JP2011159959A - 薄膜形成方法、表示板用金属配線、及びこれを含む薄膜トランジスタ表示板とその製造方法 - Google Patents
薄膜形成方法、表示板用金属配線、及びこれを含む薄膜トランジスタ表示板とその製造方法 Download PDFInfo
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- 239000010409 thin film Substances 0.000 title claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 36
- 239000002184 metal Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000010410 layer Substances 0.000 claims abstract description 129
- 239000010949 copper Substances 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000010936 titanium Substances 0.000 claims abstract description 19
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 17
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 12
- 239000011733 molybdenum Substances 0.000 claims abstract description 12
- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 12
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000004544 sputter deposition Methods 0.000 claims abstract description 11
- 239000011261 inert gas Substances 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 96
- 230000004888 barrier function Effects 0.000 claims description 79
- 239000004065 semiconductor Substances 0.000 claims description 26
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 230000001681 protective effect Effects 0.000 claims description 8
- 230000003746 surface roughness Effects 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 abstract description 5
- 230000001965 increasing effect Effects 0.000 abstract description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 description 33
- 238000005530 etching Methods 0.000 description 8
- 238000001887 electron backscatter diffraction Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
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- 238000007740 vapor deposition Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- JUZTWRXHHZRLED-UHFFFAOYSA-N [Si].[Cu].[Cu].[Cu].[Cu].[Cu] Chemical compound [Si].[Cu].[Cu].[Cu].[Cu].[Cu] JUZTWRXHHZRLED-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910021360 copper silicide Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
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Abstract
【解決手段】本発明の薄膜形成方法は、基板上にスパッタリング方法により薄膜を形成する方法であって、薄膜は、電力密度が1.5〜3W/cm2、非活性気体の圧力が0.2〜0.3Paで形成する。薄膜は、非晶質構造を有することができ、チタニウム、タンタル、又はモリブデンのうちのいずれか一つで形成することができる。
【選択図】図1
Description
前記薄膜は非晶質構造を有することができ、前記薄膜は、チタニウム、タンタル、又はモリブデンのうちのいずれか一つで形成することができる。
前記薄膜の表面粗度(Rms)は、0.55nm以下に形成することができる。
前記非活性気体は、アルゴン又はヘリウムとすることができる。
前記基板はガラス基板とすることができ、バリア層の表面粗度は0.55nm以下とすることができる。
前記バリア層のストレスは、−0.19E+8dyne/cm2とすることができる。
