JP2011207878A5 - - Google Patents
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- JP2011207878A5 JP2011207878A5 JP2011055906A JP2011055906A JP2011207878A5 JP 2011207878 A5 JP2011207878 A5 JP 2011207878A5 JP 2011055906 A JP2011055906 A JP 2011055906A JP 2011055906 A JP2011055906 A JP 2011055906A JP 2011207878 A5 JP2011207878 A5 JP 2011207878A5
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- JP
- Japan
- Prior art keywords
- ester
- mercapto
- sulfonic acid
- acid
- alkyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000000217 alkyl group Chemical group 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- -1 3-mercapto-propylsulfonic acid- (3-sulfopropyl) 3-mercapto-propyl sulfonic acid sodium salt Chemical compound 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000004404 heteroalkyl group Chemical group 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- PSBDWGZCVUAZQS-UHFFFAOYSA-N (dimethylsulfonio)acetate Chemical compound C[S+](C)CC([O-])=O PSBDWGZCVUAZQS-UHFFFAOYSA-N 0.000 description 1
- MHGUSQPDQPUNQD-UHFFFAOYSA-N 2-(2,2-disulfoethyldisulfanyl)ethane-1,1-disulfonic acid Chemical compound OS(=O)(=O)C(S(O)(=O)=O)CSSCC(S(O)(=O)=O)S(O)(=O)=O MHGUSQPDQPUNQD-UHFFFAOYSA-N 0.000 description 1
- YXEXMVJHQLWNGG-UHFFFAOYSA-N 3-(3,3-disulfopropyldisulfanyl)propane-1,1-disulfonic acid Chemical compound OS(=O)(=O)C(S(O)(=O)=O)CCSSCCC(S(O)(=O)=O)S(O)(=O)=O YXEXMVJHQLWNGG-UHFFFAOYSA-N 0.000 description 1
- WRBSVISDQAINGQ-UHFFFAOYSA-N 3-(dimethylcarbamothioylsulfanyl)propane-1-sulfonic acid Chemical compound CN(C)C(=S)SCCCS(O)(=O)=O WRBSVISDQAINGQ-UHFFFAOYSA-N 0.000 description 1
- REEBJQTUIJTGAL-UHFFFAOYSA-N 3-pyridin-1-ium-1-ylpropane-1-sulfonate Chemical compound [O-]S(=O)(=O)CCC[N+]1=CC=CC=C1 REEBJQTUIJTGAL-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 125000001164 benzothiazolyl group Chemical group S1C(=NC2=C1C=CC=C2)* 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- SOUPVZCONBCBGI-UHFFFAOYSA-M potassium;3-sulfanylpropane-1-sulfonate Chemical compound [K+].[O-]S(=O)(=O)CCCS SOUPVZCONBCBGI-UHFFFAOYSA-M 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- KQFAFFYKLIBKDE-UHFFFAOYSA-M sodium;ethanesulfonate Chemical compound [Na+].CCS([O-])(=O)=O KQFAFFYKLIBKDE-UHFFFAOYSA-M 0.000 description 1
- NPAWNPCNZAPTKA-UHFFFAOYSA-M sodium;propane-1-sulfonate Chemical compound [Na+].CCCS([O-])(=O)=O NPAWNPCNZAPTKA-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Chemical group 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 125000003107 substituted aryl group Chemical group 0.000 description 1
- 229940117986 sulfobetaine Drugs 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
Description
