JP2011207878A5 - - Google Patents
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- JP2011207878A5 JP2011207878A5 JP2011055906A JP2011055906A JP2011207878A5 JP 2011207878 A5 JP2011207878 A5 JP 2011207878A5 JP 2011055906 A JP2011055906 A JP 2011055906A JP 2011055906 A JP2011055906 A JP 2011055906A JP 2011207878 A5 JP2011207878 A5 JP 2011207878A5
- Authority
- JP
- Japan
- Prior art keywords
- ester
- mercapto
- sulfonic acid
- acid
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000000217 alkyl group Chemical group 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- -1 3-mercapto-propylsulfonic acid- (3-sulfopropyl) 3-mercapto-propyl sulfonic acid sodium salt Chemical compound 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000004404 heteroalkyl group Chemical group 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- PSBDWGZCVUAZQS-UHFFFAOYSA-N (dimethylsulfonio)acetate Chemical compound C[S+](C)CC([O-])=O PSBDWGZCVUAZQS-UHFFFAOYSA-N 0.000 description 1
- MHGUSQPDQPUNQD-UHFFFAOYSA-N 2-(2,2-disulfoethyldisulfanyl)ethane-1,1-disulfonic acid Chemical compound OS(=O)(=O)C(S(O)(=O)=O)CSSCC(S(O)(=O)=O)S(O)(=O)=O MHGUSQPDQPUNQD-UHFFFAOYSA-N 0.000 description 1
- YXEXMVJHQLWNGG-UHFFFAOYSA-N 3-(3,3-disulfopropyldisulfanyl)propane-1,1-disulfonic acid Chemical compound OS(=O)(=O)C(S(O)(=O)=O)CCSSCCC(S(O)(=O)=O)S(O)(=O)=O YXEXMVJHQLWNGG-UHFFFAOYSA-N 0.000 description 1
- WRBSVISDQAINGQ-UHFFFAOYSA-N 3-(dimethylcarbamothioylsulfanyl)propane-1-sulfonic acid Chemical compound CN(C)C(=S)SCCCS(O)(=O)=O WRBSVISDQAINGQ-UHFFFAOYSA-N 0.000 description 1
- REEBJQTUIJTGAL-UHFFFAOYSA-N 3-pyridin-1-ium-1-ylpropane-1-sulfonate Chemical compound [O-]S(=O)(=O)CCC[N+]1=CC=CC=C1 REEBJQTUIJTGAL-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 125000001164 benzothiazolyl group Chemical group S1C(=NC2=C1C=CC=C2)* 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- SOUPVZCONBCBGI-UHFFFAOYSA-M potassium;3-sulfanylpropane-1-sulfonate Chemical compound [K+].[O-]S(=O)(=O)CCCS SOUPVZCONBCBGI-UHFFFAOYSA-M 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- KQFAFFYKLIBKDE-UHFFFAOYSA-M sodium;ethanesulfonate Chemical compound [Na+].CCS([O-])(=O)=O KQFAFFYKLIBKDE-UHFFFAOYSA-M 0.000 description 1
- NPAWNPCNZAPTKA-UHFFFAOYSA-M sodium;propane-1-sulfonate Chemical compound [Na+].CCCS([O-])(=O)=O NPAWNPCNZAPTKA-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Chemical group 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- 229940117986 sulfobetaine Drugs 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/661312 | 2010-03-15 | ||
| US12/661,312 US8268157B2 (en) | 2010-03-15 | 2010-03-15 | Plating bath and method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016210569A Division JP2017061487A (ja) | 2010-03-15 | 2016-10-27 | めっき浴および方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011207878A JP2011207878A (ja) | 2011-10-20 |
| JP2011207878A5 true JP2011207878A5 (enExample) | 2016-04-14 |
Family
ID=43984121
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011055906A Withdrawn JP2011207878A (ja) | 2010-03-15 | 2011-03-14 | めっき浴および方法 |
| JP2016210569A Pending JP2017061487A (ja) | 2010-03-15 | 2016-10-27 | めっき浴および方法 |
| JP2018207674A Active JP6797166B2 (ja) | 2010-03-15 | 2018-11-02 | めっき浴および方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016210569A Pending JP2017061487A (ja) | 2010-03-15 | 2016-10-27 | めっき浴および方法 |