前記バリア層は、スパッタリング方法により形成し、電力密度が1.5〜3W/cm2、非活性気体の圧力が0.2〜0.3Paで形成することができる。
前記バリア層は、チタニウム、タンタル、又はモリブデンのうちのいずれか一つで形成することができる。
前記バリア層の表面粗度(Rms)は、0.55nm以下に形成することができる。
前記オーミックコンタクト部材、前記半導体、前記データ線、及び前記ドレイン電極を形成する段階は、一つの感光膜パターンにより形成することができる。
前記非晶質バリア層の表面粗度は、0.55nm以下とすることができる。
前記非晶質バリア層のストレスは、−0.19E+8dyne/cm2とすることができる。
前記非晶質バリア層は、200Å以下の厚さとすることができる。
前記非晶質バリア層は、チタニウム、タンタル、又はモリブデンのうちのいずれか一つで形成することができる。
110 絶縁基板
121 ゲート線
124 ゲート電極
140 ゲート絶縁膜
150 第1非晶質シリコン膜
154 線状半導体の突出部
160 第2非晶質シリコン膜
163 線状オーミックコンタクト部材の突出部
164 非晶質シリコンパターン
165 島型オーミックコンタクト部材
171 データ線
173 ソース電極
173a ソース電極の下部膜
173b ソース電極の上部膜
174a 第1金属パターン
174b 第2金属パターン
175 ドレイン電極
175a ドレイン電極の下部膜
175b ドレイン電極の上部膜
180 保護膜
185 コンタクトホール
191 画素電極
Claims (19)
- 基板上にスパッタリング方法により薄膜を形成する方法であって、
前記薄膜は、電力密度が1.5〜3W/cm2、非活性気体の圧力が0.2〜0.3Paで形成することを特徴とする薄膜形成方法。 - 前記薄膜は非晶質構造を有することを特徴とする請求項1に記載の薄膜形成方法。
- 前記薄膜は、チタニウム、タンタル、又はモリブデンのうちのいずれか一つで形成することを特徴とする請求項1に記載の薄膜形成方法。
- 前記薄膜の表面粗度(Rms)は、0.55nm以下に形成することを特徴とする請求項2に記載の薄膜形成方法。
- 前記非活性気体はアルゴン又はヘリウムであることを特徴とする請求項2に記載の薄膜形成方法。
- 基板の上に形成されるケイ素層と、
前記基板又は前記ケイ素層の上に形成されるバリア層と、
前記バリア層の上に形成される銅配線と、を有し、
前記バリア層は非晶質構造からなり、
前記バリア層は、チタニウム、タンタル、又はモリブデンのうちのいずれか一つで形成されることを特徴とする表示板用金属配線。 - 前記基板はガラス基板であることを特徴とする請求項6に記載の表示板用金属配線。
- 前記バリア層の表面粗度は0.55nm以下であることを特徴とする請求項6に記載の表示板用金属配線。
- 前記バリア層のストレスは−0.19E+8dyne/cm2であることを特徴とする請求項6に記載の表示板用金属配線。
- 絶縁基板の上にゲート電極を形成する段階と、
前記ゲート電極の上にゲート絶縁膜を形成する段階と、
前記ゲート絶縁膜の上に半導体を形成する段階と、
前記半導体の上にオーミックコンタクト層を形成する段階と、
前記オーミックコンタクト層の上に非晶質バリア層と該非晶質バリア層の上に形成される銅層とを含むデータ線及びドレイン電極を形成する段階と、
前記データ線及びドレイン電極の上に保護膜を形成する段階と、
前記保護膜の上に前記ドレイン電極と接続する画素電極を形成する段階と、を有することを特徴とする薄膜トランジスタ表示板の製造方法。 - 前記バリア層は、スパッタリング方法により形成し、電力密度が1.5〜3W/cm2、非活性気体の圧力が0.2〜0.3Paで形成することを特徴とする請求項10に記載の薄膜トランジスタ表示板の製造方法。
- 前記バリア層は、チタニウム、タンタル、又はモリブデンのうちのいずれか一つで形成することを特徴とする請求項10に記載の薄膜トランジスタ表示板の製造方法。
- 前記バリア層の表面粗度(Rms)は、0.55nm以下に形成することを特徴とする請求項10に記載の薄膜トランジスタ表示板の製造方法。
- 前記オーミックコンタクト部材、前記半導体、前記データ線、及び前記ドレイン電極を形成する段階は、一つの感光膜パターンにより形成することを特徴とする請求項10に記載の薄膜トランジスタ表示板の製造方法。
- 基板の上に形成されるゲート線と、
前記ゲート線と交差するデータ線と、
前記ゲート線及びデータ線と接続される薄膜トランジスタと、
前記薄膜トランジスタと接続される画素電極と、を有し、
前記データ線及び前記薄膜トランジスタのドレイン電極は、非晶質バリア層及び銅層を含むことを特徴とする薄膜トランジスタ表示板。 - 前記非晶質バリア層の表面粗度は0.55nm以下であることを特徴とする請求項15に記載の薄膜トランジスタ表示板。
- 前記非晶質バリア層のストレスは−0.19E+8dyne/cm2であることを特徴とする請求項15に記載の薄膜トランジスタ表示板。
- 前記非晶質バリア層は200Å以下の厚さであることを特徴とする請求項17に記載の薄膜トランジスタ表示板。
- 前記非晶質バリア層は、チタニウム、タンタル、又はモリブデンのうちのいずれか一つで形成されることを特徴とする請求項15に記載の薄膜トランジスタ表示板。
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US9799678B2 (en) | 2017-10-24 |
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US20150129885A1 (en) | 2015-05-14 |
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