本めっき浴は典型的には促進剤を含む。（光沢剤とも称される）あらゆる促進剤が本発明における使用に好適である。このような促進剤は当業者に周知である。典型的な促進剤は１以上の硫黄原子を含み、かつ１０００以下の分子量を有する。スルフィドおよび／またはスルホン酸基を有する促進剤化合物が一般的に好ましく、特に、式：Ｒ’−Ｓ−Ｒ−ＳＯ３Ｘ（式中、Ｒは場合によって置換されたアルキル、場合によって置換されたヘテロアルキル、場合によって置換されたアリールまたは場合によって置換された複素環式基；Ｘは対イオン、例えば、ナトリウムもしくはカリウム；並びに、Ｒ’は水素もしくは化学結合である）のグループを含む化合物が好ましい。典型的には、アルキル基は（Ｃ１−Ｃ１６）アルキルおよび好ましくは（Ｃ３−Ｃ１２）アルキルである。ヘテロアルキル基は、典型的には、１以上のヘテロ原子、例えば、窒素、硫黄もしくは酸素をアルキル鎖内に有する。好適なアリール基には、これに限定されないが、フェニル、ベンジル、ビフェニルおよびナフチルが挙げられる。好適な複素環式基は、典型的には、１〜３個のヘテロ原子、例えば、窒素、硫黄もしくは酸素を含み、１〜３つの別々のもしくは縮合した環システムを含む。このような複素環式基は芳香族もしくは非芳香族であることができる。本発明における使用に好ましい具体的な促進剤には、これに限定されないが、Ｎ，Ｎ−ジメチル−ジチオカルバミン酸−（３−スルホプロピル）エステル；３−メルカプト−プロピルスルホン酸−（３−スルホプロピル）エステル；３−メルカプト−プロピルスルホン酸ナトリウム塩；３−メルカプト−１−プロパンスルホン酸カリウム塩との炭酸−ジチオ−ｏ−エチルエステル−ｓ−エステル；ビス−スルホプロピルジスルフィド；３−（ベンゾチアゾリル−ｓ−チオ）プロピルスルホン酸ナトリウム塩；ピリジニウムプロピルスルホベタイン；１−ナトリウム−３−メルカプトプロパン−１−スルホナート；Ｎ，Ｎ−ジメチル−ジチオカルバミン酸−（３−スルホエチル）エステル；３−メルカプト−エチルプロピルスルホン酸−（３−スルホエチル）エステル；３−メルカプト−エチルスルホン酸ナトリウム塩；３−メルカプト−１−エタンスルホン酸カリウム塩との炭酸−ジチオ−ｏ−エチルエステル−ｓ−エステル；ビス−スルホエチルジスルフィド；３−（ベンゾチアゾリル−ｓ−チオ）エチルスルホン酸ナトリウム塩；ピリジニウムエチルスルホベタイン；および、１−ナトリウム−３−メルカプトエタン−１−スルホナートが挙げられる。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/661312 | 2010-03-15 | ||
| US12/661,312 US8268157B2 (en) | 2010-03-15 | 2010-03-15 | Plating bath and method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016210569A Division JP2017061487A (ja) | 2010-03-15 | 2016-10-27 | めっき浴および方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011207878A JP2011207878A (ja) | 2011-10-20 |
| JP2011207878A5 true JP2011207878A5 (ja) | 2016-04-14 |
Family
ID=43984121
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011055906A Withdrawn JP2011207878A (ja) | 2010-03-15 | 2011-03-14 | めっき浴および方法 |
| JP2016210569A Pending JP2017061487A (ja) | 2010-03-15 | 2016-10-27 | めっき浴および方法 |
| JP2018207674A Active JP6797166B2 (ja) | 2010-03-15 | 2018-11-02 | めっき浴および方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016210569A Pending JP2017061487A (ja) | 2010-03-15 | 2016-10-27 | めっき浴および方法 |
| JP2018207674A Active JP6797166B2 (ja) | 2010-03-15 | 2018-11-02 | めっき浴および方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8268157B2 (ja) |
| EP (1) | EP2366686B1 (ja) |
| JP (3) | JP2011207878A (ja) |
| KR (1) | KR101739417B1 (ja) |
| CN (1) | CN102276796B (ja) |
| TW (1) | TWI428329B (ja) |
Families Citing this family (53)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8262895B2 (en) * | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US20110220512A1 (en) * | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US9321741B2 (en) * | 2010-04-30 | 2016-04-26 | Jcu Corporation | Copper plating bath containing a tertiary amine compound and use thereof |
| US8454815B2 (en) | 2011-10-24 | 2013-06-04 | Rohm And Haas Electronics Materials Llc | Plating bath and method |
