27 |
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