CN102152413A - 晶片的加工方法 - Google Patents

晶片的加工方法 Download PDF

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Publication number
CN102152413A
CN102152413A CN2011100035026A CN201110003502A CN102152413A CN 102152413 A CN102152413 A CN 102152413A CN 2011100035026 A CN2011100035026 A CN 2011100035026A CN 201110003502 A CN201110003502 A CN 201110003502A CN 102152413 A CN102152413 A CN 102152413A
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CN
China
Prior art keywords
wafer
grinding
layer
semiconductor wafer
along
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Pending
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CN2011100035026A
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English (en)
Chinese (zh)
Inventor
中村胜
汤平泰吉
小清水秀辉
竹下元
三原拓也
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Disco Corp
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Disco Corp
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Publication of CN102152413A publication Critical patent/CN102152413A/zh
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  • Mechanical Treatment Of Semiconductor (AREA)
CN2011100035026A 2010-01-19 2011-01-10 晶片的加工方法 Pending CN102152413A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-009176 2010-01-19
JP2010009176A JP2011151070A (ja) 2010-01-19 2010-01-19 ウエーハの加工方法

Publications (1)

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CN102152413A true CN102152413A (zh) 2011-08-17

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CN2011100035026A Pending CN102152413A (zh) 2010-01-19 2011-01-10 晶片的加工方法

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JP (1) JP2011151070A (https=)
CN (1) CN102152413A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103681491A (zh) * 2012-09-20 2014-03-26 株式会社迪思科 加工方法
CN106409762A (zh) * 2015-08-03 2017-02-15 株式会社迪思科 被加工物的加工方法
CN114823409A (zh) * 2021-01-27 2022-07-29 东莞新科技术研究开发有限公司 一种芯片切割刀片

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5930645B2 (ja) * 2011-09-30 2016-06-08 株式会社ディスコ ウエーハの加工方法
JP6721420B2 (ja) * 2016-06-02 2020-07-15 株式会社ディスコ 漏れ光検出方法
KR102345923B1 (ko) * 2017-05-18 2022-01-03 가부시기가이샤 디스코 웨이퍼를 프로세싱하는데 사용하기 위한 보호 시팅, 웨이퍼에 대한 핸들링 시스템, 및 웨이퍼 및 보호 시팅의 조합체
JP7075242B2 (ja) * 2018-02-28 2022-05-25 株式会社ディスコ 被加工物の加工方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101161411A (zh) * 2006-10-11 2008-04-16 株式会社迪思科 晶片的磨削加工方法
CN101281861A (zh) * 2007-04-05 2008-10-08 株式会社迪思科 晶片的加工方法
CN101407035A (zh) * 2007-10-10 2009-04-15 株式会社迪思科 晶片的磨削方法
CN101436526A (zh) * 2007-11-13 2009-05-20 株式会社迪思科 半导体器件的制造方法
CN101491880A (zh) * 2008-01-23 2009-07-29 株式会社迪思科 晶片磨削方法
JP2009170694A (ja) * 2008-01-17 2009-07-30 Disco Abrasive Syst Ltd 厚み計測装置及び該厚み計測装置を備えた研削装置
CN101604659A (zh) * 2008-06-13 2009-12-16 株式会社迪思科 光器件晶片的分割方法
CN101620986A (zh) * 2008-07-03 2010-01-06 株式会社迪思科 粘接带的粘贴方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4398686B2 (ja) * 2003-09-11 2010-01-13 株式会社ディスコ ウエーハの加工方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101161411A (zh) * 2006-10-11 2008-04-16 株式会社迪思科 晶片的磨削加工方法
CN101281861A (zh) * 2007-04-05 2008-10-08 株式会社迪思科 晶片的加工方法
CN101407035A (zh) * 2007-10-10 2009-04-15 株式会社迪思科 晶片的磨削方法
CN101436526A (zh) * 2007-11-13 2009-05-20 株式会社迪思科 半导体器件的制造方法
JP2009170694A (ja) * 2008-01-17 2009-07-30 Disco Abrasive Syst Ltd 厚み計測装置及び該厚み計測装置を備えた研削装置
CN101491880A (zh) * 2008-01-23 2009-07-29 株式会社迪思科 晶片磨削方法
CN101604659A (zh) * 2008-06-13 2009-12-16 株式会社迪思科 光器件晶片的分割方法
CN101620986A (zh) * 2008-07-03 2010-01-06 株式会社迪思科 粘接带的粘贴方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103681491A (zh) * 2012-09-20 2014-03-26 株式会社迪思科 加工方法
CN106409762A (zh) * 2015-08-03 2017-02-15 株式会社迪思科 被加工物的加工方法
CN106409762B (zh) * 2015-08-03 2021-08-17 株式会社迪思科 被加工物的加工方法
CN114823409A (zh) * 2021-01-27 2022-07-29 东莞新科技术研究开发有限公司 一种芯片切割刀片
CN114823409B (zh) * 2021-01-27 2026-04-10 东莞新科技术研究开发有限公司 一种芯片切割刀片

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Application publication date: 20110817