| JP5952093B2 (ja) | 2012-05-31 | 2016-07-13 | ローム・アンド・ハース電子材料株式会社 | 電解銅めっき液及び電解銅めっき方法 |
| KR102086501B1 (ko) * | 2012-07-09 | 2020-03-09 | 시코쿠가세이고교가부시키가이샤 | 구리 피막 형성제 및 구리 피막의 형성 방법 |
| CN103400906B (zh) * | 2012-08-28 | 2015-11-25 | 夏洋 | 一种晶硅太阳能电池栅线的仿生制备方法 |
| EP2931822B1 (en) * | 2012-12-14 | 2021-06-23 | Blue Cube IP LLC | High solids epoxy coatings |
| KR20140092626A (ko) | 2013-01-16 | 2014-07-24 | 삼성전자주식회사 | 구리 전해 도금액, 구리 도금 장치 및 이를 이용한 구리 범프 형성 방법 |
| US20140238868A1 (en) | 2013-02-25 | 2014-08-28 | Dow Global Technologies Llc | Electroplating bath |
| US9598787B2 (en) * | 2013-03-14 | 2017-03-21 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes |
| EP3068819B1 (en) | 2013-11-06 | 2019-03-27 | Rohm and Haas Electronic Materials LLC | Nitrogen containing polymers as levelers |
| US9403762B2 (en) * | 2013-11-21 | 2016-08-02 | Rohm And Haas Electronic Materials Llc | Reaction products of guanidine compounds or salts thereof, polyepoxides and polyhalogens |
| US9783903B2 (en) * | 2013-12-06 | 2017-10-10 | Rohm And Haas Electronic Materials Llc | Additives for electroplating baths |
| DE102013226297B3 (de) * | 2013-12-17 | 2015-03-26 | Umicore Galvanotechnik Gmbh | Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen |
| US9273407B2 (en) | 2014-03-17 | 2016-03-01 | Hong Kong Applied Science and Technology Research Institute Company Limited | Additive for electrodeposition |
| US9439294B2 (en) | 2014-04-16 | 2016-09-06 | Rohm And Haas Electronic Materials Llc | Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens |
| CN106574390A (zh) * | 2014-04-25 | 2017-04-19 | 株式会社杰希优 | 铜的高速填充方法 |
| US9809891B2 (en) | 2014-06-30 | 2017-11-07 | Rohm And Haas Electronic Materials Llc | Plating method |
| US9611560B2 (en) | 2014-12-30 | 2017-04-04 | Rohm And Haas Electronic Materials Llc | Sulfonamide based polymers for copper electroplating |
| US9725816B2 (en) | 2014-12-30 | 2017-08-08 | Rohm And Haas Electronic Materials Llc | Amino sulfonic acid based polymers for copper electroplating |
| US9783905B2 (en) | 2014-12-30 | 2017-10-10 | Rohm and Haas Electronic Mateirals LLC | Reaction products of amino acids and epoxies |
| CN107771227B (zh) * | 2015-04-20 | 2019-04-02 | 埃托特克德国有限公司 | 电解铜镀液组合物及其用法 |
| CN105018977B (zh) * | 2015-07-17 | 2017-09-12 | 深圳市板明科技有限公司 | 一种填孔电镀整平剂、制备方法及应用该整平剂的电镀液 |
| CN105002527B (zh) * | 2015-07-31 | 2017-06-16 | 广东光华科技股份有限公司 | 整平剂溶液及其制备方法和应用 |
| US9932684B2 (en) | 2015-08-06 | 2018-04-03 | Rohm And Haas Electronic Materials Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides |
| TWI608132B (zh) * | 2015-08-06 | 2017-12-11 | 羅門哈斯電子材料有限公司 | 自含有吡啶基烷基胺及雙環氧化物之反應產物的銅電鍍覆浴液電鍍覆光阻劑限定之特徵的方法 |
| US10100421B2 (en) * | 2015-08-06 | 2018-10-16 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds |
