JP2011124602A - 表面実装可能な光結合素子パッケージ - Google Patents
表面実装可能な光結合素子パッケージ Download PDFInfo
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- 230000003287 optical effect Effects 0.000 title claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 116
- 229910000679 solder Inorganic materials 0.000 claims description 65
- 230000008878 coupling Effects 0.000 claims description 47
- 238000010168 coupling process Methods 0.000 claims description 47
- 238000005859 coupling reaction Methods 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 34
- 239000002243 precursor Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 23
- 230000008569 process Effects 0.000 description 14
- 238000000465 moulding Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- LNUFLCYMSVYYNW-ZPJMAFJPSA-N [(2r,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6r)-6-[(2r,3r,4s,5r,6r)-6-[(2r,3r,4s,5r,6r)-6-[[(3s,5s,8r,9s,10s,13r,14s,17r)-10,13-dimethyl-17-[(2r)-6-methylheptan-2-yl]-2,3,4,5,6,7,8,9,11,12,14,15,16,17-tetradecahydro-1h-cyclopenta[a]phenanthren-3-yl]oxy]-4,5-disulfo Chemical compound O([C@@H]1[C@@H](COS(O)(=O)=O)O[C@@H]([C@@H]([C@H]1OS(O)(=O)=O)OS(O)(=O)=O)O[C@@H]1[C@@H](COS(O)(=O)=O)O[C@@H]([C@@H]([C@H]1OS(O)(=O)=O)OS(O)(=O)=O)O[C@@H]1[C@@H](COS(O)(=O)=O)O[C@H]([C@@H]([C@H]1OS(O)(=O)=O)OS(O)(=O)=O)O[C@@H]1C[C@@H]2CC[C@H]3[C@@H]4CC[C@@H]([C@]4(CC[C@@H]3[C@@]2(C)CC1)C)[C@H](C)CCCC(C)C)[C@H]1O[C@H](COS(O)(=O)=O)[C@@H](OS(O)(=O)=O)[C@H](OS(O)(=O)=O)[C@H]1OS(O)(=O)=O LNUFLCYMSVYYNW-ZPJMAFJPSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 230000001351 cycling effect Effects 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- YSUIQYOGTINQIN-UZFYAQMZSA-N 2-amino-9-[(1S,6R,8R,9S,10R,15R,17R,18R)-8-(6-aminopurin-9-yl)-9,18-difluoro-3,12-dihydroxy-3,12-bis(sulfanylidene)-2,4,7,11,13,16-hexaoxa-3lambda5,12lambda5-diphosphatricyclo[13.2.1.06,10]octadecan-17-yl]-1H-purin-6-one Chemical compound NC1=NC2=C(N=CN2[C@@H]2O[C@@H]3COP(S)(=O)O[C@@H]4[C@@H](COP(S)(=O)O[C@@H]2[C@@H]3F)O[C@H]([C@H]4F)N2C=NC3=C2N=CN=C3N)C(=O)N1 YSUIQYOGTINQIN-UZFYAQMZSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
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Abstract
