JP2011151070A - ウエーハの加工方法 - Google Patents

ウエーハの加工方法 Download PDF

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Publication number
JP2011151070A
JP2011151070A JP2010009176A JP2010009176A JP2011151070A JP 2011151070 A JP2011151070 A JP 2011151070A JP 2010009176 A JP2010009176 A JP 2010009176A JP 2010009176 A JP2010009176 A JP 2010009176A JP 2011151070 A JP2011151070 A JP 2011151070A
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JP
Japan
Prior art keywords
wafer
street
deteriorated layer
grinding
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010009176A
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English (en)
Japanese (ja)
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JP2011151070A5 (https=
Inventor
Masaru Nakamura
勝 中村
Yasukichi Yuhira
泰吉 湯平
Hideki Koshimizu
秀輝 小清水
Hajime Takeshita
元 竹下
Takuya Mihara
拓也 三原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2010009176A priority Critical patent/JP2011151070A/ja
Priority to CN2011100035026A priority patent/CN102152413A/zh
Publication of JP2011151070A publication Critical patent/JP2011151070A/ja
Publication of JP2011151070A5 publication Critical patent/JP2011151070A5/ja
Pending legal-status Critical Current

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  • Dicing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2010009176A 2010-01-19 2010-01-19 ウエーハの加工方法 Pending JP2011151070A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010009176A JP2011151070A (ja) 2010-01-19 2010-01-19 ウエーハの加工方法
CN2011100035026A CN102152413A (zh) 2010-01-19 2011-01-10 晶片的加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010009176A JP2011151070A (ja) 2010-01-19 2010-01-19 ウエーハの加工方法

Publications (2)

Publication Number Publication Date
JP2011151070A true JP2011151070A (ja) 2011-08-04
JP2011151070A5 JP2011151070A5 (https=) 2013-01-31

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ID=44434239

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010009176A Pending JP2011151070A (ja) 2010-01-19 2010-01-19 ウエーハの加工方法

Country Status (2)

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JP (1) JP2011151070A (https=)
CN (1) CN102152413A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077694A (ja) * 2011-09-30 2013-04-25 Disco Abrasive Syst Ltd ウエーハの加工方法
KR20190103942A (ko) * 2018-02-28 2019-09-05 가부시기가이샤 디스코 피가공물의 가공 방법
KR20200007957A (ko) * 2017-05-18 2020-01-22 가부시기가이샤 디스코 웨이퍼를 프로세싱하는데 사용하기 위한 보호 시팅, 웨이퍼에 대한 핸들링 시스템, 및 웨이퍼 및 보호 시팅의 조합체
TWI713734B (zh) * 2016-06-02 2020-12-21 日商迪思科股份有限公司 漏光檢測方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014063813A (ja) * 2012-09-20 2014-04-10 Disco Abrasive Syst Ltd 加工方法
JP6300763B2 (ja) * 2015-08-03 2018-03-28 株式会社ディスコ 被加工物の加工方法
CN114823409B (zh) * 2021-01-27 2026-04-10 东莞新科技术研究开发有限公司 一种芯片切割刀片

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005086161A (ja) * 2003-09-11 2005-03-31 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2009170694A (ja) * 2008-01-17 2009-07-30 Disco Abrasive Syst Ltd 厚み計測装置及び該厚み計測装置を備えた研削装置
JP2009176848A (ja) * 2008-01-23 2009-08-06 Disco Abrasive Syst Ltd ウエーハの研削方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4986568B2 (ja) * 2006-10-11 2012-07-25 株式会社ディスコ ウエーハの研削加工方法
JP5048379B2 (ja) * 2007-04-05 2012-10-17 株式会社ディスコ ウェーハの加工方法
JP2009094326A (ja) * 2007-10-10 2009-04-30 Disco Abrasive Syst Ltd ウェーハの研削方法
JP2009123835A (ja) * 2007-11-13 2009-06-04 Disco Abrasive Syst Ltd 半導体デバイスの製造方法
JP5155030B2 (ja) * 2008-06-13 2013-02-27 株式会社ディスコ 光デバイスウエーハの分割方法
JP2010016147A (ja) * 2008-07-03 2010-01-21 Disco Abrasive Syst Ltd 粘着テープの貼着方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005086161A (ja) * 2003-09-11 2005-03-31 Disco Abrasive Syst Ltd ウエーハの加工方法
JP2009170694A (ja) * 2008-01-17 2009-07-30 Disco Abrasive Syst Ltd 厚み計測装置及び該厚み計測装置を備えた研削装置
JP2009176848A (ja) * 2008-01-23 2009-08-06 Disco Abrasive Syst Ltd ウエーハの研削方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077694A (ja) * 2011-09-30 2013-04-25 Disco Abrasive Syst Ltd ウエーハの加工方法
TWI713734B (zh) * 2016-06-02 2020-12-21 日商迪思科股份有限公司 漏光檢測方法
KR20200007957A (ko) * 2017-05-18 2020-01-22 가부시기가이샤 디스코 웨이퍼를 프로세싱하는데 사용하기 위한 보호 시팅, 웨이퍼에 대한 핸들링 시스템, 및 웨이퍼 및 보호 시팅의 조합체
KR102345923B1 (ko) 2017-05-18 2022-01-03 가부시기가이샤 디스코 웨이퍼를 프로세싱하는데 사용하기 위한 보호 시팅, 웨이퍼에 대한 핸들링 시스템, 및 웨이퍼 및 보호 시팅의 조합체
US11676833B2 (en) 2017-05-18 2023-06-13 Disco Corporation Protective sheet for use in processing wafer, handling system for wafer, and combination of wafer and protective sheeting
KR20190103942A (ko) * 2018-02-28 2019-09-05 가부시기가이샤 디스코 피가공물의 가공 방법
KR102586315B1 (ko) 2018-02-28 2023-10-06 가부시기가이샤 디스코 피가공물의 가공 방법

Also Published As

Publication number Publication date
CN102152413A (zh) 2011-08-17

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