| US10006136B2 (en) | 2015-08-06 | 2018-06-26 | Dow Global Technologies Llc | Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds |
| KR102125234B1 (ko) * | 2015-10-08 | 2020-06-22 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | 아민과 폴리아크릴아미드의 반응 생성물의 화합물을 포함하는 구리 전기도금욕 |
| KR102127642B1 (ko) * | 2015-10-08 | 2020-06-29 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | 아민과 폴리아크릴아미드와 비스에폭시드의 반응 생성물을 함유하는 구리 전기도금욕 |
| US10988852B2 (en) | 2015-10-27 | 2021-04-27 | Rohm And Haas Electronic Materials Llc | Method of electroplating copper into a via on a substrate from an acid copper electroplating bath |
| US10519557B2 (en) * | 2016-02-12 | 2019-12-31 | Macdermid Enthone Inc. | Leveler compositions for use in copper deposition in manufacture of microelectronics |
| US10508357B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
| US10512174B2 (en) | 2016-02-15 | 2019-12-17 | Rohm And Haas Electronic Materials Llc | Method of filling through-holes to reduce voids and other defects |
| US10190228B2 (en) * | 2016-03-29 | 2019-01-29 | Rohm And Haas Electronic Materials Llc | Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features |
| WO2018033461A1 (en) * | 2016-08-15 | 2018-02-22 | Atotech Deutschland Gmbh | Acidic aqueous composition for electrolytic copper plating |
| US10718059B2 (en) * | 2017-07-10 | 2020-07-21 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions with cationic polymers and methods of electroplating nickel |
| CN107313082B (zh) | 2017-07-25 | 2018-08-17 | 上海新阳半导体材料股份有限公司 | 整平剂、含其的金属电镀组合物、制备方法及应用 |
| US20190136397A1 (en) * | 2017-11-08 | 2019-05-09 | Rohm And Haas Electronic Materials Llc | Electroplated copper |
| CN109989076A (zh) * | 2017-12-29 | 2019-07-09 | 广东东硕科技有限公司 | 一种整平剂 |
| CN109989077A (zh) * | 2017-12-29 | 2019-07-09 | 广东东硕科技有限公司 | 一种铜镀液 |
| WO2019135991A1 (en) | 2018-01-03 | 2019-07-11 | Ecolab Usa Inc. | Benzotriazole derivatives as corrosion inhibitors |
| JP7208913B2 (ja) * | 2018-08-28 | 2023-01-19 | 株式会社Jcu | 硫酸銅めっき液およびこれを用いた硫酸銅めっき方法 |
| CN110129841B (zh) * | 2019-06-17 | 2021-04-27 | 广东东硕科技有限公司 | 整平剂及包含其的电镀液 |
| CN111876799A (zh) * | 2020-07-07 | 2020-11-03 | 广东硕成科技有限公司 | 一种适用于背板孔金属化组合物及其孔金属化方法 |
| US20240132453A1 (en) * | 2021-02-15 | 2024-04-25 | Adeka Corporation | Additive for electroplating solution, electroplating solution, electroplating method, and method of producing metal layer |
| CN113463142B (zh) * | 2021-06-03 | 2022-06-14 | 广东硕成科技股份有限公司 | 一种电镀填孔组合物及其电镀填孔方法 |
| KR102339868B1 (ko) * | 2021-07-30 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물 |
| KR102339866B1 (ko) * | 2021-08-04 | 2021-12-16 | 와이엠티 주식회사 | 레벨링제 및 이를 포함하는 유리비아홀 기판 도금을 위한 전기도금 조성물 |
| CN115894908A (zh) * | 2021-09-30 | 2023-04-04 | 华为技术有限公司 | 聚合物、整平剂及其制备方法、电镀液和电镀方法 |