【解決手段】光結合素子パッケージ30は、キャリア基板32と、キャリア基板上の複数の導電領域46から成り、光結合デバイス38、40、光透過性媒体48、および複数の導電構造34をキャリア基板上に配置する。
【選択図】図2
Description
Claims (18)
- a)第1面、第2面および前記第1面に配置された複数の導電領域を含んだキャリア基板と、
b)前記キャリア基板の前記第1面上の光エミッタデバイスと、
c)前記キャリア基板の前記第1面上の光受信デバイスと、
d)前記キャリア基板の前記第1面上において、前記光エミッタデバイスと前記光受信デバイスの周りに配置され、そのキャリア基板の前記第1面上に高さを有するダム構造と、
e)前記ダム構造の内側であって、前記光エミッタデバイスと前記光受信デバイス間に配置され、前記キャリア基板の前記第1面上に高さがあるドーム形状を有する光透過性媒体と、
f)前記キャリア基板の前記第1面の前記導電領域のうちの少なくともその一部の導電領域上に形成され、前記キャリア基板の前記第1面上に高さを有する複数の半田ボールを有し、この複数の半田ボールと前記光透過性媒体間に配置される前記ダム構造であって、
前記光透過性媒体の高さは、前記半田ボールの高さを越えず、かつ、前記ダム構造の高さよりも高い、
光結合素子パッケージ。 - 前記ダム構造は前記光透過性媒体の前躯体を閉じ込め、この前躯体は複数の前記半田ボールが配置される前記導電領域には達しない、請求項1に記載の光結合素子パッケージ。
- 複数の前記半田ボールにおけるその各々の半田ボール寸法は、前記光エミッタデバイスおよび前記光受信デバイスの厚さよりも大きいことを特徴とする、請求項1に記載の光結合素子パッケージ。
- さらに、前記光透過性媒体上に反射性コーティングを施していることを特徴とする、請求項1に記載の光結合素子パッケージ。
- 前記キャリア基板上において、前記光エミッタデバイスを複数の導電領域のうちの1つに連結する第1ワイヤと、前記光受信デバイスを導電領域のうちの1つに連結する第2ワイヤをさらに備えていることを特徴とする、請求項1に記載の光結合素子パッケージ。
- a)第1面、第2面および前記第1面に配置された複数の導電領域を含んだキャリア基板と、
b)前記キャリア基板の前記第1面上の光エミッタデバイスと、
c)前記光エミッタデバイスを複数の導電領域のうちの少なくともその1つに連結する第1ワイヤと、
d)前記光エミッタデバイスからの放射線を受け取るようにされた、前記キャリア基板の前記第1面上の光受信デバイスと、
e)前記光受信デバイスを導電領域のうちの少なくともその1つに連結する第2ワイヤと、
f)前記キャリア基板の前記第1面上において、前記光エミッタデバイスと前記光受信デバイスの周りに配置され、そのキャリア基板の前記第1面上に高さを有するダム構造と、
g)前記ダム構造の内側であって、前記光エミッタデバイスおよび前記光受信デバイス上や、これらの間に光透過性媒体が配置され、前記キャリア基板の前記第1面上に高さを有するドーム形状を有する前記光透過性媒体と、
h)前記キャリア基板の前記第1面に、そして、複数の導電領域のうちの少なくともその一部の導電領域上に形成された複数の半田ボールとによって構成され、この半田ボールの各々が前記光受信デバイスおよび前記光エミッタデバイスの厚さよりも大きな寸法を有し、前記半田ボールは、前記キャリア基板の前記第1面上に高さを有し、前記ダム構造は、この複数の半田ボールと前記光透過性媒体間に配置され、
前記光透過性媒体の高さは、前記半田ボールの高さを越えず、かつ、前記ダム構造の高さよりも高い、
光結合素子パッケージ。 - 光透過性媒体はシリコンからなることを特徴とする、請求項6に記載の光結合素子パッケージ。
- 複数の半田ボールが、光エミッタデバイス、光受信デバイス、および光透過性媒体の周りに配置されることを特徴とする、請求項6に記載の光結合素子パッケージ。
- キャリア基板はセラミック材料からなることを特徴とする、請求項6に記載の光結合素子パッケージ。
- a)第1の複数導電領域から成る回路基板と、
b)(i)第1面および第2面を有するキャリア基板、
(ii)前記キャリア基板の前記第1面上の第2の複数導電領域、
(iii)前記キャリア基板の前記第1面上の光受信デバイス、
(iv)前記キャリア基板の前記第1面上の光エミッタデバイス、
(v)前記キャリア基板の前記第1面上において、前記光エミッタデバイスと前記光受信デバイスの周りに配置され、そのキャリア基板の前記第1面上に高さを有するダム構造、
(vi)前記ダム構造の内側であって、前記光エミッタデバイスと前記光受信デバイス間に配置され、前記キャリア基板の前記第1面上に高さがあるドーム形状を有する光透過性媒体、
(vii)前記キャリア基板の前記第1面に前記第2複数導電領域のうちの少なくともその一部の導電領域上に形成された複数の半田ボールであって、
前記光透過性媒体の高さは、前記半田ボールの高さを越えず、かつ、前記ダム構造よりも高い高さを有する光結合素子パッケージであって、