| JP2018207674A Active JP6797166B2 (ja) | 2010-03-15 | 2018-11-02 | めっき浴および方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8268157B2 (enExample) |
| EP (1) | EP2366686B1 (enExample) |
| JP (3) | JP2011207878A (enExample) |
| KR (1) | KR101739417B1 (enExample) |
| CN (1) | CN102276796B (enExample) |
| TW (1) | TWI428329B (enExample) |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8262895B2 (en) * | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US20110220512A1 (en) * | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US9321741B2 (en) * | 2010-04-30 | 2016-04-26 | Jcu Corporation | Copper plating bath containing a tertiary amine compound and use thereof |
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| JP5952093B2 (ja) | 2012-05-31 | 2016-07-13 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
| JP6027613B2 (ja) | 2012-07-09 | 2016-11-16 | 四国化成工業株式会社 | 銅被膜形成剤及び銅被膜の形成方法 |
| CN103400906B (zh) * | 2012-08-28 | 2015-11-25 | 夏洋 | 一种晶硅太阳能电池栅线的仿生制备方法 |
| US10584261B2 (en) * | 2012-12-14 | 2020-03-10 | Blue Cube Ip Llc | High solids epoxy coatings |
| KR20140092626A (ko) | 2013-01-16 | 2014-07-24 | 삼성전자주식회사 | 구리 전해 도금액, 구리 도금 장치 및 이를 이용한 구리 범프 형성 방법 |
| US20140238868A1 (en) | 2013-02-25 | 2014-08-28 | Dow Global Technologies Llc | Electroplating bath |
| US9598787B2 (en) * | 2013-03-14 | 2017-03-21 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes |
| EP3068819B1 (en) | 2013-11-06 | 2019-03-27 | Rohm and Haas Electronic Materials LLC | Nitrogen containing polymers as levelers |
| US9403762B2 (en) * | 2013-11-21 | 2016-08-02 | Rohm And Haas Electronic Materials Llc | Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens |
| US9783903B2 (en) * | 2013-12-06 | 2017-10-10 | Rohm And Haas Electronic Materials Llc | Additives for electroplating baths |
| DE102013226297B3 (de) * | 2013-12-17 | 2015-03-26 | Umicore Galvanotechnik Gmbh | Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen |
| US9273407B2 (en) * | 2014-03-17 | 2016-03-01 | Hong Kong Applied Science and Technology Research Institute Company Limited | Additive for electrodeposition |
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| WO2015162775A1 (ja) * | 2014-04-25 | 2015-10-29 | 株式会社Ｊｃｕ | 銅の高速充填方法 |
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| US9783905B2 (en) | 2014-12-30 | 2017-10-10 | Rohm and Haas Electronic Mateirals LLC | Reaction products of amino acids and epoxies |
| US9611560B2 (en) * | 2014-12-30 | 2017-04-04 | Rohm And Haas Electronic Materials Llc | Sulfonamide based polymers for copper electroplating |
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| KR102426521B1 (ko) * | 2015-04-20 | 2022-07-27 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 전해 구리 도금 배쓰 조성물 및 그 사용 방법 |
| CN105018977B (zh) * | 2015-07-17 | 2017-09-12 | 深圳市板明科技有限公司 | 一种填孔电镀整平剂、制备方法及应用该整平剂的电镀液 |
| CN105002527B (zh) * | 2015-07-31 | 2017-06-16 | 广东光华科技股份有限公司 | 整平剂溶液及其制备方法和应用 |
| TWI608132B (zh) * | 2015-08-06 | 2017-12-11 | 羅門哈斯電子材料有限公司 | 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法 |
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| JP6684354B2 (ja) * | 2015-10-08 | 2020-04-22 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | アミンとポリアクリルアミドとの反応生成物の化合物を含有する銅電気めっき浴 |
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| US10718059B2 (en) * | 2017-07-10 | 2020-07-21 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions with cationic polymers and methods of electroplating nickel |