| CN113802158B (zh) * | 2021-10-21 | 2023-06-20 | 东莞市康迈克电子材料有限公司 | 一种电镀液及其应用、镀铜工艺及镀件 |
| CN113737232B (zh) * | 2021-11-08 | 2022-01-11 | 深圳市板明科技股份有限公司 | 一种线路板通孔电镀铜整平剂及其应用、制备方法 |
Family Cites Families (58)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL172828B (nl) * | 1951-10-03 | Degussa | Werkwijze voor het bereiden van katalysatoren voor de oxydatie van onverzadigde aldehyden tot onverzadigde carbonzuren en aldus gevormde katalysator. | |
| US3409590A (en) * | 1966-12-27 | 1968-11-05 | Shell Oil Co | Process for preparing epoxy-containing condensates, and resulting products |
| US4066625A (en) * | 1967-05-02 | 1978-01-03 | Amicon Corporation | Unitary curable resin compositions |
| FR1566468A (ja) * | 1968-03-04 | 1969-05-09 | ||
| DE2007968A1 (de) | 1970-01-16 | 1971-07-22 | R.T. Vanderbilt Company, Inc., New York, N.Y. (V.St.A.) | Propy lenoxid-Imidazol-Reaktionsprodukte, Verfahren zu ihrer Herstellung und ihre Verwendung als Hartungsmittel fur Epoxidharze |
| GB1307903A (en) * | 1970-03-24 | 1973-02-21 | Koninkl Pharmaceutische Fabrik | Phenyl naphthyl and tetrahydronaphthyl derivatives |
| GB1320453A (en) * | 1971-03-24 | 1973-06-13 | Biosedra Lab | Aromatic diethers |
| US3954575A (en) * | 1972-11-10 | 1976-05-04 | Dipsol Chemicals Co., Ltd. | Zinc electroplating |
| US3843667A (en) * | 1973-09-12 | 1974-10-22 | M Cupery | N-imidazole compounds and their complex metal derivatives |
| DE2525264C2 (de) * | 1975-06-04 | 1984-02-16 | Schering AG, 1000 Berlin und 4709 Bergkamen | Alkalisches cyanidfreies Zinkbad und Verfahren zur galvanischen Abscheidung von Zinküberzügen unter Verwendung dieses Bades |
| SU535301A1 (ru) | 1975-07-08 | 1976-11-15 | Днепропетровский Ордена Трудового Красного Знамени Государственный Университет Им.300-Летия Воссоединения Украины С Россией | Производные 1,2-диалкилбензимидазола, про вл ющие гипотензивное действие |
| US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
| US4024083A (en) * | 1976-03-08 | 1977-05-17 | Texaco Inc. | Substituted phenoxy propanol diamines and amino alcohol detergent additives for fuels and mineral oils |
| US4038171A (en) * | 1976-03-31 | 1977-07-26 | Battelle Memorial Institute | Supported plasma sputtering apparatus for high deposition rate over large area |
| DE2725930C2 (de) | 1976-06-12 | 1986-06-12 | Mitsubishi Petrochemical Co., Ltd., Tokio/Tokyo | Verfahren zur Herstellung eines Anionenaustauscherharzes und Verwendung derselben zur Herstellung einer Anionenaustauschermembran |
| AU507206B2 (en) * | 1976-08-18 | 1980-02-07 | Celanese Polymer Specialities Company | Modified epoxy resins |
| BE857754A (fr) * | 1976-08-18 | 1978-02-13 | Celanese Polymer Special Co | Composition de resine pour revetements, notamment par electrodeposition cathodique |