この光結合素子パッケージは、前記回路基板と前記キャリア基板間に配置された前記光エミッタデバイスおよび前記光受信デバイスと共に前記回路基板にマウントがなされる、
光結合装置。 - 光透過性媒体と回路基板間にはギャップ(すき間)があることを特徴とする、請求項10に記載の光結合装置。
- a)第1面の反対面に第2面を有し、キャリア基板の前記第1面上に配置された高さを有するダム構造および前記第1面上に複数の導電領域を有するキャリア基板の前記第1面上に光エミッタデバイスをマウントし、
b)前記キャリア基板の前記第1面上に光受信デバイスをマウントし、前記ダム構造は前記光エミッタデバイスと前記光受信デバイスの周りに配置され、
c)前記ダム構造の内側であって、前記光エミッタデバイスおよび光受信デバイス上に光透過性媒体を形成し、その光透過性媒体は前記キャリア基板の前記第1面上に高さがあるドーム形状を有し、そして
d)前記キャリア基板の前記第1面に導電領域のうちの少なくともその一部の導電領域上に複数の半田ボール若しくは導電性カラムを形成し、複数の前記半田ボール若しくは前記導電性カラムは前記キャリア基板の前記第1面上に高さを有し、
前記ダム構造は、この複数の半田ボール若しくは導電性カラムと前記光透過性媒体間に配置され、
前記光透過性媒体の高さは、前記半田ボール若しくは前記導電性カラムの高さを越えず、かつ、前記ダム構造の高さよりも高い、
光結合素子パッケージを形成する方法。 - 複数の半田ボールの形成は、前記キャリア基板の前記第1面上の導電領域のうちの少なくともその一部の導電領域上に複数の半田デポジットを堆積させ、その半田デポジットをリフローすることから成ることを特徴とする、請求項12に記載の方法。
- ステップd)はステップc)の後に実行されることを特徴とする、請求項12に記載の方法。
- a)請求項12の方法に従って光結合素子パッケージを形成し、
b)該光結合素子パッケージを回路基板にマウントする
ことから成る、光結合装置を形成する方法。 - a)第1面、第2面および前記第1面に配置された複数の導電領域を含んだキャリア基板と、
b)前記キャリア基板の前記第1面上の光エミッタデバイスと、
c)前記キャリア基板の前記第1面上の光受信デバイスと、
d)前記キャリア基板の前記第1面上において、前記光エミッタデバイスと前記光受信デバイスの周りに配置され、そのキャリア基板の前記第1面に高さを有するダム構造と、
e)前記ダム構造の内側であって、前記光エミッタデバイスと前記光受信デバイス間に配置される光透過性媒体と、
f)前記キャリア基板の前記第1面に導電領域のうちの少なくともその一部の導電領域上の複数の導電性カラムによって構成され、前記キャリア基板の前記第1面上に高さがあるドーム形状を有する前記光透過性媒体と、
前記光透過性媒体の高さは、前記半田ボールの高さを越えず、かつ、前記ダム構造の高さよりも高く、そして、
回路基板に対向する複数の導電性カラムによって構成される回路構造にマウント可能である、
表面実装可能な光結合素子パッケージ。 - 前記回路構造はプリント回路基板であることを特徴とする、請求項16に記載の表面実装可能な光結合素子パッケージ。
- 複数の導電性カラムのその各々の高さは、前記光エミッタデバイスおよび前記光受信デバイスよりも高いことを特徴とする、請求項16に記載の表面実装可能な光結合素子パッケージ。
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US09/944,717 | 2001-08-31 | ||
US09/944,717 US6633030B2 (en) | 2001-08-31 | 2001-08-31 | Surface mountable optocoupler package |
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JP (2) | JP2005502205A (ja) |
CN (1) | CN100364114C (ja) |
DE (1) | DE10297164T5 (ja) |
TW (1) | TW560045B (ja) |
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CN100364114C (zh) | 2008-01-23 |
CN1550044A (zh) | 2004-11-24 |
DE10297164T5 (de) | 2004-10-14 |
TW560045B (en) | 2003-11-01 |
WO2003021686A1 (en) | 2003-03-13 |
US6633030B2 (en) | 2003-10-14 |
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US20030042403A1 (en) | 2003-03-06 |
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