| CN107313082B (zh) * | 2017-07-25 | 2018-08-17 | 上海新阳半导体材料股份有限公司 | 整平剂、含其的金属电镀组合物、制备方法及应用 |
| US20190136397A1 (en) * | 2017-11-08 | 2019-05-09 | Rohm And Haas Electronic Materials Llc | Electroplated copper |
| CN109989077A (zh) * | 2017-12-29 | 2019-07-09 | 广东东硕科技有限公司 | 一种铜镀液 |
| CN109989076A (zh) * | 2017-12-29 | 2019-07-09 | 广东东硕科技有限公司 | 一种整平剂 |
| WO2019135991A1 (en) | 2018-01-03 | 2019-07-11 | Ecolab Usa Inc. | Benzotriazole derivatives as corrosion inhibitors |
| JP7208913B2 (ja) * | 2018-08-28 | 2023-01-19 | 株式会社Jcu | 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法 |
| CN110129841B (zh) * | 2019-06-17 | 2021-04-27 | 广东东硕科技有限公司 | 整平剂及包含其的电镀液 |
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| JP7808062B2 (ja) * | 2021-02-15 | 2026-01-28 | 株式会社Adeka | 電解めっき液用添加剤、電解めっき液、電解めっき方法及び金属層の製造方法 |
| CN113463142B (zh) * | 2021-06-03 | 2022-06-14 | 广东硕成科技股份有限公司 | 一种电镀填孔组合物及其电镀填孔方法 |
| KR102339868B1 (ko) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물 |
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| CN115894908B (zh) * | 2021-09-30 | 2025-06-06 | 华为技术有限公司 | 聚合物、整平剂及其制备方法、电镀液和电镀方法 |
| CN113802158B (zh) * | 2021-10-21 | 2023-06-20 | 东莞市康迈克电子材料有限公司 | 一种电镀液及其应用、镀铜工艺及镀件 |
| CN113737232B (zh) * | 2021-11-08 | 2022-01-11 | 深圳市板明科技股份有限公司 | 一种线路板通孔电镀铜整平剂及其应用、制备方法 |
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| US6610192B1 (en) * | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
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| JP4183999B2 (ja) * | 2002-07-29 | 2008-11-19 | 日鉱金属株式会社 | イミダゾールアルコールを有効成分とする表面処理剤 |
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| TW200613586A (en) * | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
| EP1741804B1 (en) * | 2005-07-08 | 2016-04-27 | Rohm and Haas Electronic Materials, L.L.C. | Electrolytic copper plating method |
| US7662981B2 (en) * | 2005-07-16 | 2010-02-16 | Rohm And Haas Electronic Materials Llc | Leveler compounds |
| JP5497261B2 (ja) | 2006-12-15 | 2014-05-21 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | インジウム組成物 |
| JP2008266722A (ja) | 2007-04-20 | 2008-11-06 | Ebara Udylite Kk | パルス銅めっき浴用添加剤およびこれを用いたパルス銅めっき浴 |
| PL2130948T3 (pl) * | 2008-06-02 | 2011-05-31 | Atotech Deutschland Gmbh | Kąpiel zawierająca pirofosforany do bezcyjankowego osadzania stopów miedź-cyna |
| JP2010018885A (ja) * | 2008-06-12 | 2010-01-28 | Furukawa Electric Co Ltd:The | 電解銅皮膜、その製造方法及び銅電解皮膜製造用の銅電解液 |
| JP2010202526A (ja) * | 2009-02-27 | 2010-09-16 | Toray Ind Inc | Ｃ型肝炎ウイルスの宿主細胞への侵入阻害剤及びこれを含有する医薬組成物 |
| US8262895B2 (en) * | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US20110220512A1 (en) * | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
-
2010
- 2010-03-15 US US12/661,312 patent/US8268157B2/en active Active
-
2011
- 2011-03-14 JP JP2011055906A patent/JP2011207878A/ja not_active Withdrawn
- 2011-03-15 EP EP11158232.6A patent/EP2366686B1/en not_active Not-in-force
- 2011-03-15 TW TW100108654A patent/TWI428329B/zh active
- 2011-03-15 CN CN2011101213393A patent/CN102276796B/zh active Active
- 2011-03-15 KR KR1020110023077A patent/KR101739417B1/ko active Active
-
2016
- 2016-10-27 JP JP2016210569A patent/JP2017061487A/ja active Pending
-
2018
- 2018-11-02 JP JP2018207674A patent/JP6797166B2/ja active Active
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