| US4211725A (en) * | 1977-11-10 | 1980-07-08 | Milliken Research Corporation | Nitrogen containing compositions |
| US4169772A (en) * | 1978-11-06 | 1979-10-02 | R. O. Hull & Company, Inc. | Acid zinc plating baths, compositions useful therein, and methods for electrodepositing bright zinc deposits |
| CA1151182A (en) | 1979-08-10 | 1983-08-02 | Marvin L. Kaufman | Chemically modified imidazole curing catalysts for epoxy resins and powder coatings containing them |
| US4397717A (en) * | 1981-02-10 | 1983-08-09 | Elektro-Brite Gmbh & Co. Kg. | Alkaline zinc electroplating bath with or without cyanide content |
| CH646956A5 (de) * | 1981-12-15 | 1984-12-28 | Ciba Geigy Ag | Imidazolide. |
| JPS58147416A (ja) * | 1982-02-26 | 1983-09-02 | Hitachi Ltd | エポキシ樹脂組成物 |
| JPS59128291A (ja) * | 1983-01-06 | 1984-07-24 | 日産自動車株式会社 | ポリジエン系コンポジツト推進薬の粘結剤 |
| DE3467803D1 (en) * | 1983-11-09 | 1988-01-07 | Ciba Geigy Ag | Method of lining the insides of pipes or parts of pipes |
| US5026872A (en) * | 1984-02-01 | 1991-06-25 | American Cyanamid | Aromatic ether-ketone polyamines, intermediates and products, and methods for preparing same |
| US4536261A (en) * | 1984-08-07 | 1985-08-20 | Francine Popescu | Alkaline bath for the electrodeposition of bright zinc |
| JPS61286369A (ja) | 1985-06-11 | 1986-12-16 | Shikoku Chem Corp | ２―フェニル―４，５―ジベンジルイミダゾール及び該化合物の合成方法 |
| US4730022A (en) * | 1987-03-06 | 1988-03-08 | Mcgean-Rohco, Inc. | Polymer compositions and alkaline zinc electroplating baths |
| US4792383A (en) * | 1987-10-27 | 1988-12-20 | Mcgean-Rohco, Inc. | Polymer compositions and alkaline zinc electroplating baths and processes |
| JPH01219188A (ja) * | 1988-02-26 | 1989-09-01 | Okuno Seiyaku Kogyo Kk | 亜鉛−ニッケル合金めっき浴 |
| DE4010548A1 (de) * | 1990-04-02 | 1991-10-10 | Schering Ag | Imidazolylderivate, ihre verwendung als haertungsmittel in epoxidharzzusammensetzungen, sie enthaltende haertbare epoxidharzzusammensetzungen und epoxidharzformkoerper |
| JPH03277631A (ja) | 1990-08-31 | 1991-12-09 | Mitsubishi Petrochem Co Ltd | 新規な高分子四級塩の製造方法 |
| SU1743158A1 (ru) | 1990-09-04 | 1998-02-20 | Институт физико-органической химии и углехимии АН УССР | 1-глицидилимидазолы в качестве соотвердителей эпоксидных смол |
| JPH07228572A (ja) | 1994-02-18 | 1995-08-29 | Japan Energy Corp | 新規ベンズイミダゾールフッ素誘導体及びその製造方法並びにそれを用いる金属表面処理剤 |
| US5607570A (en) * | 1994-10-31 | 1997-03-04 | Rohbani; Elias | Electroplating solution |
| JPH1030015A (ja) | 1996-07-15 | 1998-02-03 | Kansai Paint Co Ltd | エポキシ樹脂用硬化触媒及びそれを用いてなる熱硬化性塗料組成物 |
| ES2154013T3 (es) | 1997-10-02 | 2001-03-16 | Hexcel Corp | Agentes de curado para resinas epoxidicas. |
| KR100659544B1 (ko) * | 1999-11-12 | 2006-12-19 | 에바라 유지라이토 코포레이션 리미티드 | 비아 필링 방법 |
| US6610192B1 (en) * | 2000-11-02 | 2003-08-26 | Shipley Company, L.L.C. | Copper electroplating |
| US6515237B2 (en) * | 2000-11-24 | 2003-02-04 | Hitachi Chemical Company, Ltd. | Through-hole wiring board |
| US6800188B2 (en) * | 2001-05-09 | 2004-10-05 | Ebara-Udylite Co., Ltd. | Copper plating bath and plating method for substrate using the copper plating bath |
| KR20030094098A (ko) * | 2002-06-03 | 2003-12-11 | 쉬플리 캄파니, 엘.엘.씨. | 평탄화제 화합물 |
| JP4249438B2 (ja) * | 2002-07-05 | 2009-04-02 | 日本ニュークローム株式会社 | 銅―錫合金めっき用ピロリン酸浴 |
| JP3789107B2 (ja) * | 2002-07-23 | 2006-06-21 | 株式会社日鉱マテリアルズ | 特定骨格を有するアミン化合物及び有機硫黄化合物を添加剤として含む銅電解液並びにそれにより製造される電解銅箔 |
| JP4183999B2 (ja) * | 2002-07-29 | 2008-11-19 | 日鉱金属株式会社 | イミダゾールアルコールを有効成分とする表面処理剤 |
| US7128822B2 (en) * | 2003-06-04 | 2006-10-31 | Shipley Company, L.L.C. | Leveler compounds |
| JP4583373B2 (ja) * | 2004-03-31 | 2010-11-17 | 旭化成イーマテリアルズ株式会社 | エポキシ樹脂用硬化剤及びエポキシ樹脂組成物 |
| TW200613586A (en) | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
| EP1741804B1 (en) | 2005-07-08 | 2016-04-27 | Rohm and Haas Electronic Materials, L.L.C. | Electrolytic copper plating method |
| US7662981B2 (en) * | 2005-07-16 | 2010-02-16 | Rohm And Haas Electronic Materials Llc | Leveler compounds |
| JP5497261B2 (ja) | 2006-12-15 | 2014-05-21 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | インジウム組成物 |
| JP2008266722A (ja) | 2007-04-20 | 2008-11-06 | Ebara Udylite Kk | パルス銅めっき浴用添加剤およびこれを用いたパルス銅めっき浴 |
| PL2130948T3 (pl) * | 2008-06-02 | 2011-05-31 | Atotech Deutschland Gmbh | Kąpiel zawierająca pirofosforany do bezcyjankowego osadzania stopów miedź-cyna |
| JP2010018885A (ja) * | 2008-06-12 | 2010-01-28 | Furukawa Electric Co Ltd:The | 電解銅皮膜、その製造方法及び銅電解皮膜製造用の銅電解液 |
| JP2010202526A (ja) * | 2009-02-27 | 2010-09-16 | Toray Ind Inc | Ｃ型肝炎ウイルスの宿主細胞への侵入阻害剤及びこれを含有する医薬組成物 |
| US8262895B2 (en) * | 2010-03-15 | 2012-09-11 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
| US20110220512A1 (en) * | 2010-03-15 | 2011-09-15 | Rohm And Haas Electronic Materials Llc | Plating bath and method |
-
2010
- 2010-03-15 US US12/661,312 patent/US8268157B2/en active Active
-
2011
- 2011-03-14 JP JP2011055906A patent/JP2011207878A/ja not_active Withdrawn
- 2011-03-15 CN CN2011101213393A patent/CN102276796B/zh active Active
- 2011-03-15 KR KR1020110023077A patent/KR101739417B1/ko active IP Right Grant
- 2011-03-15 EP EP11158232.6A patent/EP2366686B1/en active Active
- 2011-03-15 TW TW100108654A patent/TWI428329B/zh active
-
2016
- 2016-10-27 JP JP2016210569A patent/JP2017061487A/ja active Pending
-
2018
- 2018-11-02 JP JP2018207674A patent/JP6797166B2/ja active Active
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